LFXP2-5E-7FTN256C

The LFXP2-5E-7FTN256C is a LatticeXP2 family field programmable gate array (FPGA) combining a LUT-based FPGA fabric with non-volatile flash in a flexiFLASH architecture. This commercial-grade, surface-mount device delivers 5,000 logic elements, 172 I/Os and approximately 169,984 bits of on-chip RAM for embedded logic, interface bridging and display/memory interface applications.

Built for systems that require instant-on configuration, secure updates and integrated DSP and memory resources, the device is suited to applications where compact footprint, flexible I/O and reconfigurability are required. It operates from a 1.14 V to 1.26 V supply and supports standard commercial temperature operation (0 °C to 85 °C).

Key Features

• flexiFLASH architecture — Instant-on, infinitely reconfigurable single-chip architecture with FlashBAK and Serial TAG memory to store configuration and provide design security.
• Live Update and security — TransFR live update support with secure updates using 128‑bit AES encryption and dual-boot capability with external SPI.
• Logic resources — 5,000 logic elements to implement mid-density FPGA designs.
• Embedded memory — Approximately 169,984 bits of on-chip RAM for embedded and distributed storage to support control and buffering functions.
• sysDSP and multipliers — Family-level sysDSP blocks and dedicated multipliers for high-performance multiply-accumulate operations (series documentation lists sysDSP blocks and 18×18 multiplier resources for XP2 devices).
• Clocking — On-chip PLL resources for clock multiplication, division and phase shifting (family documentation indicates device-level PLL support).
• Flexible I/O — 172 I/Os with broad I/O standards supported by the family (includes LVDS and source-synchronous interfaces suitable for display and high-speed links as described in the series documentation).
• Memory and interface support — Pre-engineered source-synchronous interfaces including DDR/DDR2 support up to 200 MHz and 7:1 LVDS for display applications (per family documentation).
• Package and mounting — 256-ball LBGA (supplier designation 256-FTBGA, 17 × 17 mm) in a surface-mount package for compact board integration.
• Commercial temperature and supply — Rated for 0 °C to 85 °C operation with a supply range of 1.14 V to 1.26 V (nominal 1.2 V).
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• Display and video interfaces — Use the device’s LVDS and pre-engineered 7:1 interfaces to implement display bridging, timing control and video interface logic.
• Memory interface controllers — Implement DDR/DDR2 interfacing and buffering logic, leveraging the device’s source-synchronous support and on-chip memory.
• Embedded control and signal processing — Leverage the logic resources, sysDSP blocks and multiplier arrays for motor control, sensor preprocessing and other embedded DSP tasks.
• Secure field upgrades — Use TransFR live update and 128‑bit AES encryption for secure remote firmware updates and dual-boot image deployment.

Unique Advantages

• Instant-on non-volatile configuration: flexiFLASH architecture provides immediate FPGA functionality after power-up without external configuration flash.
• Integrated security and update path: Built-in secure update mechanisms (128‑bit AES, TransFR, dual-boot) simplify firmware management and increase system robustness.
• Balanced mid-range integration: 5,000 logic elements with substantial on-chip RAM and DSP resources reduce external components and simplify board-level design.
• Compact package: 256-LBGA (17 × 17 mm) surface-mount package offers a small footprint for space-constrained designs.
• Flexible I/O and memory interfaces: Broad I/O capabilities and pre-engineered DDR/DDR2 and LVDS interfaces accelerate time-to-market for high-speed link and display applications.
• Commercial temperature operation: Rated 0 °C to 85 °C for mainstream embedded and consumer applications.

Why Choose LFXP2-5E-7FTN256C?

The LFXP2-5E-7FTN256C positions itself as a compact, flash-based FPGA option for mid-density designs that require instant-on configuration, secure update paths and integrated DSP/memory resources. With 5,000 logic elements, approximately 169,984 bits of embedded RAM, 172 I/Os and a 256-LBGA footprint, it offers a balanced mix of integration and I/O capability for embedded control, interface bridging, display and memory interface applications.

Designed for teams that need reconfigurability with built-in security and a compact package, this device benefits from the LatticeXP2 family architecture and system-level features documented for the series.

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