LFXP2-8E-5TN144I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 100 226304 8000 144-LQFP |
|---|---|
| Quantity | 530 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFXP2-8E-5TN144I – XP2 Field Programmable Gate Array (FPGA) IC 100 226304 8000 144-LQFP
The LFXP2-8E-5TN144I is an industrial-grade FPGA from Lattice Semiconductor's LatticeXP2 family, delivering 8,000 logic elements and approximately 0.226 Mbits of on-chip RAM in a 144-pin LQFP (20 × 20 mm) package. The device integrates non-volatile flash-based configuration with a flexible FPGA fabric tailored for embedded and industrial applications.
Designed for low-voltage systems, the device operates from a 1.14 V to 1.26 V supply and supports an extended operating range of −40 °C to 100 °C. With 100 user I/Os and surface-mount packaging, it targets compact, reconfigurable designs requiring secure configuration and embedded memory resources.
Key Features
- flexiFLASH Architecture — Flash-based instant-on configuration with on-chip FlashBAK memory and serial TAG memory for design security and infinite reconfiguration.
- Live Update and Secure Boot — Support for TransFR Live Update technology, dual-boot with external SPI, and secure updates using 128-bit AES encryption.
- Logic and DSP Resources — Approximately 8,000 logic elements and sysDSP blocks (family-defined) for multiply-accumulate tasks; family devices include 18×18 multipliers (table mapping indicates up to 16 for XP2-8).
- Embedded and Distributed Memory — Total on-chip RAM of 226,304 bits, providing embedded block RAM and distributed RAM resources for buffering and state storage.
- Flexible I/O — 100 user I/Os in the 144-LQFP package; family I/O buffer support includes LVCMOS, LVTTL, LVDS, and other signaling standards for interface versatility.
- Clocking and Timing — Integrated PLL support (family devices provide up to four analog PLLs) for clock multiplication, division, and phase shifting.
- Industrial Temperature Grade — Rated for −40 °C to 100 °C operating temperature, suitable for industrial environments.
- Compact Surface-Mount Package — 144-LQFP (20 × 20 mm) surface-mount package for space-constrained PCBs.
- Low-Voltage Core — Core supply specified between 1.14 V and 1.26 V for low-power system integration.
- RoHS Compliant — Meets RoHS environmental requirements.
Typical Applications
- Industrial Control and Automation — Industrial temperature rating and reconfigurable logic make this FPGA suitable for control logic, protocol bridging, and deterministic I/O handling in automation equipment.
- Secure Embedded Systems — Flash-based configuration, dual-boot options, and 128-bit AES secure update capability support secure firmware and field updates.
- Signal Processing and DSP Tasks — sysDSP resources and multiple 18×18 multipliers (family mapping) enable embedded multiply-accumulate functions and real-time signal processing.
- Interface and Display Bridge — Flexible I/O standards supported by the family and high I/O count in this package make it suitable for bridging between serial and parallel interfaces or driving display subsystems.
Unique Advantages
- Instant-on, Reconfigurable Flash — Built-in flash configuration enables instant-on behavior and field reprogramming without external volatile configuration memory.
- Secure Field Updates — Live Update technology with AES-based secure updates reduces deployment risk when updating in-field firmware.
- Balanced Logic and Memory — 8,000 logic elements paired with ~0.226 Mbits of on-chip RAM provides a balanced resource set for mid-density designs.
- Industrial Reliability — Operating range down to −40 °C and up to 100 °C with surface-mount packaging supports reliable deployment in industrial environments.
- Low-Voltage Integration — Narrow core voltage range (1.14–1.26 V) facilitates integration into low-voltage power domains.
- Compact Package with Ample I/O — 144-LQFP package offers a compact footprint while providing 100 usable I/Os for peripheral and sensor connectivity.
Why Choose LFXP2-8E-5TN144I?
The LFXP2-8E-5TN144I brings flash-based instant-on configuration, security-focused update mechanisms, and a balanced combination of logic, DSP, and embedded memory into a compact 144-LQFP package. Its industrial temperature rating and RoHS compliance make it a practical choice for mid-density designs that require field reprogrammability and secure updates.
This device is well suited to engineers building industrial control systems, secure embedded products, or signal-processing-oriented designs that need a low-voltage, reconfigurable platform with on-chip non-volatile configuration and a clear upgrade path within the LatticeXP2 family.
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