LFXP2-8E-6M132C

The LFXP2-8E-6M132C is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation designed for compact, low-voltage digital logic integration. It provides approximately 8,000 logic elements, embedded memory, and 86 user I/O in a 132-ball LFBGA/CSPBGA package, making it suitable for commercial embedded designs and space-constrained applications requiring flexible programmable logic.

Key Features

• Core Logic  Approximately 8,000 logic elements for implementing custom logic, glue logic, and protocol bridging in a small-footprint FPGA.
• Embedded Memory  Approximately 0.226 Mbits of on-chip RAM (226,304 total bits) to support buffering, FIFOs, and local data storage.
• I/O Capabilities  86 user I/O pins to interface with peripherals, sensors, and external buses in compact systems.
• Power Supply  Low-voltage operation with a supply range of 1.14 V to 1.26 V to support power-efficient designs.
• Package & Mounting  132-LFBGA (CSPBGA) surface-mount package, supplier device package 132-CSBGA (8×8), sized for board-level space optimization.
• Operating Conditions  Commercial temperature range from 0 °C to 85 °C and commercial grade designation for use in general-purpose electronic products.
• Environmental Compliance  RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Consumer Electronics  Implement display controllers, user-interface logic, or peripheral management in compact consumer devices.
• Prototyping & Development  Rapidly validate custom logic and system integration using on-chip programmable resources and memory.
• Communications & Connectivity  Bridge interfaces and handle protocol adaptation where moderate logic density and multiple I/O are required.
• Embedded Control Systems  Control and glue logic for embedded products operating within commercial temperature environments.

Unique Advantages

• Balanced Logic Density: Approximately 8,000 logic elements provide a mid-range capacity for implementing complex logic without excessive die size.
• On-Chip Memory: Approximately 0.226 Mbits of embedded RAM reduces external memory needs for buffering and small data structures.
• Compact, Board-Friendly Package: The 132-LFBGA/CSPBGA surface-mount package enables compact PCB layouts and high-density designs.
• Low-Voltage Operation: 1.14 V–1.26 V supply range supports low-power system designs and modern power-rail architectures.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C to match typical commercial product environments.
• RoHS Compliance: Environmentally compliant for markets requiring lead-free components.

Why Choose LFXP2-8E-6M132C?

The LFXP2-8E-6M132C delivers a practical combination of programmable logic, embedded memory, and I/O count in a compact 132-ball BGA package, positioned for commercial embedded applications that need mid-range logic capacity and low-voltage operation. Its specification set is well-suited to designers looking to integrate custom logic, interface bridging, and local data buffering without large board area or high power requirements.

As a Lattice Semiconductor Corporation FPGA with RoHS compliance and a commercial temperature range, this device is appropriate for production designs and development work in controlled commercial environments where predictable performance and compact packaging are priorities.

Request a quote for LFXP2-8E-6M132C or submit a procurement inquiry to obtain pricing and availability information.