LFXP2-5E-6FT256I

The LFXP2-5E-6FT256I is a LatticeXP2 family FPGA in a 256-ball ftBGA (256-LBGA / 17 × 17 mm) surface-mount package. It combines LUT-based programmable logic with on-chip flash configuration (flexiFLASH) and security/Live Update features from the LatticeXP2 architecture.

Designed for industrial-grade applications, this device provides 5,000 logic elements, approximately 0.17 Mbits of embedded RAM (169,984 bits), and 172 I/O pins while operating from a core supply range of 1.14 V to 1.26 V and an ambient temperature range of −40 °C to 100 °C.

Key Features

• Programmable Core  5,000 logic elements deliver flexible LUT-based logic for mid-density designs.
• Embedded Memory  Approximately 0.17 Mbits of on-chip RAM (169,984 bits) for distributed and embedded storage.
• sysDSP and Multipliers  Includes the LatticeXP2 sysDSP architecture for high-performance multiply-accumulate operations; the XP2-5 device provides 3 sysDSP blocks and 12 18×18 multipliers as defined by the family data.
• I/O and Interfaces  172 I/O pins with flexible sysIO buffer support and pre-engineered source-synchronous interfaces; family-level support includes DDR/DDR2 interfaces up to 200 MHz and LVDS display interfaces.
• Configuration & Security  flexiFLASH instant-on, FlashBAK embedded memory, Serial TAG memory, Live Update (TransFR) capability, dual-boot external SPI support and 128-bit AES encryption for secure updates.
• Clocking  On-chip PLL resources (family supports multiple analog PLLs) for clock multiply/divide and phase shifting.
• Power  Operates from a core supply between 1.14 V and 1.26 V (typical family VCC = 1.2 V).
• Package & Environmental  256-ball ftBGA (17 × 17 mm) surface-mount package; industrial grade with an operating range of −40 °C to 100 °C; RoHS compliant.

Typical Applications

• Industrial Control & Automation  Reconfigurable logic for industrial systems that require operation across −40 °C to 100 °C and flexible I/O routing.
• Display & Video Interfaces  Support for LVDS source-synchronous interfaces and 7:1 LVDS-style display links at the family level makes the device suitable for display front-ends and panel interfaces.
• Memory Interface Bridging  Pre-engineered DDR/DDR2 interface support (up to 200 MHz) enables memory controller and bridge implementations.
• Secure Embedded Systems  On-chip flexiFLASH configuration plus Live Update and 128-bit AES support facilitate secure field updates and dual-boot configurations.

Unique Advantages

• Instant-on non-volatile configuration: flexiFLASH architecture enables on-chip flash configuration for immediate startup without external volatile configuration memory.
• Integrated DSP capability: sysDSP blocks and dedicated multipliers provide hardware-accelerated multiply-accumulate operations for signal processing tasks.
• Secure field updates: Live Update (TransFR) and 128-bit AES encryption support secure remote firmware updates with dual-boot options.
• Compact industrial package: 256-ball ftBGA (17 × 17 mm) surface-mount package combines a small PCB footprint with 172 I/Os for dense interface routing.
• Design ecosystem support: Family-level tools and IP (as documented for LatticeXP2 devices) support efficient design implementation and density migration within the LatticeXP2 portfolio.

Why Choose LFXP2-5E-6FT256I?

The LFXP2-5E-6FT256I positions itself as a mid-density, industrial-grade FPGA option that pairs on-chip flash configuration and secure update mechanisms with a practical mix of logic, embedded memory, DSP resources, and flexible I/O. Its operating voltage range and industrial temperature rating make it suitable for systems that need reliable operation across extended conditions.

This device is well suited to designers and engineers seeking a reconfigurable, secure, and compact FPGA platform that aligns with the LatticeXP2 family architecture and ecosystem for streamlined development and future density migration.

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