LFXP2-5E-5QN208I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 146 169984 5000 208-BFQFP |
|---|---|
| Quantity | 1,319 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 146 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 625 | Number of Logic Elements/Cells | 5000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 169984 |
Overview of LFXP2-5E-5QN208I – XP2 FPGA, 5,000 logic elements, 208‑BFQFP
The LFXP2-5E-5QN208I is a LatticeXP2 family field programmable gate array (FPGA) offered in a 208‑pin BFQFP package. It combines a LUT-based FPGA fabric with non-volatile flash configuration (flexiFLASH architecture) to deliver instant-on, reconfigurable logic for mid-density embedded designs.
With 5,000 logic elements, approximately 169,984 bits of on-chip memory, 146 user I/Os and industrial temperature rating, this device targets applications that require reconfigurable logic, embedded memory and DSP acceleration in a compact surface-mount package.
Key Features
- Core Logic — 5,000 logic elements (LUT-based FPGA fabric) suitable for mid-density logic integration and glue logic.
- Non‑volatile Configuration (flexiFLASH) — Flash-based architecture provides instant-on and infinitely reconfigurable single-chip configuration with on-chip flash storage.
- Embedded Memory — Approximately 169,984 bits of on-chip RAM for embedded storage and buffering needs.
- sysDSP and Multipliers — Family-level sysDSP blocks (XP2-5 family includes three sysDSP blocks) with dedicated 18×18 multipliers for efficient MAC and signal-processing tasks.
- Flexible I/O — 146 user I/Os available in the 208-pin package for interfaces, bus bridging and peripheral connectivity.
- Power and Voltage — Designed to operate at a core supply in the range of 1.14 V to 1.26 V (nominal 1.2 V operation referenced in family data).
- Package and Mounting — 208‑pin BFQFP surface-mount package (supplier device package listed as 208‑PQFP, 28×28 mm) to support compact board layouts.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial applications.
- Standards and System Support — Family-level support includes on-chip PLLs, source-synchronous interfaces (DDR/DDR2 support up to 200 MHz) and tools/IP support from the Lattice ecosystem as documented in the family datasheet.
- Environmental — RoHS compliant.
Typical Applications
- Display and Video Interfaces — Source-synchronous and LVDS support in the XP2 family make this device suitable for display interface bridging and timing control.
- Memory Interface Logic — Use for DDR/DDR2 interface logic and timing adapters, leveraging pre-engineered source synchronous interfaces and on-chip PLLs.
- Embedded Signal Processing — sysDSP blocks and dedicated multipliers provide MAC capability for mid-range signal processing tasks and sensor data aggregation.
- Industrial Control and Automation — Industrial temperature rating and flexible I/O make the device appropriate for motor control, I/O consolidation and protocol bridging in industrial systems.
Unique Advantages
- Instant‑on, reconfigurable flash architecture — flexiFLASH enables single‑chip non-volatile configuration with instant startup and repeated reprogramming without external configuration PROMs.
- Balanced mid-range resources — 5,000 logic elements with approximately 170 Kbits of embedded memory provide a compact platform for designs that need both logic and on-chip storage.
- Integrated DSP capability — Dedicated sysDSP blocks and multiple fixed multipliers reduce the need for external DSP components in compute tasks.
- Broad I/O in a compact package — 146 user I/Os in a 208‑pin BFQFP enable dense connectivity while supporting surface-mount PCB assembly.
- Industrial temperature and RoHS compliance — Suitable for deployment in temperature-challenging environments while meeting RoHS environmental requirements.
- Supported design ecosystem — Family datasheet documents support for on-chip PLLs, source-synchronous interfaces and vendor design tools/IP to accelerate development.
Why Choose LFXP2-5E-5QN208I?
The LFXP2-5E-5QN208I occupies a mid-density segment that balances logic capacity, embedded memory and DSP resources in a single, flash-configured FPGA. Its approximately 5,000 logic elements, ~169,984 bits of on-chip RAM and dedicated sysDSP resources make it well-suited for embedded systems requiring reconfigurable logic, modest signal processing and rich I/O in a compact package.
With industrial temperature rating, RoHS compliance and family-level support for common interfaces and PLLs, this device offers a practical, integrated platform for applications where instant-on flash configuration and repeatable field updates are valuable. The LatticeXP2 family documentation and toolchain support help streamline development and migration within the XP2 series.
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