LFXP2-8E-5M132C

IC FPGA 86 I/O 132CSBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 86 226304 8000 132-LFBGA, CSPBGA

Quantity 506 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package132-CSBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O86Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1000Number of Logic Elements/Cells8000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits226304

Overview of LFXP2-8E-5M132C – LatticeXP2 FPGA, 8000 logic elements, 86 I/Os, 132-ball csBGA

The LFXP2-8E-5M132C is a LatticeXP2-family field programmable gate array combining LUT-based FPGA fabric with on-chip non-volatile flash. It delivers a compact, instant-on reconfigurable solution with 8000 logic elements, approximately 226 Kbits of embedded memory, and 86 user I/Os in a 132-ball csBGA (8×8 mm) package.

Designed for commercial embedded systems, this device targets applications that require low-voltage operation (1.14–1.26 V), flexible I/O support and DSP acceleration, while offering live-update and security features provided by the LatticeXP2 architecture.

Key Features

  • flexiFLASH non-volatile architecture — On-chip flash provides instant-on operation, infinite reconfigurability and embedded FlashBAK memory for reliable single-chip configuration.
  • Live Update and security — TransFR live-update support with 128-bit AES encryption and dual-boot image capability enables secure field updates and robust boot strategies.
  • Core logic — 8000 logic elements (LUT-based fabric) suitable for mid-range control, glue logic and protocol offload tasks.
  • Embedded memory — Approximately 226 Kbits of on-chip RAM (embedded + distributed) for buffering, FIFOs and small data structures.
  • sysDSP acceleration — FPGA includes 4 sysDSP blocks and 16 18×18 multipliers for high-performance multiply-accumulate and signal processing routines.
  • Flexible I/O and interfaces — 86 I/Os with sysIO buffer support for LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS standards to support a wide range of serial and parallel links.
  • Clocking — Integrated PLL resources (two device PLLs for this device class) for clock multiplication, division and phase shifting.
  • Compact package and mounting — 132-LFBGA (csBGA, 8×8 mm) surface-mount package for dense board-level integration with 86 available I/Os.
  • Operating conditions — Commercial grade operation from 0 °C to 85 °C and low-voltage supply range of 1.14 V to 1.26 V.
  • System support and configuration — SPI boot flash interface, dual-boot image support, Soft Error Detect (SED) macro, IEEE 1149.1 and IEEE 1532 compliance, and an on-chip oscillator for initialization.

Typical Applications

  • Embedded control and automation — Use the FPGA fabric and on-chip memory to implement control logic, sensor interfacing and timing-critical glue logic in commercial embedded systems.
  • Signal processing and DSP offload — sysDSP blocks and 18×18 multipliers accelerate multiply-accumulate workloads for filtering, data conversion and real-time processing.
  • Display and video interfaces — Flexible I/O and pre-engineered source-synchronous interfaces (including LVDS variants) support display drivers and high-speed parallel/serial interfaces.
  • Communications and protocol bridging — Implement protocol translators, peripheral interfaces and custom datapaths using the device’s logic, memory and flexible I/O standards.

Unique Advantages

  • Instant-on, single-chip configuration: Non-volatile flexiFLASH enables immediate startup without external configuration memory, reducing system complexity.
  • Secure field updates: TransFR live-update with 128-bit AES encryption and dual-boot support allows secure in-field firmware upgrades and rollback strategies.
  • DSP-capable fabric: sysDSP blocks and 16 dedicated 18×18 multipliers provide hardware acceleration for compute-heavy signal tasks, offloading the CPU.
  • Rich I/O flexibility in a compact footprint: 86 I/Os with broad support for industry signaling standards allow dense interface integration in an 8×8 mm csBGA package.
  • Low-voltage operation: 1.14–1.26 V supply range supports modern low-power system designs and efficient power budgeting.
  • System-level reliability features: Soft Error Detect, IEEE programming/test support and on-chip oscillator simplify development and improve resilience.

Why Choose LFXP2-8E-5M132C?

The LFXP2-8E-5M132C positions itself as a versatile mid-density FPGA for commercial embedded designs that require instant-on behavior, secure update capability and DSP acceleration in a small footprint. With 8000 logic elements, approximately 226 Kbits of on-chip memory, 86 flexible I/Os and dedicated sysDSP resources, it delivers the integration and performance needed for control, interface and signal-processing functions.

This device is well suited to customers designing compact, low-voltage systems who value reconfigurability, in-field update security and a broad set of I/O standards. Its LatticeXP2 family features and system-level support help reduce BOM complexity and streamline design migration within the family.

Request a quote or submit an inquiry to get pricing, availability and technical support for the LFXP2-8E-5M132C. Our team can provide delivery options and additional product information to support your design evaluation.

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