LFXP2-8E-5QN208C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 146 226304 8000 208-BFQFP |
|---|---|
| Quantity | 578 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 146 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFXP2-8E-5QN208C – XP2 Field Programmable Gate Array (FPGA) IC 146 226304 8000 208-BFQFP
The LFXP2-8E-5QN208C is a Lattice XP2 family FPGA combining LUT-based logic fabric with non-volatile flash architecture for instant-on, reconfigurable designs. It delivers 8,000 logic elements, on-chip embedded memory and dedicated DSP resources for mid-range embedded and interface applications.
This device is suited for designs that require a balance of logic density, embedded RAM and I/O in a 208-pin PQFP/BFQFP package, and supports secure update and configuration capabilities provided by the XP2 family architecture.
Key Features
- Core Logic 8,000 logic elements (LUT-based FPGA fabric) for combinational and sequential logic implementation.
- Embedded Memory Approximately 226 Kbits of on-chip RAM (total RAM bits: 226,304) for data buffering, state storage and small SRAM requirements.
- Dedicated DSP Resources Four sysDSP blocks with support for 18×18 multipliers (family-level support for multiply-accumulate operations) to accelerate signal-processing tasks.
- I/O and Package Up to 146 user I/Os in a 208-pin BFQFP / PQFP (28 × 28 mm) package, enabling complex interfacing and board-level connectivity in a surface-mount form factor.
- Power Low-voltage operation with a supply range of 1.14 V to 1.26 V (nominal 1.2 V) for core power.
- Configuration & Security flexiFLASH™ architecture with instant-on, FlashBAK embedded memory and family-level Live Update features including secure updates with 128-bit AES encryption and dual-boot support.
- Clocking sysCLOCK PLL support for clock multiply/divide and phase shifting (family-level PLL resources available).
- Packaging & Mounting Surface-mount device in a 208-pin PQFP/BFQFP package; commercial grade with an operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- Embedded control and glue logic Implement board-level control, protocol bridging and custom peripheral logic using the device’s logic elements and I/O resources.
- Memory interface and buffering Use the on-chip RAM and I/O capabilities to implement DDR/DDR2 interface logic or memory controller glue (family support for DDR interfaces noted in the XP2 family).
- Signal processing and DSP offload Leverage sysDSP blocks and 18×18 multipliers for filtering, accumulation and other moderate-performance DSP functions.
- Display and high-speed interfaces Support source-synchronous display interfaces and high-pin-count I/O requirements in compact PQFP packaging.
Unique Advantages
- Instant-on, reconfigurable architecture: flexiFLASH technology provides non-volatile configuration with instant-on capability and on-chip FlashBAK storage to simplify system boot and updates.
- Balanced mid-range resources: 8,000 logic elements combined with approximately 226 Kbits of embedded RAM and dedicated DSP blocks delivers a versatile resource mix for many embedded designs.
- High I/O count in a PQFP package: 146 user I/Os in a 208-pin PQFP/BFQFP package give substantial connectivity while remaining compatible with standard surface-mount assembly.
- Secure update support: Family-level Live Update features with 128-bit AES encryption and dual-boot support enable secure field updates and design protection.
- Low-voltage core operation: Narrow core supply range (1.14–1.26 V) supports low-power system architectures and predictable power budgeting.
- RoHS compliant: Conforms to RoHS requirements for lead-free manufacturing processes and environmental compliance.
Why Choose LFXP2-8E-5QN208C?
The LFXP2-8E-5QN208C positions itself as a flexible, mid-density FPGA solution within the XP2 family, offering an effective combination of logic elements, embedded memory and DSP capability in a surface-mount 208-pin package. Its flash-based configuration, secure update features and dedicated DSP blocks make it suitable for designers who need instant-on operation, on-chip reconfigurability and hardware-accelerated signal processing without external configuration memory.
This device is well suited for engineering teams building embedded controllers, interface logic, memory interface modules and moderate DSP subsystems who value a compact package, predictable power requirements and the XP2 family’s configuration and security features.
Request a quote or submit a procurement inquiry to obtain pricing, availability and ordering information for LFXP2-8E-5QN208C.

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