LFXP2-8E-5FTN256I

The LFXP2-8E-5FTN256I is a Lattice XP2-series field programmable gate array (FPGA) in a 256-ball ftBGA package designed for industrial applications. It pairs an FPGA fabric with on-chip flash-based configuration (flexiFLASH architecture) to provide instant-on, reconfigurable logic with integrated security and update features. Typical use cases include industrial control, display and interface bridging, and embedded communications where mid-range logic density, significant I/O count, and industrial temperature operation are required.

Key Features

• Core Logic — Approximately 8,000 logic elements (cells) provide mid-range programmable logic capacity for control, glue logic, and custom datapaths.
• Memory — Approximately 226 Kbits of embedded RAM and family support for distributed and embedded memory resources for buffering and small on-chip storage.
• sysDSP and Multipliers — XP2 family sysDSP blocks and 18×18 multipliers available for multiply-accumulate tasks; the XP2-8 device class provides DSP resources suitable for signal processing and control algorithms.
• I/O and Interfaces — Up to 201 user I/Os supported on the 256-FTBGA (17×17) package; flexible I/O buffer options and pre‑engineered source-synchronous interfaces (e.g., DDR/DDR2, LVDS) are supported by the XP2 family.
• Configuration & Update — flexiFLASH architecture provides instant-on and non-volatile configuration; Live Update technologies including TransFR, dual-boot with external SPI, and 128-bit AES secure update support are available in the XP2 family.
• Clocking — Family features include analog PLLs for clock multiply/divide and phase shifting; selection guide notes device-level PLL resources.
• Power — Device supply range is specified at 1.14 V to 1.26 V (nominal family VCC ~1.2 V), enabling low-voltage system integration.
• Package & Mounting — 256-LBGA / 256-FTBGA (17×17 mm) surface-mount package optimized for compact board designs.
• Industrial Temperature & Compliance — Rated for operation from −40 °C to 100 °C and RoHS compliant for industrial applications.

Typical Applications

• Industrial control and automation — Mid-range logic capacity, 201 I/Os and industrial temperature rating enable real-time control, I/O aggregation, and protocol bridging in automation systems.
• Display and video interfaces — Family support for high-speed source-synchronous interfaces and multi-lane LVDS make the device suitable for display timing, bridging, and interface conversion tasks.
• Embedded communications and buffering — On-chip embedded RAM and pre‑engineered interfaces such as DDR/DDR2 and XGMII (as supported by the XP2 family) are suitable for packet buffering and interface protocol handling.
• Secure field-update systems — flexiFLASH with Live Update, TransFR and 128-bit AES encryption enable secure firmware updates and dual-boot configurations for deployed systems.

Unique Advantages

• Instant-on non-volatile configuration — flexiFLASH architecture enables immediate startup without external configuration memory, simplifying system boot behavior.
• Integrated security and update support — Secure update features including 128-bit AES and TransFR reduce operational risk when updating deployed devices.
• Balanced integration for mid-density designs — ~8,000 logic elements, ~226 Kbits embedded RAM and up to 201 I/Os deliver a balanced feature set for control, interface and moderate DSP tasks.
• Industrial temperature range — −40 °C to 100 °C rating supports deployment in harsh environments where extended temperature operation is required.
• Compact BGA package — 256-ball ftBGA (17×17 mm) provides a small footprint with high I/O count for space-constrained boards.
• Low-voltage operation — Narrow supply range around 1.2 V supports integration into low-voltage power domains.

Why Choose LFXP2-8E-5FTN256I?

The LFXP2-8E-5FTN256I offers a practical balance of programmable logic, embedded memory, DSP resources and a high I/O count in a compact 256-ball ftBGA package, all rated for industrial temperature operation. It is well suited to engineers designing mid-density FPGA solutions that require instant-on non-volatile configuration, secure field updates, and flexible interface support.

As part of the Lattice XP2 family, this device is supported by the family-level features and design ecosystem that include on-chip configuration, Live Update technologies and pre‑engineered IP to accelerate implementation and migration across XP2 devices.

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