LFXP2-5E-6M132C

IC FPGA 86 I/O 132CSBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 86 169984 5000 132-LFBGA, CSPBGA

Quantity 76 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-CSBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O86Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs625Number of Logic Elements/Cells5000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits169984

Overview of LFXP2-5E-6M132C – XP2 Field Programmable Gate Array (FPGA) IC

The LFXP2-5E-6M132C is a compact, flash-based XP2 FPGA featuring the flexiFLASH architecture and integrated system features drawn from the LatticeXP2 family. This device combines approximately 5,000 logic elements, on-chip reconfigurable memory, DSP resources and flexible I/O in a 132-ball csBGA package for space-constrained applications.

Designed for commercial-grade embedded designs, the part targets applications that require instant-on non-volatile configuration, secure field updates and compact package integration while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C temperature window.

Key Features

  • Core Architecture flexiFLASH architecture with instant-on and infinitely reconfigurable single-chip flash-based configuration.
  • Logic Capacity Approximately 5,000 logic elements suitable for small-to-mid complexity FPGA implementations.
  • On-chip Memory Approximately 169,984 bits of total on-chip RAM for embedded storage and buffering.
  • sysDSP and Multipliers sysDSP resources consistent with the XP2-5 family, including dedicated multiply-accumulate capability and multiple 18×18 multipliers for DSP workloads.
  • Flexible I/O 86 I/Os in the 132-LFBGA (csBGA) package with family-supported I/O standards for LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS.
  • Secure Live Update Live Update technologies including TransFR and secure update support with 128-bit AES encryption plus dual-boot options with external SPI.
  • Clocks and PLLs On-chip PLL support for clock multiplication, division and phase shifting as provided in the LatticeXP2 family.
  • Power and Temperature Low-voltage operation across 1.14 V to 1.26 V and rated for commercial operating temperatures from 0 °C to 85 °C.
  • Package and Mounting 132-LFBGA (csBGA) surface-mount package, supplier device package 132-CSBGA (8×8 mm), offering a compact footprint with 86 available I/Os.
  • Regulatory RoHS compliant for environmental and supply-chain requirements.
  • Design Ecosystem Supported by the LatticeXP2 family tooling and Lattice Diamond design software for synthesis, place-and-route and timing verification.

Typical Applications

  • Display interfaces Support for 7:1 LVDS interfaces and flexible I/O makes the device suitable for compact display controller and timing applications.
  • Memory interfacing and buffering Pre-engineered source-synchronous interfaces (e.g., DDR/DDR2 support in the family) enable integration as memory bridge or buffering logic in systems.
  • Embedded signal processing sysDSP blocks and multiple 18×18 multipliers provide targeted acceleration for multiply-accumulate workloads and real-time processing.
  • Secure field-updatable systems Built-in Live Update technologies and AES-based secure update support for systems requiring encrypted remote upgrades and dual-boot capability.

Unique Advantages

  • Instant-on, non-volatile configuration: flexiFLASH architecture provides single-chip flash configuration for immediate start-up without external bitstreams.
  • Secure field updates: TransFR live update and 128-bit AES encryption enable secure, reliable in-field firmware updates with dual-boot options.
  • Integrated DSP capability: Dedicated sysDSP resources and 18×18 multipliers reduce the need for external accelerators in signal-processing tasks.
  • Compact, I/O-rich package: 132-LFBGA csBGA package with 86 I/Os balances footprint and connectivity for space-constrained boards.
  • Low-voltage operation: Operation within a 1.14 V to 1.26 V range supports low-voltage system designs and nominal 1.2 V supply architectures.
  • Commercial-grade reliability: Rated for 0 °C to 85 °C operation to meet standard commercial embedded application requirements.

Why Choose LFXP2-5E-6M132C?

The LFXP2-5E-6M132C offers a balanced combination of non-volatile configuration, DSP resources and flexible I/O in a compact 132-ball csBGA package. Its approximately 5,000 logic elements, on-chip RAM and dedicated DSP multipliers make it well suited to embedded designs that need instant-on capability, secure firmware updates and modest signal-processing throughput.

Backed by the LatticeXP2 family architecture and supported by Lattice Diamond design software, this device provides a clear migration path within the XP2 family and practical tooling support for development and timing closure. It is a strong fit for designers seeking a compact, flash-based FPGA solution for commercial-grade embedded systems.

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