LFXP2-8E-6FT256I

The LFXP2-8E-6FT256I is a LatticeXP2 family FPGA featuring a LUT-based fabric combined with non-volatile flash configuration (flexiFLASH™). This device provides 8,000 logic elements, approximately 0.226 Mbits (226,304 bits) of on-chip RAM and up to 201 I/O pins in a compact 256-ball ftBGA (17 × 17 mm) package.

Designed for industrial applications, the device supports low-voltage operation (1.14–1.26 V), an extended operating temperature range (‑40 °C to 100 °C), and RoHS compliance—making it suitable for designs that require instant-on configuration, embedded memory, and a mix of high-performance DSP and flexible I/O.

Key Features

• flexiFLASH™ Architecture Instant-on, single-chip flash-based configuration with on-chip FlashBAK™ memory and design security features.
• Live Update / Secure Configuration TransFR™ live update capability with support for secure updates including 128-bit AES encryption and dual-boot image options.
• Logic Capacity 8,000 logic elements for implementing combinational and sequential logic functions.
• Embedded Memory Approximately 0.226 Mbits (226,304 bits) of on-chip RAM plus support for distributed RAM and EBR blocks across the family.
• sysDSP™ Blocks & Multipliers Dedicated sysDSP resources (device-class implementation includes multiple DSP blocks and 18×18 multipliers for multiply-accumulate algorithms).
• I/O Flexibility Up to 201 I/Os with support for a wide range of standards including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS, enabling source-synchronous interfaces and display links.
• Memory Interfaces Pre-engineered DDR/DDR2 interfaces supporting memory data rates up to 200 MHz (family-level capability).
• Clocking On-chip PLLs for clock multiply/divide and phase shifting; device-class PLL availability supports common clocking needs.
• Package & Mounting 256-ball ftBGA (17 × 17 mm) / 256-LBGA package; surface-mount mounting type for compact board integration.
• Industrial Grade & Temperature Industrial-grade device rated for operation from ‑40 °C to 100 °C.
• Low-Voltage Core Core supply range of 1.14 V to 1.26 V to match system power-rail requirements.
• Standards & System Support IEEE 1149.1 and IEEE 1532 compliance and on-chip oscillator for initialization and general use.
• Environmental RoHS compliant.

Typical Applications

• High-performance DSP and signal processing — Use the sysDSP blocks and on-chip multipliers for multiply-accumulate workloads and real-time processing functions.
• Memory interface bridging — Implement DDR/DDR2 interfaces and memory controllers leveraging pre-engineered source-synchronous IP for up to 200 MHz operation.
• Display and video interfaces — Support for LVDS and 7:1 LVDS display links makes this device suitable for display interface implementations.
• Secure field firmware updates — TransFR™ live update capability with AES encryption enables secure remote firmware updates and dual-boot strategies.

Unique Advantages

• Instant-on, non-volatile configuration: flexiFLASH™ architecture provides single-chip flash configuration for immediate startup without external configuration memory.
• Secure live updates: TransFR™ support with 128-bit AES encryption enables secure, reliable field updates and dual-boot configurations for safer firmware deployment.
• Balanced compute and memory: 8,000 logic elements combined with approximately 0.226 Mbits of on-chip RAM provide a compact platform for mixed logic and memory tasks.
• Versatile I/O support: Up to 201 I/Os with broad standard support simplifies integration with high-speed serial links, memory devices, and legacy parallel interfaces.
• Industrial temperature and RoHS compliance: Rated for ‑40 °C to 100 °C operation and RoHS compliant for industrial application requirements.
• Compact packaging: 256-ball ftBGA (17 × 17 mm) reduces PCB area while providing ample I/O for system-level integration.

Why Choose LFXP2-8E-6FT256I?

The LFXP2-8E-6FT256I delivers a practical balance of logic capacity, embedded memory and flexible I/O in a flash-configured FPGA suited to industrial temperature environments. Its flexiFLASH non-volatile architecture, secure live-update features, and DSP-capable resources make it appropriate for designs that require instant-on behavior, in-field reconfiguration, and real-time processing.

Engineers designing systems that need mid-range logic density, secure firmware management, and a compact ftBGA footprint will find this device supports scalable implementations while leveraging family-level IP and system features for faster development cycles.

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