LFXP2-8E-5FTN256C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 201 226304 8000 256-LBGA |
|---|---|
| Quantity | 1,050 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 201 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFXP2-8E-5FTN256C – XP2 Field Programmable Gate Array (FPGA) IC 201 226304 8000 256-LBGA
The LFXP2-8E-5FTN256C is a commercial-grade FPGA from Lattice Semiconductor Corporation based on the LatticeXP2 family architecture. This device combines a flash-based configuration approach with an FPGA fabric to deliver instant-on reconfigurability and secure update capabilities for embedded designs.
With 8,000 logic elements, approximately 0.226 Mbits of on-chip RAM and 201 user I/Os in a compact 256-ball ftBGA package, the part targets compact, low-power embedded systems requiring flexible I/O interfaces, DSP resources and secure configuration management.
Key Features
- Core Logic 8,000 logic elements provide the programmable fabric for custom combinational and sequential logic implementation.
- Embedded Memory Approximately 0.226 Mbits of on-chip RAM (226,304 bits) for distributed and embedded storage of data and state.
- I/O Capacity and Flexibility 201 I/O pins support a wide range of external interfaces; the family supports flexible I/O standards and pre‑engineered source‑synchronous interfaces.
- DSP and Arithmetic Support Family sysDSP functionality and dedicated multipliers in the LatticeXP2 architecture enable high-performance multiply-accumulate operations for signal processing and control tasks.
- Non-volatile Configuration and Live Update The LatticeXP2 family’s flexiFLASH architecture provides instant-on, infinitely reconfigurable operation with FlashBAK and Live Update technologies including secure updates (128-bit AES) and dual-boot capability.
- Clocking and Timing On-chip PLL resources (up to four analog PLLs in the family) provide clock multiply/divide and phase-shifting capability for system timing and interface synchronization.
- Power Nominal supply range of 1.14 V to 1.26 V supports low-voltage system architectures.
- Package and Mounting 256-ball ftBGA (17 × 17 mm) surface-mount package delivers a compact footprint for space-constrained designs.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation to suit standard commercial and embedded environments.
- Regulatory RoHS compliant for simplified environmental compliance.
Typical Applications
- Display and Imaging Interfaces Supports pre‑engineered LVDS display interfaces and multi-lane source-synchronous links used in display controllers and flat-panel integration.
- Memory Interface and Buffering Implements DDR/DDR2 source-synchronous interfaces (up to family-supported rates) for local buffering and memory bridging in embedded systems.
- Embedded Networking and Protocol Bridging Flexible I/O and timing resources enable protocol conversions and MAC/PHY interfacing including XGMII-class connections.
- Signal Processing and Control sysDSP blocks and dedicated multipliers accelerate multiply-accumulate workloads for motor control, sensor preprocessing and real-time data conditioning.
Unique Advantages
- Instant-on, reconfigurable architecture: The flexiFLASH-based design enables immediate boot and infinite reconfiguration without external volatile configuration memories.
- Secure update capability: Live Update features including 128-bit AES encryption and dual-boot support simplify secure field updates and rollback strategies.
- Balanced integration: Combines 8,000 logic elements, on-chip RAM and DSP resources with 201 I/Os in a compact 256-LBGA package to reduce board area and BOM complexity.
- Low-voltage operation: 1.14–1.26 V supply range aligns with modern low-voltage system rails for power-efficient designs.
- Commercial-ready temperature range: 0 °C to 85 °C rating fits a broad class of embedded and consumer applications.
- Environmental compliance: RoHS status simplifies regulatory alignment for global product deployment.
Why Choose LFXP2-8E-5FTN256C?
The LFXP2-8E-5FTN256C positions itself as a compact, flash-configured FPGA option for designers who need immediate boot capability, secure field updates and a balanced mix of logic, memory and DSP resources. Its 201 I/Os and ftBGA package make it suitable where board space and flexible interfacing are critical.
This device is well suited to engineering teams building commercial embedded systems, display and memory interface solutions, and protocol bridging or signal processing functions that benefit from on-chip non-volatile configuration and hardware-accelerated arithmetic resources. The LatticeXP2 family ecosystem and feature set support scalable development and secure in-field maintenance.
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