LFXP2-8E-5TN144C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 100 226304 8000 144-LQFP |
|---|---|
| Quantity | 366 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFXP2-8E-5TN144C – XP2 Field Programmable Gate Array (FPGA)
The LFXP2-8E-5TN144C is a commercial-grade LatticeXP2 family FPGA in a 144-pin LQFP package. It combines a LUT-based FPGA fabric with on-chip non-volatile flash architecture to provide instant-on, reconfigurable logic for embedded digital designs. Typical use cases include control, interface bridging, signal processing, and display or memory interface functions where moderate logic density, embedded RAM, and flexible I/O are required.
Key Features
- Core Logic — Approximately 8,000 logic elements supporting designs that require mid-range LUT capacity.
- Embedded Memory — Approximately 226,304 bits of on-chip RAM to support data buffering, state storage and small SRAM-based functions.
- Configurable I/O — Up to 100 user I/Os with flexible buffer standards for a wide range of digital interfaces; surface-mount package simplifies board integration.
- Flash-based Architecture (flexiFLASH) — Instant-on, infinitely reconfigurable single-chip flash architecture with on-chip FlashBAK memory and serial tag support for design security and non-volatile configuration.
- Live Update and Security — Family-level Live Update capabilities with secure update mechanisms including 128-bit AES encryption and dual-boot support (as documented for LatticeXP2 family).
- sysDSP and Multipliers — Family support for dedicated DSP resources and hardware multipliers to accelerate multiply-accumulate workloads (as provided by the LatticeXP2 family).
- Clocking — On-chip PLL resources for clock multiply/divide and phase shifting to meet system timing requirements.
- Power and Operating Range — Operates from a 1.14 V to 1.26 V supply with an ambient operating temperature range of 0 °C to 85 °C (commercial grade).
- Package and Mounting — 144-LQFP package (supplier device package listed as 144-TQFP, 20 × 20 mm) designed for surface-mount assembly.
- RoHS Compliant — Manufactured in compliance with RoHS environmental requirements.
Typical Applications
- Embedded Control and Glue Logic — Implement custom control state machines, bus bridging and peripheral interfacing using available logic elements and I/Os.
- Signal Processing — Leverage family DSP resources and on-chip multipliers for moderate-performance filtering, aggregation or data manipulation tasks.
- Memory and Display Interfaces — Use the flexible I/O and pre-engineered source-synchronous interfaces documented for the LatticeXP2 family to implement DDR/DDR2 or multi-lane LVDS links.
- Prototyping and Reconfigurable Systems — Flash-based configuration enables instant-on prototypes and field-reconfigurable products with secure update capability.
Unique Advantages
- Instant-on non-volatile configuration: Flash-based flexiFLASH architecture removes the need for external configuration memory for immediate startup.
- Secure and maintainable firmware: Live Update and AES-based secure update mechanisms reduce risk when deploying field firmware updates.
- Balanced integration: Mid-range logic capacity, substantial on-chip RAM and dedicated DSP resources provide a compact solution that reduces external component count.
- Flexible I/O and clocking: Comprehensive I/O buffer options and on-chip PLLs allow adaptation to diverse interface and timing requirements without additional chips.
- Commercial-grade operating envelope: Designed for 0 °C to 85 °C environments with a defined supply voltage window for predictable system behavior.
Why Choose LFXP2-8E-5TN144C?
The LFXP2-8E-5TN144C delivers a practical balance of logic density, embedded memory and DSP capabilities within a 144-pin surface-mount package, backed by the LatticeXP2 family feature set such as flash-based instant-on configuration and secure live update. It is well suited to designers who need a reconfigurable, mid-density FPGA for embedded control, interface bridging, and moderate signal-processing tasks in commercial applications.
With clear supply and thermal specifications and RoHS compliance, the device offers predictable integration into production systems and supports design longevity through field reconfiguration and secure firmware management.
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