LFXP2-8E-6FTN256I

The LFXP2-8E-6FTN256I is an XP2 Field Programmable Gate Array (FPGA) IC targeted for industrial embedded designs. It provides a mid-range programmable logic fabric with 8,000 logic elements and a high I/O count for systems that require flexible digital interfacing.

With industrial temperature grading and a compact 256-LBGA package, this device addresses designs requiring a balance of integration, on-chip memory, and dense I/O in a surface-mount form factor.

Key Features

• Core Logic  8,000 logic elements to implement custom digital functions and control logic for a variety of embedded tasks.
• Embedded Memory  Approximately 0.226 Mbits of on-chip RAM to support buffers, state machines, and small data structures without external memory.
• I/O Density  201 I/O pins to support multiple parallel interfaces, sensor inputs, and control signals in a single device.
• Power  Operates from a supply range of 1.14 V to 1.26 V for core power planning and thermal budgeting.
• Package and Mounting  256-LBGA package (supplier package 256-FTBGA, 17×17) designed for surface-mount assembly and compact board layouts.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Regulatory Compliance  RoHS compliant to support environmental and material requirements.

Typical Applications

• Industrial Control  Implement control logic, state machines, and interface glue in factory automation or machine control systems where industrial temperature capability is required.
• I/O-Intensive Interfaces  Aggregate and route numerous digital signals between peripherals and processors using the device’s 201 I/O pins.
• Embedded System Prototyping  Rapidly prototype custom logic and peripheral interfaces leveraging on-chip logic elements and embedded RAM.
• Sensor Data Aggregation  Buffer and preprocess sensor inputs locally using embedded memory and programmable logic before passing data to a host processor.

Unique Advantages

• Balanced Logic Capacity: 8,000 logic elements provide enough programmable resources for mid-range designs without unnecessary overhead.
• High I/O Count: 201 I/Os reduce the need for external multiplexing and simplify board-level signal routing.
• Compact BGA Package: 256-LBGA (256-FTBGA, 17×17) enables dense PCB designs while keeping the solution surface-mount friendly.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in harsh or temperature-variable environments.
• Low-Voltage Core: 1.14 V to 1.26 V supply range allows integration into modern low-voltage power domains.
• RoHS Compliant: Conforms to material regulation expectations for commercial and industrial products.

Why Choose LFXP2-8E-6FTN256I?

The LFXP2-8E-6FTN256I positions itself as a practical choice for engineers needing a mid-range FPGA with a strong I/O capability and industrial temperature tolerance. Its combination of 8,000 logic elements, on-chip memory, and 201 I/O pins offers a balanced platform for embedded control, interface consolidation, and prototype development.

This device suits customers seeking a compact, surface-mount FPGA solution that aligns with industrial environmental requirements and standard board-level integration while providing the programmability to adapt to changing system requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the LFXP2-8E-6FTN256I.