LFXP2-8E-5FT256I

The LFXP2-8E-5FT256I is an XP2 Field Programmable Gate Array (FPGA) IC by Lattice Semiconductor Corporation. It delivers mid-range programmable logic capacity with a combination of logic elements, on-chip memory, and a high I/O count in a compact 256‑LBGA package.

Key attributes include approximately 8,000 logic elements, roughly 226,304 bits of embedded RAM, 201 I/O pins, industrial-grade operation from −40 °C to 100 °C, and low-voltage operation across 1.14 V to 1.26 V—providing designers with dense logic, memory resources, and robust temperature tolerance.

Key Features

• Logic Capacity  Approximately 8,000 logic elements for implementing combinational and sequential logic functions and custom glue logic.
• Embedded Memory  Around 226,304 bits of on-chip RAM to support buffering, state storage, and small lookup tables directly inside the FPGA fabric.
• I/O Density  201 I/O pins to support multiple peripheral interfaces, parallel buses, and mixed-signal front-end connections when used with external components.
• Power and Voltage  Operates from 1.14 V to 1.26 V, enabling use in low-voltage power domains and modern system architectures.
• Package and Mounting  256‑LBGA (supplier package: 256‑FTBGA, 17×17) in a surface‑mount form factor for high-density PCB layouts.
• Industrial Temperature Range  Rated for −40 °C to 100 °C, suitable for applications that require broader thermal tolerance.
• Environmental Compliance  RoHS compliant for alignment with lead‑free manufacturing requirements.

Typical Applications

• Industrial Control Systems  Custom logic, I/O aggregation, and real‑time control functions benefiting from the device’s industrial temperature rating and 201 I/O pins.
• Communication and Interface Bridging  Protocol conversion, bus interfacing, and glue logic where multiple I/O and embedded RAM are needed to buffer and route data.
• Embedded Prototyping and Custom Logic  Development of mid‑density programmable logic for proof‑of‑concept designs and small production runs leveraging 8,000 logic elements and on‑chip memory.

Unique Advantages

• Balanced Logic and Memory  Combines approximately 8,000 logic elements with roughly 226,304 bits of embedded RAM to support both control logic and modest on‑chip storage needs.
• High I/O Count  201 I/O pins reduce the need for external multiplexers and simplify interfacing to sensors, peripherals, and external memory.
• Low‑Voltage Operation  Nominal supply range of 1.14 V to 1.26 V aligns with low‑power system domains and newer power rails.
• Compact Surface‑Mount Package  256‑LBGA (17×17 FTBGA footprint) supports high‑density PCB designs while maintaining accessible I/O.
• Industrial Reliability  Rated for −40 °C to 100 °C and RoHS compliant for deployment in temperature‑challenging environments and lead‑free manufacturing flows.

Why Choose LFXP2-8E-5FT256I?

The LFXP2-8E-5FT256I positions itself as a practical mid‑density FPGA option for engineers seeking a compact, industrial‑rated programmable device. Its combination of approximately 8,000 logic elements, significant on‑chip RAM, and a 201‑pin I/O count offers a balanced platform for custom logic, interface bridging, and embedded prototyping.

Produced by Lattice Semiconductor Corporation, this device is suited for designs that require reliable operation across a wide temperature range, low‑voltage compatibility, and a surface‑mount 256‑LBGA footprint—delivering scalability and integration for production and development projects.

Request a quote or submit an inquiry to obtain pricing and availability for LFXP2-8E-5FT256I and to discuss how this FPGA can fit your next design.