LFXP2-8E-5M132C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 86 226304 8000 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 506 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 86 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFXP2-8E-5M132C – LatticeXP2 FPGA, 8000 logic elements, 86 I/Os, 132-ball csBGA
The LFXP2-8E-5M132C is a LatticeXP2-family field programmable gate array combining LUT-based FPGA fabric with on-chip non-volatile flash. It delivers a compact, instant-on reconfigurable solution with 8000 logic elements, approximately 226 Kbits of embedded memory, and 86 user I/Os in a 132-ball csBGA (8×8 mm) package.
Designed for commercial embedded systems, this device targets applications that require low-voltage operation (1.14–1.26 V), flexible I/O support and DSP acceleration, while offering live-update and security features provided by the LatticeXP2 architecture.
Key Features
- flexiFLASH non-volatile architecture — On-chip flash provides instant-on operation, infinite reconfigurability and embedded FlashBAK memory for reliable single-chip configuration.
- Live Update and security — TransFR live-update support with 128-bit AES encryption and dual-boot image capability enables secure field updates and robust boot strategies.
- Core logic — 8000 logic elements (LUT-based fabric) suitable for mid-range control, glue logic and protocol offload tasks.
- Embedded memory — Approximately 226 Kbits of on-chip RAM (embedded + distributed) for buffering, FIFOs and small data structures.
- sysDSP acceleration — FPGA includes 4 sysDSP blocks and 16 18×18 multipliers for high-performance multiply-accumulate and signal processing routines.
- Flexible I/O and interfaces — 86 I/Os with sysIO buffer support for LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS standards to support a wide range of serial and parallel links.
- Clocking — Integrated PLL resources (two device PLLs for this device class) for clock multiplication, division and phase shifting.
- Compact package and mounting — 132-LFBGA (csBGA, 8×8 mm) surface-mount package for dense board-level integration with 86 available I/Os.
- Operating conditions — Commercial grade operation from 0 °C to 85 °C and low-voltage supply range of 1.14 V to 1.26 V.
- System support and configuration — SPI boot flash interface, dual-boot image support, Soft Error Detect (SED) macro, IEEE 1149.1 and IEEE 1532 compliance, and an on-chip oscillator for initialization.
Typical Applications
- Embedded control and automation — Use the FPGA fabric and on-chip memory to implement control logic, sensor interfacing and timing-critical glue logic in commercial embedded systems.
- Signal processing and DSP offload — sysDSP blocks and 18×18 multipliers accelerate multiply-accumulate workloads for filtering, data conversion and real-time processing.
- Display and video interfaces — Flexible I/O and pre-engineered source-synchronous interfaces (including LVDS variants) support display drivers and high-speed parallel/serial interfaces.
- Communications and protocol bridging — Implement protocol translators, peripheral interfaces and custom datapaths using the device’s logic, memory and flexible I/O standards.
Unique Advantages
- Instant-on, single-chip configuration: Non-volatile flexiFLASH enables immediate startup without external configuration memory, reducing system complexity.
- Secure field updates: TransFR live-update with 128-bit AES encryption and dual-boot support allows secure in-field firmware upgrades and rollback strategies.
- DSP-capable fabric: sysDSP blocks and 16 dedicated 18×18 multipliers provide hardware acceleration for compute-heavy signal tasks, offloading the CPU.
- Rich I/O flexibility in a compact footprint: 86 I/Os with broad support for industry signaling standards allow dense interface integration in an 8×8 mm csBGA package.
- Low-voltage operation: 1.14–1.26 V supply range supports modern low-power system designs and efficient power budgeting.
- System-level reliability features: Soft Error Detect, IEEE programming/test support and on-chip oscillator simplify development and improve resilience.
Why Choose LFXP2-8E-5M132C?
The LFXP2-8E-5M132C positions itself as a versatile mid-density FPGA for commercial embedded designs that require instant-on behavior, secure update capability and DSP acceleration in a small footprint. With 8000 logic elements, approximately 226 Kbits of on-chip memory, 86 flexible I/Os and dedicated sysDSP resources, it delivers the integration and performance needed for control, interface and signal-processing functions.
This device is well suited to customers designing compact, low-voltage systems who value reconfigurability, in-field update security and a broad set of I/O standards. Its LatticeXP2 family features and system-level support help reduce BOM complexity and streamline design migration within the family.
Request a quote or submit an inquiry to get pricing, availability and technical support for the LFXP2-8E-5M132C. Our team can provide delivery options and additional product information to support your design evaluation.

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