LFXP2-5E-6QN208I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 146 169984 5000 208-BFQFP |
|---|---|
| Quantity | 605 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 146 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 625 | Number of Logic Elements/Cells | 5000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 169984 |
Overview of LFXP2-5E-6QN208I – XP2 Field Programmable Gate Array (FPGA) IC 146 169984 5000 208-BFQFP
The LFXP2-5E-6QN208I is a LatticeXP2 family FPGA in a 208-pin PQFP/BFQFP surface-mount package, combining flash-based configuration with a LUT-based FPGA fabric. This device targets industrial embedded designs requiring instant-on reconfigurability, a mid-range logic capacity, and flexible I/O integration.
Key device attributes include approximately 5,000 logic elements, 625 CLBs, roughly 170 Kbits of on-chip RAM, and 146 user I/Os, operating from 1.14 V to 1.26 V and specified for -40 °C to 100 °C. It is RoHS compliant and supplied in a 208‑pin (28 × 28 mm) package.
Key Features
- flexiFLASH™ architecture Instant-on, infinitely reconfigurable flash-based configuration with on-chip FlashBAK memory and Serial TAG support for secure, non-volatile storage of configuration data.
- Live Update technologies TransFR™ live-update support with secure update capability and 128-bit AES encryption; dual-boot with external SPI supported at the family level.
- Logic and routing Approximately 5,000 logic elements and 625 CLBs provide mid-range LUT-based FPGA capacity suitable for control, protocol bridging, and interface logic.
- Embedded memory Approximately 169,984 bits (≈170 Kbits) of combined embedded and distributed RAM for buffering, small data tables, and local storage.
- sysDSP™ blocks and multipliers Family-level sysDSP blocks are available for efficient multiply–accumulate operations; the XP2-5 devices use 3 sysDSP blocks and include 12 18×18 multipliers.
- Clocking On-chip PLL resources at the family level—XP2-5 devices provide up to two PLLs—for clock multiplication, division, and phase shifting.
- Flexible I/O 146 user I/Os supporting a broad range of interface standards at the family level, enabling parallel, serial, and source-synchronous interfaces.
- Power and operating range Core supply range 1.14 V to 1.26 V and industrial operating temperature from -40 °C to 100 °C for use in demanding ambient conditions.
- Package and mounting 208-pin PQFP/BFQFP (28 × 28 mm) surface-mount package suitable for standard PCB assembly processes; RoHS compliant.
Typical Applications
- Industrial control and automation Use for control logic, protocol bridging, and local processing where reconfigurable hardware and industrial temperature range are required.
- Signal processing and motor control sysDSP blocks and on-chip multipliers support multiply–accumulate operations useful for control loops and basic signal processing tasks.
- Communications and protocol bridging Flexible I/O and embedded memory enable implementation of custom interfaces, protocol conversion, and buffering in embedded communication modules.
- Display and user interface controllers Parallel and source-synchronous interface support at the family level suits display timing, LVDS links, and UI peripheral interfacing.
Unique Advantages
- Non-volatile, instant-on configuration: flash-based flexiFLASH architecture eliminates external configuration memory for faster system startup and field reconfiguration.
- Secure field updates: TransFR live-update capability with 128-bit AES encryption at the family level enables secure remote updates and dual-boot image strategies.
- Balanced mid-range capacity: approximately 5,000 logic elements and ~170 Kbits of on-chip RAM provide a compact FPGA solution for moderate complexity designs.
- Dedicated DSP resources: integrated sysDSP blocks and 18×18 multipliers support arithmetic-heavy tasks without consuming general-purpose LUT resources.
- Industrial temperature rating: specified operation from -40 °C to 100 °C for deployment in temperature-challenging environments.
- High I/O integration: 146 user I/Os in a 208-pin package reduce external glue logic and help simplify PCB routing for multi-interface designs.
Why Choose LFXP2-5E-6QN208I?
The LFXP2-5E-6QN208I positions itself as a mid-density, industrial-grade FPGA that combines non-volatile flash configuration with practical DSP and memory resources. Its mix of approximately 5,000 logic elements, roughly 170 Kbits of embedded RAM, dedicated sysDSP blocks, and 146 I/Os makes it well suited for embedded applications requiring reliable instant-on behavior, secure updates, and moderate compute capability.
Designed for engineers building industrial control, communication, and interface-focused systems, this device offers a compact package, broad I/O count, and family-level features—such as flash-based configuration and secure live updates—that support scalable designs and long-term field maintenance.
Request a quote or submit a request for pricing and availability for LFXP2-5E-6QN208I to evaluate this FPGA for your next embedded design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016