LFXP2-5E-6MN132I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 86 169984 5000 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 96 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSBGA (8x8) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 86 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 625 | Number of Logic Elements/Cells | 5000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 169984 |
Overview of LFXP2-5E-6MN132I – XP2 Field Programmable Gate Array (FPGA) IC 86 169984 5000 132-LFBGA, CSPBGA
The LFXP2-5E-6MN132I is a Lattice XP2 family FPGA in a 132-ball csBGA package, offering a flash-based, instant-on FPGA architecture for industrial applications. It combines approximately 5,000 logic elements with embedded and distributed memory, flexible I/O and on-chip system features to support source-synchronous interfaces, display connectivity and embedded control functions.
Key Features
- flexiFLASH architecture Instant-on, single-chip flash-based configuration with on-chip FlashBAK and serial TAG memory for design security and infinite reconfigurability.
- Live Update and Security TransFR live-update capability with support for secure updates using 128-bit AES encryption and dual-boot with external SPI.
- Logic and DSP resources Approximately 5,000 logic elements and sysDSP resources suitable for multiply-accumulate operations and arithmetic acceleration.
- On-chip memory Total on-chip RAM of 169,984 bits (approximately 170 Kbits) combining embedded block RAM and distributed RAM for control and buffering tasks.
- Clocking Device-level PLL support consistent with the XP2-5 family (two PLLs) for clock multiplication, division and phase shifting.
- Flexible I/O buffer support I/O buffer options in the XP2 family include LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and other differential standards to support a broad range of interfaces.
- Pre-engineered interfaces Family-level support for source-synchronous interfaces such as DDR/DDR2 memory interfaces and multi-lane LVDS links useful for display and high-speed data paths.
- Package and I/O 132-ball csBGA (8 × 8 mm) package with 86 user I/Os; surface-mount package suitable for compact board designs.
- Power and temperature Operates around a 1.2 V supply with a specified voltage range of 1.14 V to 1.26 V and an industrial operating temperature range of −40 °C to 100 °C.
- Compliance RoHS-compliant for environmental and manufacturing requirements.
Typical Applications
- Display and video interfaces Use the device’s LVDS and multi-lane source-synchronous support for display controllers, video bridging and timing-critical interfaces.
- Memory interface bridging Implement DDR/DDR2 interface logic and memory controllers using the device’s pre-engineered source-synchronous building blocks.
- Embedded control and industrial automation Leverage flash-based instant-on and reconfigurability for industrial control, motor drives and sensor aggregation within the specified −40 °C to 100 °C range.
- Secure field updates Enable secure firmware and configuration updates with AES-encrypted TransFR live-update and dual-boot capability for in-system reconfiguration.
Unique Advantages
- Instant-on, single-chip solution: Flash-based flexiFLASH architecture delivers immediate start-up and on-chip non-volatile configuration without external volatile configuration memory.
- Secure in-field updates: TransFR live-update with 128-bit AES encryption and dual-boot support reduces risk during firmware updates and enables controlled rollbacks.
- Compact package with ample I/O: 132-ball csBGA (8×8 mm) footprint provides 86 I/Os for space-constrained designs that still require significant external connectivity.
- Low-voltage operation: Designed for a nominal 1.2 V supply (operating range 1.14 V–1.26 V), enabling compatibility with modern low-voltage systems.
- Industrial temperature range: Rated from −40 °C to 100 °C to meet the thermal demands of industrial deployments.
- Verified family-level IP and tools: XP2 family support for pre-engineered interfaces and Lattice design tools helps accelerate development and migration within the family.
Why Choose LFXP2-5E-6MN132I?
The LFXP2-5E-6MN132I delivers a practical combination of non-volatile, flash-based configuration, roughly 5,000 logic elements, and approximately 170 Kbits of on-chip RAM in a compact 132-ball csBGA package. Its secure Live Update capabilities and flexible I/O support make it well suited to industrial control, display interfacing and embedded system designs that require instant-on behavior and in-field reconfigurability.
This part is positioned for engineers and procurement seeking a reliable, flash-configured FPGA with industrial temperature capability, modest logic density and ready support for source-synchronous and high-speed I/O interfaces within a small footprint.
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