LFXP2-8E-5M132I

The LFXP2-8E-5M132I is a LatticeXP2 family Field Programmable Gate Array (FPGA) in a 132-ball LFBGA/CSPBGA package. It combines a LUT-based FPGA fabric with on-chip non-volatile features and system-level peripherals from the LatticeXP2 family architecture.

Designed for industrial-grade applications, the device delivers approximately 8,000 logic elements, 226,304 bits of embedded RAM, flexible I/O support for a variety of signaling standards, and operation across a wide temperature and low-voltage range—making it suitable for embedded control, interface bridging, and display or memory interfacing tasks found in industrial systems.

Key Features

• Core Architecture LatticeXP2 family flexiFLASH architecture with instant-on, infinitely reconfigurable single-chip flash-based configuration and on-chip FlashBAK technology for non-volatile storage.
• Logic Capacity Approximately 8,000 logic elements (LUT-based fabric) for mid-density logic and control implementations.
• Embedded Memory 226,304 total RAM bits of on-chip memory (embedded and distributed memory structures available within the LatticeXP2 family).
• DSP and Math Blocks Family-level sysDSP blocks provide dedicated multiply/accumulate resources and 18×18 multiplier support for signal processing tasks.
• Flexible I/O 86 user I/Os with sysIO buffer support for a wide range of standards (LVCMOS, SSTL, HSTL, PCI, LVDS variants, LVPECL, RSDS), enabling source-synchronous interfaces and display links.
• Memory and Interface Support Pre-engineered DDR/DDR2 interfaces (up to 200 MHz) and multi-channel LVDS support for display and high-speed interface designs (features from the LatticeXP2 family).
• Power and Temperature Low-voltage operation with supply range 1.14 V to 1.26 V and industrial operating temperature from −40 °C to 100 °C.
• Package and Mounting 132-LFBGA (CSPBGA) 8 × 8 mm footprint, surface-mount package (132-ball csBGA configuration).
• Security and System Features Family-level support for secure updates with 128-bit AES encryption, TransFR live update technology, and dual-boot configuration options.
• Standards and Support Family-level system support includes on-chip oscillators, PLLs for clock management, and IEEE 1149.1 / IEEE 1532 compliance.
• Environmental RoHS compliant.

Typical Applications

• Industrial Control Industrial embedded controllers and automation interfaces that benefit from the device’s industrial temperature rating, flexible I/O, and low-voltage operation.
• Memory Interface Bridging DDR/DDR2 interface support and system-level I/O make the device suitable for designs requiring memory bridging or interface adaptation up to the family-supported rates.
• Display and Video Interfaces Multi-channel LVDS and 7:1 LVDS support in the family enable display-interface implementations and source-synchronous video links.
• Embedded Signal Processing sysDSP blocks and on-chip multipliers support mid-range signal processing tasks such as filtering, sensor data aggregation, and control algorithms.

Unique Advantages

• Instant-on, non-volatile architecture: flexiFLASH single-chip configuration provides immediate start-up and on-chip flash storage with FlashBAK capability.
• Integrated DSP resources: sysDSP blocks with 18×18 multipliers accelerate arithmetic-heavy functions without external accelerators.
• Flexible, multi-standard I/O: Broad I/O standard support enables interfacing to a wide range of peripherals and high-speed links from a single device.
• Compact industrial-grade package: 132-ball LFBGA/CSPBGA (8×8 mm) delivers a small footprint while supporting industrial temperature operation.
• Secure update and system resilience: Family-level TransFR live update and 128-bit AES secure update support help protect designs and enable field reconfiguration.
• Low-voltage operation: 1.14–1.26 V supply range aligns with modern low-voltage system rails and power-constrained designs.

Why Choose LFXP2-8E-5M132I?

The LFXP2-8E-5M132I places the LatticeXP2 family’s flash-based, instant-on FPGA architecture into a compact, industrial-grade 132-ball LFBGA package. With approximately 8,000 logic elements, 226,304 bits of embedded RAM, dedicated DSP blocks, and 86 flexible I/Os, it provides a balanced combination of logic capacity, on-chip memory, and mixed-signal interface support for mid-density embedded designs.

This device is suited to engineers who need a reconfigurable, secure, and compact solution for industrial control, interface bridging, display interfacing, and embedded signal processing. Its low-voltage operation, industrial temperature rating, and on-chip system features offer a scalable option within the LatticeXP2 family for long-term, field-upgradable designs.

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