LFXP2-5E-5MN132I

IC FPGA 86 I/O 132CSBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 86 169984 5000 132-LFBGA, CSPBGA

Quantity 664 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package132-CSBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case132-LFBGA, CSPBGANumber of I/O86Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs625Number of Logic Elements/Cells5000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits169984

Overview of LFXP2-5E-5MN132I – XP2 FPGA, 5,000 Logic Elements, 86 I/Os, 132-LFBGA

The LFXP2-5E-5MN132I is an industrial‑grade field programmable gate array (FPGA) based on the LatticeXP2 family flexiFLASH architecture. It integrates approximately 5,000 logic elements, roughly 170 Kbits of on‑chip RAM, and 86 I/O pins in a 132‑ball LFBGA (csBGA) package for compact, surface‑mount system designs.

Designed for applications that require instant-on non‑volatile configuration, reconfigurability and a compact footprint, this device delivers a balance of logic density, DSP capability and flexible I/O options while operating from a 1.14–1.26 V supply over a –40 °C to 100 °C industrial temperature range.

Key Features

  • Core Logic — Approximately 5,000 logic elements provide a compact FPGA fabric suitable for mid-density control, glue‑logic and signal processing functions.
  • Embedded Memory — Total on‑chip RAM of 169,984 bits (approximately 170 Kbits) for embedded storage and buffering needs.
  • sysDSP and Multipliers — Family features include dedicated sysDSP blocks and hardware multipliers to accelerate multiply‑accumulate operations; the XP2-5 device class includes multiple DSP resources appropriate for signal processing tasks.
  • Flexible I/O — 86 I/O pins supported in the 132‑ball csBGA package, with the family supporting a wide range of buffer standards and source‑synchronous interfaces as required by system designs.
  • Non‑volatile Configuration — flexiFLASH architecture delivers instant‑on, infinitely reconfigurable operation with on‑chip flash and features such as dual‑boot and secure update capabilities available in the LatticeXP2 family.
  • Clocking — On‑chip PLLs available in the family for clock multiply, divide and phase shifting to support complex timing requirements.
  • Power and Package — Operates from a 1.14–1.26 V supply; supplied in a compact 132‑LFBGA (csBGA) surface‑mount package (8 × 8 mm footprint).
  • Industrial Temperature Rating & RoHS Compliant — Specified for operation from –40 °C to 100 °C and RoHS compliant for industrial deployments.

Typical Applications

  • Industrial Control — Implement real‑time control logic, sensor interfacing and deterministic I/O handling using the device’s logic fabric and flexible I/O.
  • Communications & Networking — Use the FPGA’s DSP blocks and source‑synchronous I/O support to build protocol bridges, packet handling and interface glue logic.
  • Video and Display Interfaces — Leverage the family’s pre‑engineered source‑synchronous interfaces and LVDS support for display timing, lane aggregation and video preprocessing.
  • Instrumentation & Test Equipment — Apply the compact FPGA and on‑chip memory for data acquisition preprocessing, signal conditioning and control functions in industrial and laboratory instruments.

Unique Advantages

  • Instant‑on, non‑volatile operation: flexiFLASH architecture enables immediate configuration at power‑up without external configuration memory, simplifying system design and boot sequencing.
  • Reconfigurable DSP capability: Dedicated sysDSP blocks and hardware multipliers accelerate arithmetic workloads, reducing load on external processors and improving system throughput.
  • Compact, surface‑mount package: The 132‑LFBGA csBGA package provides a small PCB footprint while delivering 86 I/Os, ideal for space‑constrained designs.
  • Industrial temperature range: Rated for –40 °C to 100 °C operation to meet the environmental needs of industrial applications.
  • Secure and flexible system updates: Family features such as secure update and dual‑boot support enable field updates and design protection strategies.
  • Low‑voltage core: Operates from a nominal 1.2 V supply window (1.14–1.26 V), aligning with modern low‑power system rails.

Why Choose LFXP2-5E-5MN132I?

The LFXP2-5E-5MN132I positions itself as a compact, industrial‑rated mid‑density FPGA that combines non‑volatile instant‑on configuration, on‑chip RAM and DSP acceleration in a small csBGA package. It is well suited to designers who need a reconfigurable, secure and compact FPGA solution for control, interface bridging and signal processing tasks.

With the LatticeXP2 family’s ecosystem of configuration options, clocking resources and I/O flexibility, this device supports scalable designs that can evolve through firmware updates while maintaining a low component count and footprint — providing long‑term value for industrial and embedded projects.

Request a quote or submit a procurement inquiry to get pricing, availability and lead‑time information for LFXP2-5E-5MN132I.

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