LFXP2-5E-5QN208I

IC FPGA 146 I/O 208QFP
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 146 169984 5000 208-BFQFP

Quantity 1,319 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O146Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs625Number of Logic Elements/Cells5000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits169984

Overview of LFXP2-5E-5QN208I – XP2 FPGA, 5,000 logic elements, 208‑BFQFP

The LFXP2-5E-5QN208I is a LatticeXP2 family field programmable gate array (FPGA) offered in a 208‑pin BFQFP package. It combines a LUT-based FPGA fabric with non-volatile flash configuration (flexiFLASH architecture) to deliver instant-on, reconfigurable logic for mid-density embedded designs.

With 5,000 logic elements, approximately 169,984 bits of on-chip memory, 146 user I/Os and industrial temperature rating, this device targets applications that require reconfigurable logic, embedded memory and DSP acceleration in a compact surface-mount package.

Key Features

  • Core Logic — 5,000 logic elements (LUT-based FPGA fabric) suitable for mid-density logic integration and glue logic.
  • Non‑volatile Configuration (flexiFLASH) — Flash-based architecture provides instant-on and infinitely reconfigurable single-chip configuration with on-chip flash storage.
  • Embedded Memory — Approximately 169,984 bits of on-chip RAM for embedded storage and buffering needs.
  • sysDSP and Multipliers — Family-level sysDSP blocks (XP2-5 family includes three sysDSP blocks) with dedicated 18×18 multipliers for efficient MAC and signal-processing tasks.
  • Flexible I/O — 146 user I/Os available in the 208-pin package for interfaces, bus bridging and peripheral connectivity.
  • Power and Voltage — Designed to operate at a core supply in the range of 1.14 V to 1.26 V (nominal 1.2 V operation referenced in family data).
  • Package and Mounting — 208‑pin BFQFP surface-mount package (supplier device package listed as 208‑PQFP, 28×28 mm) to support compact board layouts.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial applications.
  • Standards and System Support — Family-level support includes on-chip PLLs, source-synchronous interfaces (DDR/DDR2 support up to 200 MHz) and tools/IP support from the Lattice ecosystem as documented in the family datasheet.
  • Environmental — RoHS compliant.

Typical Applications

  • Display and Video Interfaces — Source-synchronous and LVDS support in the XP2 family make this device suitable for display interface bridging and timing control.
  • Memory Interface Logic — Use for DDR/DDR2 interface logic and timing adapters, leveraging pre-engineered source synchronous interfaces and on-chip PLLs.
  • Embedded Signal Processing — sysDSP blocks and dedicated multipliers provide MAC capability for mid-range signal processing tasks and sensor data aggregation.
  • Industrial Control and Automation — Industrial temperature rating and flexible I/O make the device appropriate for motor control, I/O consolidation and protocol bridging in industrial systems.

Unique Advantages

  • Instant‑on, reconfigurable flash architecture — flexiFLASH enables single‑chip non-volatile configuration with instant startup and repeated reprogramming without external configuration PROMs.
  • Balanced mid-range resources — 5,000 logic elements with approximately 170 Kbits of embedded memory provide a compact platform for designs that need both logic and on-chip storage.
  • Integrated DSP capability — Dedicated sysDSP blocks and multiple fixed multipliers reduce the need for external DSP components in compute tasks.
  • Broad I/O in a compact package — 146 user I/Os in a 208‑pin BFQFP enable dense connectivity while supporting surface-mount PCB assembly.
  • Industrial temperature and RoHS compliance — Suitable for deployment in temperature-challenging environments while meeting RoHS environmental requirements.
  • Supported design ecosystem — Family datasheet documents support for on-chip PLLs, source-synchronous interfaces and vendor design tools/IP to accelerate development.

Why Choose LFXP2-5E-5QN208I?

The LFXP2-5E-5QN208I occupies a mid-density segment that balances logic capacity, embedded memory and DSP resources in a single, flash-configured FPGA. Its approximately 5,000 logic elements, ~169,984 bits of on-chip RAM and dedicated sysDSP resources make it well-suited for embedded systems requiring reconfigurable logic, modest signal processing and rich I/O in a compact package.

With industrial temperature rating, RoHS compliance and family-level support for common interfaces and PLLs, this device offers a practical, integrated platform for applications where instant-on flash configuration and repeatable field updates are valuable. The LatticeXP2 family documentation and toolchain support help streamline development and migration within the XP2 series.

Request a quote or submit an inquiry to get pricing and availability for the LFXP2-5E-5QN208I.

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