LFXP2-8E-6QN208C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 146 226304 8000 208-BFQFP |
|---|---|
| Quantity | 1,649 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 146 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFXP2-8E-6QN208C – XP2 Field Programmable Gate Array (FPGA), 8,000 logic elements, 146 I/O, 208-BFQFP
The LFXP2-8E-6QN208C is a commercial-grade FPGA in the LatticeXP2 family, combining a reconfigurable FPGA fabric with family-level flexiFLASH architecture. It provides 8,000 logic elements, approximately 226,304 bits of on-chip RAM and up to 146 user I/O in a 208-pin PQFP (28 × 28 mm) package for compact, board-level integration.
This device is suited for embedded and system-level designs that require low-voltage operation (1.14 V to 1.26 V), moderate logic density, and flexible I/O in a surface-mount package across a commercial operating range of 0 °C to 85 °C.
Key Features
- Core Fabric 8,000 logic elements providing LUT-based programmable logic for control, glue logic, and mid-density integration.
- Embedded Memory Approximately 226,304 bits of on-chip RAM for FIFOs, buffers and small data storage needs.
- DSP and Arithmetic Support (Family Feature) LatticeXP2 family includes sysDSP blocks for high-performance multiply–accumulate operations; family architecture supports multiple multiplier configurations for signal processing tasks.
- Flexible I/O 146 user I/O pins in the 208-BFQFP package, with family-level support for wide I/O standards and source-synchronous interfaces to simplify board-level interfaces.
- Power and Operating Range Low-voltage operation from 1.14 V to 1.26 V and commercial temperature range of 0 °C to 85 °C to match common embedded system requirements.
- Package & Mounting 208-pin PQFP (28 × 28 mm) package, surface-mount mounting type for standard PCB assembly processes.
- Design Security & Live Update (Family Feature) Family-level flexiFLASH and Live Update technologies provide instant-on, reconfigurability and secure update options for field-upgradeable designs.
- RoHS Compliant Device meets RoHS requirements for materials compliance.
Typical Applications
- Embedded Control — Implement application-specific control logic, peripheral bridging and glue logic in compact embedded systems using the 8,000 logic-element fabric.
- Signal Processing — Use on-chip RAM and family-level sysDSP capabilities for DSP tasks such as filtering, data aggregation and lightweight compute acceleration.
- Display and Interface Bridging — Support source-synchronous interfaces and flexible I/O for display drivers, LVDS lanes or parallel interfaces in consumer and industrial products.
- Field-Upgradable Devices — Leverage family-level flexiFLASH and Live Update features for secure, reconfigurable systems that require in-field updates.
Unique Advantages
- Balanced Logic Density: 8,000 logic elements provide a mid-range capacity ideal for consolidating glue logic and moderate FPGA tasks without excessive BOM cost.
- Embedded Memory On-Board: Approximately 226,304 bits of on-chip RAM reduce the need for external memory for small buffers and control data.
- Compact, Surface-Mount Package: 208-pin PQFP in a 28 × 28 mm footprint enables high I/O count in a commercially proven package suitable for standard assembly.
- Low-Voltage Operation: 1.14 V to 1.26 V supply range supports modern low-power system rails and simplifies power-supply design.
- Family-Level Reconfigurability and Security: LatticeXP2 family features such as flexiFLASH and Live Update provide instant-on behavior and secure update capability for maintainable products.
- Regulatory Compliance: RoHS compliance supports designs targeting global markets with material restrictions.
Why Choose LFXP2-8E-6QN208C?
The LFXP2-8E-6QN208C offers a practical blend of logic capacity, embedded memory and a high I/O count in a compact PQFP package, making it a strong choice for designers who need a reconfigurable mid-density FPGA for embedded control, interface bridging and moderate signal-processing tasks. Its low-voltage operation and surface-mount packaging simplify board integration in a wide range of commercial applications.
Built on the LatticeXP2 family architecture, the device benefits from family-level features such as flash-based instant-on reconfigurability, live update capability and flexible I/O support—delivering a scalable, serviceable solution backed by an established FPGA ecosystem.
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