LFXP2-8E-6M132I

The LFXP2-8E-6M132I is an industrial-grade FPGA from the LatticeXP2 family that combines flash-based configuration with a LUT-based FPGA fabric. Built on the LatticeXP2 flexiFLASH architecture, the device targets embedded and industrial designs that require instant-on reconfigurability, secure field updates, and a compact csBGA package.

With approximately 8,000 logic elements, roughly 0.22 Mbits of on-chip RAM, and 86 I/Os in a 132-ball csBGA (8 × 8 mm) package, this part is suited to space-constrained applications that need DSP capability, flexible I/O support and operation across an extended industrial temperature range.

Key Features

• Core Logic  Approximately 8,000 logic elements for implementing LUT-based FPGA designs.
• Embedded Memory  Approximately 0.22 Mbits of on-chip RAM (226,304 total bits) combining embedded and distributed memory.
• sysDSP and Multipliers  XP2 family sysDSP architecture with four sysDSP blocks and 16 18×18 multipliers for efficient multiply-accumulate operations.
• Flexible I/O  86 user I/Os in the 132-ball csBGA package; LatticeXP2 family supports a wide range of I/O standards including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS.
• Configuration & Security  flexiFLASH architecture enables instant-on and infinite reconfigurability with FlashBAK and Serial TAG memory; Live Update features include secure updates and TransFR technology with 128-bit AES encryption for secure field updates and dual-boot options.
• Clocking  sysCLOCK PLLs with up to four analog PLLs per device for clock multiply, divide and phase shifting.
• Memory Interfaces  Pre‑engineered source-synchronous interfaces are supported at the family level, including DDR / DDR2 interfaces up to 200 MHz and multi-lane LVDS links suitable for display applications.
• Power and Operating Range  Single supply operation across 1.14 V to 1.26 V and industrial operating temperature range of −40 °C to 100 °C.
• Package & Mounting  132-LFBGA (csBGA) 8 × 8 mm package, surface mount; supplier package listed as 132-CSBGA (8×8).
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Real-time logic, I/O aggregation and control functions that benefit from the device’s industrial temperature rating and compact csBGA footprint.
• Embedded Systems  Instant-on, reconfigurable logic and on-chip flash storage for embedded compute, protocol bridging and system glue logic.
• Communications & Networking  DSP blocks and flexible I/O standards support line-side processing, packet buffering and protocol adaptation in constrained form factors.
• Display and Video Interfaces  Source-synchronous interfaces and multi‑lane LVDS support display front-ends and high-speed data lanes in space-limited designs.

Unique Advantages

• Instant-on, reconfigurable architecture: flexiFLASH-based configuration delivers immediate startup and field reprogramming without external volatile configuration devices.
• Compact, production-ready package: 132-ball csBGA (8×8 mm) minimizes board area while providing 86 I/Os for dense system integration.
• Industrial temperature capability: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Integrated DSP and memory resources: sysDSP blocks, 18×18 multipliers and on-chip RAM simplify high-performance signal processing without large external memory.
• Secure field updates: Live Update features and 128-bit AES encryption enable controlled, secure firmware updates and dual-boot configurations.
• Flexible interfacing: Family-level support for a broad set of I/O standards and pre-engineered source-synchronous interfaces reduces integration effort.

Why Choose LFXP2-8E-6M132I?

The LFXP2-8E-6M132I positions itself as a compact, industrial-grade FPGA solution for designers who need instant-on reconfigurability, moderate logic density (≈8,000 logic elements), integrated DSP and a flexible I/O set in a small csBGA footprint. Its supply voltage range and extended temperature rating make it suitable for embedded and industrial applications where operational robustness matters.

Supported by the LatticeXP2 family feature set and design ecosystem, this device offers a balance of integration, security and configurability for projects that require on-chip memory, DSP capability and secure field update mechanisms while conserving board space.

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