LFXP2-8E-5TN144I

IC FPGA 100 I/O 144TQFP
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 100 226304 8000 144-LQFP

Quantity 530 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O100Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1000Number of Logic Elements/Cells8000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits226304

Overview of LFXP2-8E-5TN144I – XP2 Field Programmable Gate Array (FPGA) IC 100 226304 8000 144-LQFP

The LFXP2-8E-5TN144I is an industrial-grade FPGA from Lattice Semiconductor's LatticeXP2 family, delivering 8,000 logic elements and approximately 0.226 Mbits of on-chip RAM in a 144-pin LQFP (20 × 20 mm) package. The device integrates non-volatile flash-based configuration with a flexible FPGA fabric tailored for embedded and industrial applications.

Designed for low-voltage systems, the device operates from a 1.14 V to 1.26 V supply and supports an extended operating range of −40 °C to 100 °C. With 100 user I/Os and surface-mount packaging, it targets compact, reconfigurable designs requiring secure configuration and embedded memory resources.

Key Features

  • flexiFLASH Architecture — Flash-based instant-on configuration with on-chip FlashBAK memory and serial TAG memory for design security and infinite reconfiguration.
  • Live Update and Secure Boot — Support for TransFR Live Update technology, dual-boot with external SPI, and secure updates using 128-bit AES encryption.
  • Logic and DSP Resources — Approximately 8,000 logic elements and sysDSP blocks (family-defined) for multiply-accumulate tasks; family devices include 18×18 multipliers (table mapping indicates up to 16 for XP2-8).
  • Embedded and Distributed Memory — Total on-chip RAM of 226,304 bits, providing embedded block RAM and distributed RAM resources for buffering and state storage.
  • Flexible I/O — 100 user I/Os in the 144-LQFP package; family I/O buffer support includes LVCMOS, LVTTL, LVDS, and other signaling standards for interface versatility.
  • Clocking and Timing — Integrated PLL support (family devices provide up to four analog PLLs) for clock multiplication, division, and phase shifting.
  • Industrial Temperature Grade — Rated for −40 °C to 100 °C operating temperature, suitable for industrial environments.
  • Compact Surface-Mount Package — 144-LQFP (20 × 20 mm) surface-mount package for space-constrained PCBs.
  • Low-Voltage Core — Core supply specified between 1.14 V and 1.26 V for low-power system integration.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • Industrial Control and Automation — Industrial temperature rating and reconfigurable logic make this FPGA suitable for control logic, protocol bridging, and deterministic I/O handling in automation equipment.
  • Secure Embedded Systems — Flash-based configuration, dual-boot options, and 128-bit AES secure update capability support secure firmware and field updates.
  • Signal Processing and DSP Tasks — sysDSP resources and multiple 18×18 multipliers (family mapping) enable embedded multiply-accumulate functions and real-time signal processing.
  • Interface and Display Bridge — Flexible I/O standards supported by the family and high I/O count in this package make it suitable for bridging between serial and parallel interfaces or driving display subsystems.

Unique Advantages

  • Instant-on, Reconfigurable Flash — Built-in flash configuration enables instant-on behavior and field reprogramming without external volatile configuration memory.
  • Secure Field Updates — Live Update technology with AES-based secure updates reduces deployment risk when updating in-field firmware.
  • Balanced Logic and Memory — 8,000 logic elements paired with ~0.226 Mbits of on-chip RAM provides a balanced resource set for mid-density designs.
  • Industrial Reliability — Operating range down to −40 °C and up to 100 °C with surface-mount packaging supports reliable deployment in industrial environments.
  • Low-Voltage Integration — Narrow core voltage range (1.14–1.26 V) facilitates integration into low-voltage power domains.
  • Compact Package with Ample I/O — 144-LQFP package offers a compact footprint while providing 100 usable I/Os for peripheral and sensor connectivity.

Why Choose LFXP2-8E-5TN144I?

The LFXP2-8E-5TN144I brings flash-based instant-on configuration, security-focused update mechanisms, and a balanced combination of logic, DSP, and embedded memory into a compact 144-LQFP package. Its industrial temperature rating and RoHS compliance make it a practical choice for mid-density designs that require field reprogrammability and secure updates.

This device is well suited to engineers building industrial control systems, secure embedded products, or signal-processing-oriented designs that need a low-voltage, reconfigurable platform with on-chip non-volatile configuration and a clear upgrade path within the LatticeXP2 family.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the LFXP2-8E-5TN144I.

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