LFXP2-5E-7TN144C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 100 169984 5000 144-LQFP |
|---|---|
| Quantity | 657 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 625 | Number of Logic Elements/Cells | 5000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 169984 |
Overview of LFXP2-5E-7TN144C – XP2 FPGA — 5,000 logic elements, 100 I/O, 144‑LQFP
The LFXP2-5E-7TN144C is a commercial-grade member of the LatticeXP2 family of flash-based FPGAs. It pairs approximately 5,000 logic elements with roughly 169,984 bits of on-chip RAM and up to 100 I/O in a 144‑pin LQFP (20 × 20 mm) surface-mount package.
Designed for applications requiring instant-on configuration, live updates and flexible I/O, this XP2 device delivers a compact, low-voltage (1.14–1.26 V) programmable solution for embedded control, interface bridging and signal-processing tasks within the 0 °C to 85 °C operating range.
Key Features
- flexiFLASH™ architecture — Non-volatile single-chip flash architecture supporting instant-on, infinite reconfiguration and on-chip FlashBAK embedded block memory for persistent configuration.
- Live Update and security — Live Update technology with TransFR™, dual-boot support and secure updates using 128‑bit AES encryption for protected field upgrades.
- Logic and on-chip memory — Approximately 5,000 logic elements and about 169,984 bits of embedded RAM to implement control, glue logic and moderate buffering on-chip.
- sysDSP blocks and multipliers — Family-level sysDSP resources are available; the XP2-5 device class provides three sysDSP blocks and up to twelve 18×18 multipliers for efficient multiply‑accumulate operations.
- Flexible I/O and interface support — sysIO buffer family support for multiple standards and pre‑engineered source-synchronous interfaces, including DDR/DDR2 memory interfaces and multi-lane LVDS options (as provided by the LatticeXP2 family).
- Clocking — Up to two analog PLLs in the XP2-5 family for clock multiplication, division and phase shifting (family-level capability).
- Package and mounting — 144‑LQFP (144‑TQFP 20×20) surface-mount package offering 100 accessible I/O in a compact footprint.
- Low-voltage operation and compliance — Operates from 1.14 V to 1.26 V and is RoHS compliant; commercial temperature grade (0 °C to 85 °C).
Typical Applications
- Interface bridging and protocol conversion — Use the XP2's flexible I/O and source-synchronous interfaces to implement DDR interfaces, LVDS lanes or custom protocol bridging in compact systems.
- Embedded control and glue logic — 5,000 logic elements and on-chip RAM enable integration of control functions, peripheral aggregation and board-level logic consolidation.
- Signal processing and DSP acceleration — sysDSP blocks and 18×18 multipliers support multiply-accumulate tasks for filtering, simple DSP kernels or sensor data conditioning.
- Display and video interfaces — Family support for multi-lane LVDS and 7:1 LVDS interfaces makes XP2 suitable for display interface handling and related timing/control logic.
Unique Advantages
- Instant-on, non-volatile configuration: flexiFLASH architecture provides single-chip, flash-based configuration for immediate startup without external configuration memory.
- Field update security: Live Update with TransFR and 128‑bit AES encryption enables secure, reliable firmware updates and dual-boot capabilities.
- Compact, high-function density: 5,000 logic elements, approx. 169,984 bits of on-chip RAM and 100 I/O in a 144‑LQFP package reduce board area and BOM complexity.
- Low-voltage operation: Narrow supply range (1.14–1.26 V) aligns with modern low-voltage systems and simplifies power rail design.
- Commercial temperature and compliance: Rated for 0 °C to 85 °C and RoHS compliant for mainstream embedded and consumer applications.
Why Choose LFXP2-5E-7TN144C?
The LFXP2-5E-7TN144C brings LatticeXP2 family capabilities—flash-based instant-on configuration, live update security and dedicated DSP resources—into a compact 144‑LQFP footprint. Its combination of roughly 5,000 logic elements, on-chip RAM and 100 I/O makes it suitable for designers who need a low-voltage, reconfigurable device for interface logic, embedded control or moderate DSP tasks in commercial-temperature systems.
As part of the LatticeXP2 family, this device benefits from family-level features such as sysDSP blocks, flexible I/O standards and PLL-based clocking, providing a clear upgrade path and ecosystem support for evolving designs.
Request a quote or submit an inquiry to receive pricing and availability for the LFXP2-5E-7TN144C.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016