LFXP2-8E-5QN208C

IC FPGA 146 I/O 208QFP
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 146 226304 8000 208-BFQFP

Quantity 578 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O146Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1000Number of Logic Elements/Cells8000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits226304

Overview of LFXP2-8E-5QN208C – XP2 Field Programmable Gate Array (FPGA) IC 146 226304 8000 208-BFQFP

The LFXP2-8E-5QN208C is a Lattice XP2 family FPGA combining LUT-based logic fabric with non-volatile flash architecture for instant-on, reconfigurable designs. It delivers 8,000 logic elements, on-chip embedded memory and dedicated DSP resources for mid-range embedded and interface applications.

This device is suited for designs that require a balance of logic density, embedded RAM and I/O in a 208-pin PQFP/BFQFP package, and supports secure update and configuration capabilities provided by the XP2 family architecture.

Key Features

  • Core Logic  8,000 logic elements (LUT-based FPGA fabric) for combinational and sequential logic implementation.
  • Embedded Memory  Approximately 226 Kbits of on-chip RAM (total RAM bits: 226,304) for data buffering, state storage and small SRAM requirements.
  • Dedicated DSP Resources  Four sysDSP blocks with support for 18×18 multipliers (family-level support for multiply-accumulate operations) to accelerate signal-processing tasks.
  • I/O and Package  Up to 146 user I/Os in a 208-pin BFQFP / PQFP (28 × 28 mm) package, enabling complex interfacing and board-level connectivity in a surface-mount form factor.
  • Power  Low-voltage operation with a supply range of 1.14 V to 1.26 V (nominal 1.2 V) for core power.
  • Configuration & Security  flexiFLASH™ architecture with instant-on, FlashBAK embedded memory and family-level Live Update features including secure updates with 128-bit AES encryption and dual-boot support.
  • Clocking  sysCLOCK PLL support for clock multiply/divide and phase shifting (family-level PLL resources available).
  • Packaging & Mounting  Surface-mount device in a 208-pin PQFP/BFQFP package; commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Embedded control and glue logic  Implement board-level control, protocol bridging and custom peripheral logic using the device’s logic elements and I/O resources.
  • Memory interface and buffering  Use the on-chip RAM and I/O capabilities to implement DDR/DDR2 interface logic or memory controller glue (family support for DDR interfaces noted in the XP2 family).
  • Signal processing and DSP offload  Leverage sysDSP blocks and 18×18 multipliers for filtering, accumulation and other moderate-performance DSP functions.
  • Display and high-speed interfaces  Support source-synchronous display interfaces and high-pin-count I/O requirements in compact PQFP packaging.

Unique Advantages

  • Instant-on, reconfigurable architecture: flexiFLASH technology provides non-volatile configuration with instant-on capability and on-chip FlashBAK storage to simplify system boot and updates.
  • Balanced mid-range resources: 8,000 logic elements combined with approximately 226 Kbits of embedded RAM and dedicated DSP blocks delivers a versatile resource mix for many embedded designs.
  • High I/O count in a PQFP package: 146 user I/Os in a 208-pin PQFP/BFQFP package give substantial connectivity while remaining compatible with standard surface-mount assembly.
  • Secure update support: Family-level Live Update features with 128-bit AES encryption and dual-boot support enable secure field updates and design protection.
  • Low-voltage core operation: Narrow core supply range (1.14–1.26 V) supports low-power system architectures and predictable power budgeting.
  • RoHS compliant: Conforms to RoHS requirements for lead-free manufacturing processes and environmental compliance.

Why Choose LFXP2-8E-5QN208C?

The LFXP2-8E-5QN208C positions itself as a flexible, mid-density FPGA solution within the XP2 family, offering an effective combination of logic elements, embedded memory and DSP capability in a surface-mount 208-pin package. Its flash-based configuration, secure update features and dedicated DSP blocks make it suitable for designers who need instant-on operation, on-chip reconfigurability and hardware-accelerated signal processing without external configuration memory.

This device is well suited for engineering teams building embedded controllers, interface logic, memory interface modules and moderate DSP subsystems who value a compact package, predictable power requirements and the XP2 family’s configuration and security features.

Request a quote or submit a procurement inquiry to obtain pricing, availability and ordering information for LFXP2-8E-5QN208C.

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