LFXP2-8E-5QN208I

The LFXP2-8E-5QN208I is a member of the Lattice XP2 field-programmable gate array family, combining LUT-based FPGA fabric with non-volatile flash architecture. It targets embedded and industrial applications that require a compact, reconfigurable logic device with on-chip memory and flexible I/O in a 208-pin BFQFP package.

Key value comes from integration and configurability: 8,000 logic elements, approximately 0.226 Mbits of on-chip RAM, 146 I/O pins, and support for single-chip flash-based configuration and live update technologies described for the XP2 family.

Key Features

• Core Logic  8,000 logic elements that enable moderate-density FPGA implementations and custom logic integration.
• Embedded Memory  Total on-chip RAM: 226,304 bits (approximately 0.226 Mbits) for distributed and embedded storage of state and buffering.
• DSP and Arithmetic Support  XP2 family sysDSP capabilities and configurable multipliers are part of the architecture, enabling multiply-accumulate operations for signal processing tasks.
• I/O and Package  146 user I/O in a 208-BFQFP (208-PQFP, 28 × 28 mm) supplier package, supporting surface-mount PCB assembly and dense I/O routing.
• Power  Device operates within a VCC supply range of 1.14 V to 1.26 V, suitable for 1.2 V system domains.
• Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for harsh-environment deployments.
• Configuration and Live Update (XP2 Family)  flexiFLASH architecture with instant-on, flash-based configuration, FlashBAK memory and family-level Live Update features such as TransFR and 128-bit AES secure updates.
• Clocking and Interfaces (XP2 Family)  Family-level support includes analog PLLs for clock multiply/divide/phase shifting and a flexible I/O buffer set supporting common I/O standards and source-synchronous interfaces (as documented for the XP2 family).
• Environmental Compliance  RoHS-compliant construction to meet lead-free regulatory requirements.

Typical Applications

• Industrial Control  Use the device for control logic, protocol conversion, or custom state machines where industrial temperature rating and surface-mount packaging are important.
• Signal Processing  Leverage on-chip RAM and XP2 family sysDSP capabilities to implement moderate-density DSP pipelines and multiply-accumulate functions.
• Memory and Interface Bridging  Implement DDR/DDR2 or source-synchronous interface glue logic and timing-critical I/O due to the device's flexible I/O support in the XP2 family.
• Embedded Systems  Integrate custom peripherals, glue logic and local processing functions where instant-on flash-based configuration and reconfigurability reduce system complexity.

Unique Advantages

• Flash-based instant-on architecture: The XP2 family’s flexiFLASH approach provides instant startup and on-chip non-volatile configuration storage.
• Secure, field-updatable configuration: Family-level TransFR Live Update and 128-bit AES encryption support secure updates and dual-boot configuration strategies.
• Compact, high-density I/O in PQFP package: 146 I/O in a 208-BFQFP (28 × 28 mm) footprint simplifies board layout for space-constrained designs.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in demanding thermal environments.
• Energy-efficient 1.2 V domain: Narrow supply window (1.14 V to 1.26 V) aligns with low-voltage system power domains.
• RoHS-compliant supply chain: Conforms to lead-free environmental requirements for global manufacturing.

Why Choose LFXP2-8E-5QN208I?

The LFXP2-8E-5QN208I offers a balanced combination of reconfigurable logic, on-chip memory and flexible I/O in a package suited for industrial embedded systems. Its flash-based XP2 architecture provides instant-on behavior and support for secure, field updates, while the device’s voltage and temperature ratings make it suitable for controlled low-voltage designs operating across a wide temperature range.

This device is well suited to engineers and designers needing a compact FPGA with moderate logic density, measurable embedded memory, and family-level features such as secure configuration and DSP resources—enabling scalable designs with simplified configuration management and lower system BOM complexity.

Request a quote or submit a purchase inquiry today to discuss availability and lead time for LFXP2-8E-5QN208I.