LFXP2-5E-6M132C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 86 169984 5000 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 76 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 86 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 625 | Number of Logic Elements/Cells | 5000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 169984 |
Overview of LFXP2-5E-6M132C – XP2 Field Programmable Gate Array (FPGA) IC
The LFXP2-5E-6M132C is a compact, flash-based XP2 FPGA featuring the flexiFLASH architecture and integrated system features drawn from the LatticeXP2 family. This device combines approximately 5,000 logic elements, on-chip reconfigurable memory, DSP resources and flexible I/O in a 132-ball csBGA package for space-constrained applications.
Designed for commercial-grade embedded designs, the part targets applications that require instant-on non-volatile configuration, secure field updates and compact package integration while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C temperature window.
Key Features
- Core Architecture flexiFLASH architecture with instant-on and infinitely reconfigurable single-chip flash-based configuration.
- Logic Capacity Approximately 5,000 logic elements suitable for small-to-mid complexity FPGA implementations.
- On-chip Memory Approximately 169,984 bits of total on-chip RAM for embedded storage and buffering.
- sysDSP and Multipliers sysDSP resources consistent with the XP2-5 family, including dedicated multiply-accumulate capability and multiple 18×18 multipliers for DSP workloads.
- Flexible I/O 86 I/Os in the 132-LFBGA (csBGA) package with family-supported I/O standards for LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS.
- Secure Live Update Live Update technologies including TransFR and secure update support with 128-bit AES encryption plus dual-boot options with external SPI.
- Clocks and PLLs On-chip PLL support for clock multiplication, division and phase shifting as provided in the LatticeXP2 family.
- Power and Temperature Low-voltage operation across 1.14 V to 1.26 V and rated for commercial operating temperatures from 0 °C to 85 °C.
- Package and Mounting 132-LFBGA (csBGA) surface-mount package, supplier device package 132-CSBGA (8×8 mm), offering a compact footprint with 86 available I/Os.
- Regulatory RoHS compliant for environmental and supply-chain requirements.
- Design Ecosystem Supported by the LatticeXP2 family tooling and Lattice Diamond design software for synthesis, place-and-route and timing verification.
Typical Applications
- Display interfaces Support for 7:1 LVDS interfaces and flexible I/O makes the device suitable for compact display controller and timing applications.
- Memory interfacing and buffering Pre-engineered source-synchronous interfaces (e.g., DDR/DDR2 support in the family) enable integration as memory bridge or buffering logic in systems.
- Embedded signal processing sysDSP blocks and multiple 18×18 multipliers provide targeted acceleration for multiply-accumulate workloads and real-time processing.
- Secure field-updatable systems Built-in Live Update technologies and AES-based secure update support for systems requiring encrypted remote upgrades and dual-boot capability.
Unique Advantages
- Instant-on, non-volatile configuration: flexiFLASH architecture provides single-chip flash configuration for immediate start-up without external bitstreams.
- Secure field updates: TransFR live update and 128-bit AES encryption enable secure, reliable in-field firmware updates with dual-boot options.
- Integrated DSP capability: Dedicated sysDSP resources and 18×18 multipliers reduce the need for external accelerators in signal-processing tasks.
- Compact, I/O-rich package: 132-LFBGA csBGA package with 86 I/Os balances footprint and connectivity for space-constrained boards.
- Low-voltage operation: Operation within a 1.14 V to 1.26 V range supports low-voltage system designs and nominal 1.2 V supply architectures.
- Commercial-grade reliability: Rated for 0 °C to 85 °C operation to meet standard commercial embedded application requirements.
Why Choose LFXP2-5E-6M132C?
The LFXP2-5E-6M132C offers a balanced combination of non-volatile configuration, DSP resources and flexible I/O in a compact 132-ball csBGA package. Its approximately 5,000 logic elements, on-chip RAM and dedicated DSP multipliers make it well suited to embedded designs that need instant-on capability, secure firmware updates and modest signal-processing throughput.
Backed by the LatticeXP2 family architecture and supported by Lattice Diamond design software, this device provides a clear migration path within the XP2 family and practical tooling support for development and timing closure. It is a strong fit for designers seeking a compact, flash-based FPGA solution for commercial-grade embedded systems.
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