LFXP2-8E-6QN208C

IC FPGA 146 I/O 208QFP
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 146 226304 8000 208-BFQFP

Quantity 1,649 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O146Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1000Number of Logic Elements/Cells8000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits226304

Overview of LFXP2-8E-6QN208C – XP2 Field Programmable Gate Array (FPGA), 8,000 logic elements, 146 I/O, 208-BFQFP

The LFXP2-8E-6QN208C is a commercial-grade FPGA in the LatticeXP2 family, combining a reconfigurable FPGA fabric with family-level flexiFLASH architecture. It provides 8,000 logic elements, approximately 226,304 bits of on-chip RAM and up to 146 user I/O in a 208-pin PQFP (28 × 28 mm) package for compact, board-level integration.

This device is suited for embedded and system-level designs that require low-voltage operation (1.14 V to 1.26 V), moderate logic density, and flexible I/O in a surface-mount package across a commercial operating range of 0 °C to 85 °C.

Key Features

  • Core Fabric 8,000 logic elements providing LUT-based programmable logic for control, glue logic, and mid-density integration.
  • Embedded Memory Approximately 226,304 bits of on-chip RAM for FIFOs, buffers and small data storage needs.
  • DSP and Arithmetic Support (Family Feature) LatticeXP2 family includes sysDSP blocks for high-performance multiply–accumulate operations; family architecture supports multiple multiplier configurations for signal processing tasks.
  • Flexible I/O 146 user I/O pins in the 208-BFQFP package, with family-level support for wide I/O standards and source-synchronous interfaces to simplify board-level interfaces.
  • Power and Operating Range Low-voltage operation from 1.14 V to 1.26 V and commercial temperature range of 0 °C to 85 °C to match common embedded system requirements.
  • Package & Mounting 208-pin PQFP (28 × 28 mm) package, surface-mount mounting type for standard PCB assembly processes.
  • Design Security & Live Update (Family Feature) Family-level flexiFLASH and Live Update technologies provide instant-on, reconfigurability and secure update options for field-upgradeable designs.
  • RoHS Compliant Device meets RoHS requirements for materials compliance.

Typical Applications

  • Embedded Control — Implement application-specific control logic, peripheral bridging and glue logic in compact embedded systems using the 8,000 logic-element fabric.
  • Signal Processing — Use on-chip RAM and family-level sysDSP capabilities for DSP tasks such as filtering, data aggregation and lightweight compute acceleration.
  • Display and Interface Bridging — Support source-synchronous interfaces and flexible I/O for display drivers, LVDS lanes or parallel interfaces in consumer and industrial products.
  • Field-Upgradable Devices — Leverage family-level flexiFLASH and Live Update features for secure, reconfigurable systems that require in-field updates.

Unique Advantages

  • Balanced Logic Density: 8,000 logic elements provide a mid-range capacity ideal for consolidating glue logic and moderate FPGA tasks without excessive BOM cost.
  • Embedded Memory On-Board: Approximately 226,304 bits of on-chip RAM reduce the need for external memory for small buffers and control data.
  • Compact, Surface-Mount Package: 208-pin PQFP in a 28 × 28 mm footprint enables high I/O count in a commercially proven package suitable for standard assembly.
  • Low-Voltage Operation: 1.14 V to 1.26 V supply range supports modern low-power system rails and simplifies power-supply design.
  • Family-Level Reconfigurability and Security: LatticeXP2 family features such as flexiFLASH and Live Update provide instant-on behavior and secure update capability for maintainable products.
  • Regulatory Compliance: RoHS compliance supports designs targeting global markets with material restrictions.

Why Choose LFXP2-8E-6QN208C?

The LFXP2-8E-6QN208C offers a practical blend of logic capacity, embedded memory and a high I/O count in a compact PQFP package, making it a strong choice for designers who need a reconfigurable mid-density FPGA for embedded control, interface bridging and moderate signal-processing tasks. Its low-voltage operation and surface-mount packaging simplify board integration in a wide range of commercial applications.

Built on the LatticeXP2 family architecture, the device benefits from family-level features such as flash-based instant-on reconfigurability, live update capability and flexible I/O support—delivering a scalable, serviceable solution backed by an established FPGA ecosystem.

Request a quote or submit a product inquiry to receive pricing and availability information for LFXP2-8E-6QN208C.

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