LFXP2-5E-6QN208I

IC FPGA 146 I/O 208QFP
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 146 169984 5000 208-BFQFP

Quantity 605 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O146Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs625Number of Logic Elements/Cells5000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits169984

Overview of LFXP2-5E-6QN208I – XP2 Field Programmable Gate Array (FPGA) IC 146 169984 5000 208-BFQFP

The LFXP2-5E-6QN208I is a LatticeXP2 family FPGA in a 208-pin PQFP/BFQFP surface-mount package, combining flash-based configuration with a LUT-based FPGA fabric. This device targets industrial embedded designs requiring instant-on reconfigurability, a mid-range logic capacity, and flexible I/O integration.

Key device attributes include approximately 5,000 logic elements, 625 CLBs, roughly 170 Kbits of on-chip RAM, and 146 user I/Os, operating from 1.14 V to 1.26 V and specified for -40 °C to 100 °C. It is RoHS compliant and supplied in a 208‑pin (28 × 28 mm) package.

Key Features

  • flexiFLASH™ architecture  Instant-on, infinitely reconfigurable flash-based configuration with on-chip FlashBAK memory and Serial TAG support for secure, non-volatile storage of configuration data.
  • Live Update technologies  TransFR™ live-update support with secure update capability and 128-bit AES encryption; dual-boot with external SPI supported at the family level.
  • Logic and routing  Approximately 5,000 logic elements and 625 CLBs provide mid-range LUT-based FPGA capacity suitable for control, protocol bridging, and interface logic.
  • Embedded memory  Approximately 169,984 bits (≈170 Kbits) of combined embedded and distributed RAM for buffering, small data tables, and local storage.
  • sysDSP™ blocks and multipliers  Family-level sysDSP blocks are available for efficient multiply–accumulate operations; the XP2-5 devices use 3 sysDSP blocks and include 12 18×18 multipliers.
  • Clocking  On-chip PLL resources at the family level—XP2-5 devices provide up to two PLLs—for clock multiplication, division, and phase shifting.
  • Flexible I/O  146 user I/Os supporting a broad range of interface standards at the family level, enabling parallel, serial, and source-synchronous interfaces.
  • Power and operating range  Core supply range 1.14 V to 1.26 V and industrial operating temperature from -40 °C to 100 °C for use in demanding ambient conditions.
  • Package and mounting  208-pin PQFP/BFQFP (28 × 28 mm) surface-mount package suitable for standard PCB assembly processes; RoHS compliant.

Typical Applications

  • Industrial control and automation  Use for control logic, protocol bridging, and local processing where reconfigurable hardware and industrial temperature range are required.
  • Signal processing and motor control  sysDSP blocks and on-chip multipliers support multiply–accumulate operations useful for control loops and basic signal processing tasks.
  • Communications and protocol bridging  Flexible I/O and embedded memory enable implementation of custom interfaces, protocol conversion, and buffering in embedded communication modules.
  • Display and user interface controllers  Parallel and source-synchronous interface support at the family level suits display timing, LVDS links, and UI peripheral interfacing.

Unique Advantages

  • Non-volatile, instant-on configuration: flash-based flexiFLASH architecture eliminates external configuration memory for faster system startup and field reconfiguration.
  • Secure field updates: TransFR live-update capability with 128-bit AES encryption at the family level enables secure remote updates and dual-boot image strategies.
  • Balanced mid-range capacity: approximately 5,000 logic elements and ~170 Kbits of on-chip RAM provide a compact FPGA solution for moderate complexity designs.
  • Dedicated DSP resources: integrated sysDSP blocks and 18×18 multipliers support arithmetic-heavy tasks without consuming general-purpose LUT resources.
  • Industrial temperature rating: specified operation from -40 °C to 100 °C for deployment in temperature-challenging environments.
  • High I/O integration: 146 user I/Os in a 208-pin package reduce external glue logic and help simplify PCB routing for multi-interface designs.

Why Choose LFXP2-5E-6QN208I?

The LFXP2-5E-6QN208I positions itself as a mid-density, industrial-grade FPGA that combines non-volatile flash configuration with practical DSP and memory resources. Its mix of approximately 5,000 logic elements, roughly 170 Kbits of embedded RAM, dedicated sysDSP blocks, and 146 I/Os makes it well suited for embedded applications requiring reliable instant-on behavior, secure updates, and moderate compute capability.

Designed for engineers building industrial control, communication, and interface-focused systems, this device offers a compact package, broad I/O count, and family-level features—such as flash-based configuration and secure live updates—that support scalable designs and long-term field maintenance.

Request a quote or submit a request for pricing and availability for LFXP2-5E-6QN208I to evaluate this FPGA for your next embedded design.

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