LFXP2-8E-5MN132I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 86 226304 8000 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 456 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSBGA (8x8) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 86 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFXP2-8E-5MN132I – XP2 Field Programmable Gate Array (132-LFBGA)
The LFXP2-8E-5MN132I is an industrial-grade, surface-mount FPGA featuring Lattice's flexiFLASH architecture. It combines non-volatile flash-based configuration with a LUT-based FPGA fabric and on-chip embedded memory to deliver instant-on, reconfigurable logic for industrial and embedded designs.
With 8,000 logic elements, approximately 226 Kbits of embedded RAM, and 86 I/Os in a 132-ball LFBGA (8×8 mm) package, this device targets applications that require low-voltage operation (1.14 V to 1.26 V), wide operating temperatures (-40 °C to 100 °C), and reliable, reprogrammable system-level features.
Key Features
- Core Logic 8,000 logic elements provide the programmable fabric for implementing custom digital logic and control functions.
- Embedded Memory Approximately 226,304 bits of on-chip RAM for code, buffers, and local storage, supporting compact system designs.
- DSP Resources Family-level sysDSP blocks and hardware multipliers support multiply-accumulate operations for signal processing and arithmetic acceleration.
- Flexible I/O 86 user I/Os available in the 132-LFBGA package for peripheral interfaces and custom I/O configurations.
- Configuration & Security Flash-based flexiFLASH architecture enables instant-on and infinitely reconfigurable operation with embedded non-volatile configuration storage.
- Power Low-voltage core operation with VCC supply range from 1.14 V to 1.26 V, suitable for modern low-power system designs.
- Package & Mounting 132-LFBGA (132-CSBGA, 8×8 mm) surface-mount package that balances I/O count and board area for compact assemblies.
- Industrial Temperature Rated for operation from -40 °C to 100 °C, supporting deployment in industrial environments.
- Standards & Compliance RoHS-compliant for environmental and manufacturing requirements.
Typical Applications
- Industrial Control Implement deterministic control logic, custom interfaces, and local processing in systems that require industrial temperature operation.
- Embedded Systems Integrate reconfigurable logic and on-chip memory for system management, protocol handling, and instant-on functionality.
- Display & Interface Bridging Use configurable I/O and on-chip resources to implement source-synchronous interfaces and display-related data paths.
- Communications & Protocol Conversion Deploy the FPGA fabric and DSP resources to handle protocol translation, data buffering, and timing-critical I/O tasks.
Unique Advantages
- Flash-Based Instant-On: flexiFLASH architecture provides non-volatile configuration for immediate startup without external configuration memory.
- Compact, Low-Voltage Design: 1.14 V–1.26 V core supply enables efficient power architectures in space-constrained embedded systems.
- Industrial Reliability: Specified for -40 °C to 100 °C operation and supplied in a robust 132-LFBGA surface-mount package for industrial deployments.
- Balanced Integration: A combination of 8,000 logic elements, substantial embedded RAM, and DSP resources reduces external components and simplifies BOM.
- Flexible I/O Count: 86 available I/Os in the compact 8×8 mm package allow for a variety of peripheral and interface connections while minimizing board area.
- Environmentally Compliant: RoHS compliance supports regulatory and manufacturing needs for modern electronics production.
Why Choose LFXP2-8E-5MN132I?
The LFXP2-8E-5MN132I positions itself as a practical, reconfigurable platform for industrial and embedded designs that need instant-on operation, low-voltage efficiency, and reliable performance across a wide temperature range. Its blend of 8,000 logic elements, embedded memory, DSP-capable resources, and 86 I/Os in a compact 132-LFBGA package makes it suitable for customers implementing custom control, interface bridging, and embedded processing tasks.
Choosing this FPGA provides long-term design flexibility through reprogrammability and on-chip non-volatile configuration, helping teams streamline BOMs and simplify system architectures while leveraging a family of tools and resources for design implementation.
Request a quote or submit an inquiry to get pricing and availability information for LFXP2-8E-5MN132I. Our team can provide lead-time, volume pricing, and technical support details to help you evaluate the device for your design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
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Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016