LFXP2-8E-6FT256C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 201 226304 8000 256-LBGA |
|---|---|
| Quantity | 410 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 201 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFXP2-8E-6FT256C – XP2 Field Programmable Gate Array (FPGA) IC 201 226304 8000 256-LBGA
The LFXP2-8E-6FT256C is a commercial-grade XP2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides 8,000 logic elements, 201 user I/Os and approximately 226,304 bits of embedded memory in a compact 256-LBGA package.
Designed for low-voltage systems, the device operates from 1.14 V to 1.26 V and supports commercial operating temperatures from 0 °C to 85 °C. Its surface-mount 256-FTBGA (17×17) supplier package offers a small footprint for space-constrained designs.
Key Features
- Core Logic 8,000 logic elements to implement custom digital functions and combinational/sequential logic.
- Embedded Memory Approximately 226,304 bits of on-chip RAM to support buffering, state storage, and small data tables.
- I/O Capacity 201 user I/O pins for interfacing with external devices, sensors, and peripherals.
- Power Low-voltage supply range of 1.14 V to 1.26 V to align with low-voltage system architectures.
- Package and Mounting Surface-mount 256-LBGA package; supplier device package specified as 256-FTBGA (17×17) for compact board integration.
- Temperature and Grade Commercial-grade device rated for 0 °C to 85 °C operating temperature.
- Compliance RoHS-compliant material status for environmental regulatory alignment.
Typical Applications
- Custom Logic and Control Implement application-specific finite state machines, control logic and glue logic where mid-range logic capacity is required.
- Interface and I/O Expansion Use the 201 I/Os to consolidate and manage multiple external interfaces or to act as an I/O bridge.
- On-chip Data Buffering Leverage approximately 226,304 bits of embedded memory for buffering, small FIFOs, or lookup tables.
Unique Advantages
- Balanced Logic and Memory: 8,000 logic elements combined with ~226,304 bits of RAM provide a mid-range FPGA resource mix suitable for many embedded tasks.
- High I/O Count: 201 user I/Os enable versatile interfacing without external I/O expanders, reducing overall BOM complexity.
- Compact Package: 256-LBGA / 256-FTBGA (17×17) package allows dense PCB layouts and smaller form factors.
- Low-Voltage Operation: 1.14 V to 1.26 V supply range supports integration into modern low-voltage systems.
- Commercial Temperature Rating: Rated for 0 °C to 85 °C for general-purpose, commercial electronic products.
- RoHS-Compliant: Environmental compliance simplifies regulatory considerations for product design.
Why Choose LFXP2-8E-6FT256C?
The LFXP2-8E-6FT256C positions itself as a compact, commercial-grade FPGA option offering a balanced mix of logic capacity, embedded memory and high I/O density. Its low-voltage operation and surface-mount 256-LBGA package make it appropriate for space-constrained designs that require configurable logic and moderate on-chip memory.
This FPGA is suited to developers and product teams seeking a mid-range programmable device backed by Lattice Semiconductor’s family documentation and design resources. The device’s combination of resources and packaging supports scalable designs where board area, I/O count and on-chip RAM are primary considerations.
Request a quote or contact sales to get pricing, lead times and availability for the LFXP2-8E-6FT256C.

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