LFXP2-8E-5FT256C

The LFXP2-8E-5FT256C is a commercial-grade FPGA from the LatticeXP2 family that combines a LUT-based FPGA fabric with on-chip Flash configuration in a flexiFLASH architecture. It targets commercial embedded systems and interface/display applications that require instant-on reconfigurability, a compact footprint, and flexible I/O.

With 8,000 logic elements, 201 I/O pins, and approximately 0.226 Mbits of on-chip RAM, this device delivers a balanced mix of logic, memory and DSP capability in a 256-ball ftBGA (17 × 17 mm) package for space-efficient system designs.

Key Features

• Core architecture – flexiFLASH  Non-volatile flash-based configuration with instant-on operation and infinitely reconfigurable design storage as described for the LatticeXP2 family.
• Logic capacity  8,000 logic elements suitable for mid-density control, glue logic, and interface applications.
• On-chip memory  Approximately 0.226 Mbits of total on-chip RAM (226,304 bits) for embedded storage and buffering.
• sysDSP and multipliers  Family capability includes dedicated sysDSP resources; the XP2-8 tier provides sysDSP blocks and 18×18 multipliers for arithmetic and signal-processing tasks.
• I/O flexibility  Up to 201 I/O pins in the 256-ball ftBGA package. The LatticeXP2 family supports a broad set of I/O standards for source-synchronous and high-speed interfaces.
• Clock management  General-purpose PLL resources appropriate for clock multiply/divide and phase shifting; XP2-8 devices include multiple PLLs as part of the family feature set.
• Power and operating range  Core supply voltage range 1.14 V to 1.26 V and commercial operating temperature 0 °C to 85 °C.
• Package & mounting  256-LBGA (supplier package: 256-FTBGA, 17×17 mm), surface-mount package optimized for compact board layouts.
• Compliance  RoHS compliant.
• Secure and field-update capable  Family-level Live Update technologies and secure update mechanisms are part of the LatticeXP2 feature set for protected configuration management.

Typical Applications

• Display and video interfaces  Source-synchronous and LVDS-capable I/O and PLL support make the device suitable for display timing, interface conversion, and panel drive functions.
• Embedded control and glue logic  Mid-density logic capacity and flexible I/O are well suited for board-level control, peripheral interfacing, and system glue logic in commercial products.
• Signal processing and hardware acceleration  sysDSP resources and dedicated multipliers support arithmetic-intensive functions such as filtering, preprocessing, and algorithm acceleration.
• Memory interface bridging  Pre-engineered source-synchronous interfaces and on-chip clocking facilitate DDR/DDR2 interface support at the family level for memory subsystems.

Unique Advantages

• Instant-on, non-volatile configuration:  flexiFLASH architecture stores configuration on-chip for immediate startup without external configuration flash.
• Balanced logic and memory:  8,000 logic elements and approximately 0.226 Mbits of on-chip RAM provide an efficient combination for mid-density designs.
• Broad I/O in a compact package:  201 available I/Os in a 256-ball ftBGA package reduce board area while supporting complex multi‑signal interfaces.
• Field-update capability:  Family-level Live Update and secure update technologies enable in-system reconfiguration and protected firmware updates.
• Commercial temperature suitability:  Rated for 0 °C to 85 °C, matching common commercial product requirements.
• RoHS compliant:  Supports regulatory requirements for lead-free and environmentally conscious designs.

Why Choose LFXP2-8E-5FT256C?

The LFXP2-8E-5FT256C positions itself as a compact, commercial-grade FPGA option for designers who need instant-on, reconfigurable logic with a balance of DSP, memory and I/O resources. Its flexiFLASH architecture and family-level update/security features enable flexible product lifecycles and in-field revisions without adding external configuration complexity.

This part is well suited to commercial embedded applications that require moderate logic density, a high number of I/Os in a small package, and dedicated arithmetic resources for signal processing. Its combination of on-chip non-volatile configuration, DSP capability, and flexible I/O options offers a practical route to reduce BOM and simplify system architecture within the defined operating voltage and temperature range.

If you need pricing, availability, or technical details specific to your design, request a quote or submit an inquiry to receive a prompt response.