LFXP2-8E-5MN132I

IC FPGA 86 I/O 132CSBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 86 226304 8000 132-LFBGA, CSPBGA

Quantity 456 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package132-CSBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case132-LFBGA, CSPBGANumber of I/O86Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1000Number of Logic Elements/Cells8000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits226304

Overview of LFXP2-8E-5MN132I – XP2 Field Programmable Gate Array (132-LFBGA)

The LFXP2-8E-5MN132I is an industrial-grade, surface-mount FPGA featuring Lattice's flexiFLASH architecture. It combines non-volatile flash-based configuration with a LUT-based FPGA fabric and on-chip embedded memory to deliver instant-on, reconfigurable logic for industrial and embedded designs.

With 8,000 logic elements, approximately 226 Kbits of embedded RAM, and 86 I/Os in a 132-ball LFBGA (8×8 mm) package, this device targets applications that require low-voltage operation (1.14 V to 1.26 V), wide operating temperatures (-40 °C to 100 °C), and reliable, reprogrammable system-level features.

Key Features

  • Core Logic 8,000 logic elements provide the programmable fabric for implementing custom digital logic and control functions.
  • Embedded Memory Approximately 226,304 bits of on-chip RAM for code, buffers, and local storage, supporting compact system designs.
  • DSP Resources Family-level sysDSP blocks and hardware multipliers support multiply-accumulate operations for signal processing and arithmetic acceleration.
  • Flexible I/O 86 user I/Os available in the 132-LFBGA package for peripheral interfaces and custom I/O configurations.
  • Configuration & Security Flash-based flexiFLASH architecture enables instant-on and infinitely reconfigurable operation with embedded non-volatile configuration storage.
  • Power Low-voltage core operation with VCC supply range from 1.14 V to 1.26 V, suitable for modern low-power system designs.
  • Package & Mounting 132-LFBGA (132-CSBGA, 8×8 mm) surface-mount package that balances I/O count and board area for compact assemblies.
  • Industrial Temperature Rated for operation from -40 °C to 100 °C, supporting deployment in industrial environments.
  • Standards & Compliance RoHS-compliant for environmental and manufacturing requirements.

Typical Applications

  • Industrial Control Implement deterministic control logic, custom interfaces, and local processing in systems that require industrial temperature operation.
  • Embedded Systems Integrate reconfigurable logic and on-chip memory for system management, protocol handling, and instant-on functionality.
  • Display & Interface Bridging Use configurable I/O and on-chip resources to implement source-synchronous interfaces and display-related data paths.
  • Communications & Protocol Conversion Deploy the FPGA fabric and DSP resources to handle protocol translation, data buffering, and timing-critical I/O tasks.

Unique Advantages

  • Flash-Based Instant-On: flexiFLASH architecture provides non-volatile configuration for immediate startup without external configuration memory.
  • Compact, Low-Voltage Design: 1.14 V–1.26 V core supply enables efficient power architectures in space-constrained embedded systems.
  • Industrial Reliability: Specified for -40 °C to 100 °C operation and supplied in a robust 132-LFBGA surface-mount package for industrial deployments.
  • Balanced Integration: A combination of 8,000 logic elements, substantial embedded RAM, and DSP resources reduces external components and simplifies BOM.
  • Flexible I/O Count: 86 available I/Os in the compact 8×8 mm package allow for a variety of peripheral and interface connections while minimizing board area.
  • Environmentally Compliant: RoHS compliance supports regulatory and manufacturing needs for modern electronics production.

Why Choose LFXP2-8E-5MN132I?

The LFXP2-8E-5MN132I positions itself as a practical, reconfigurable platform for industrial and embedded designs that need instant-on operation, low-voltage efficiency, and reliable performance across a wide temperature range. Its blend of 8,000 logic elements, embedded memory, DSP-capable resources, and 86 I/Os in a compact 132-LFBGA package makes it suitable for customers implementing custom control, interface bridging, and embedded processing tasks.

Choosing this FPGA provides long-term design flexibility through reprogrammability and on-chip non-volatile configuration, helping teams streamline BOMs and simplify system architectures while leveraging a family of tools and resources for design implementation.

Request a quote or submit an inquiry to get pricing and availability information for LFXP2-8E-5MN132I. Our team can provide lead-time, volume pricing, and technical support details to help you evaluate the device for your design.

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