LFXP2-5E-5MN132I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 86 169984 5000 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 664 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSBGA (8x8) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 86 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 625 | Number of Logic Elements/Cells | 5000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 169984 |
Overview of LFXP2-5E-5MN132I – XP2 FPGA, 5,000 Logic Elements, 86 I/Os, 132-LFBGA
The LFXP2-5E-5MN132I is an industrial‑grade field programmable gate array (FPGA) based on the LatticeXP2 family flexiFLASH architecture. It integrates approximately 5,000 logic elements, roughly 170 Kbits of on‑chip RAM, and 86 I/O pins in a 132‑ball LFBGA (csBGA) package for compact, surface‑mount system designs.
Designed for applications that require instant-on non‑volatile configuration, reconfigurability and a compact footprint, this device delivers a balance of logic density, DSP capability and flexible I/O options while operating from a 1.14–1.26 V supply over a –40 °C to 100 °C industrial temperature range.
Key Features
- Core Logic — Approximately 5,000 logic elements provide a compact FPGA fabric suitable for mid-density control, glue‑logic and signal processing functions.
- Embedded Memory — Total on‑chip RAM of 169,984 bits (approximately 170 Kbits) for embedded storage and buffering needs.
- sysDSP and Multipliers — Family features include dedicated sysDSP blocks and hardware multipliers to accelerate multiply‑accumulate operations; the XP2-5 device class includes multiple DSP resources appropriate for signal processing tasks.
- Flexible I/O — 86 I/O pins supported in the 132‑ball csBGA package, with the family supporting a wide range of buffer standards and source‑synchronous interfaces as required by system designs.
- Non‑volatile Configuration — flexiFLASH architecture delivers instant‑on, infinitely reconfigurable operation with on‑chip flash and features such as dual‑boot and secure update capabilities available in the LatticeXP2 family.
- Clocking — On‑chip PLLs available in the family for clock multiply, divide and phase shifting to support complex timing requirements.
- Power and Package — Operates from a 1.14–1.26 V supply; supplied in a compact 132‑LFBGA (csBGA) surface‑mount package (8 × 8 mm footprint).
- Industrial Temperature Rating & RoHS Compliant — Specified for operation from –40 °C to 100 °C and RoHS compliant for industrial deployments.
Typical Applications
- Industrial Control — Implement real‑time control logic, sensor interfacing and deterministic I/O handling using the device’s logic fabric and flexible I/O.
- Communications & Networking — Use the FPGA’s DSP blocks and source‑synchronous I/O support to build protocol bridges, packet handling and interface glue logic.
- Video and Display Interfaces — Leverage the family’s pre‑engineered source‑synchronous interfaces and LVDS support for display timing, lane aggregation and video preprocessing.
- Instrumentation & Test Equipment — Apply the compact FPGA and on‑chip memory for data acquisition preprocessing, signal conditioning and control functions in industrial and laboratory instruments.
Unique Advantages
- Instant‑on, non‑volatile operation: flexiFLASH architecture enables immediate configuration at power‑up without external configuration memory, simplifying system design and boot sequencing.
- Reconfigurable DSP capability: Dedicated sysDSP blocks and hardware multipliers accelerate arithmetic workloads, reducing load on external processors and improving system throughput.
- Compact, surface‑mount package: The 132‑LFBGA csBGA package provides a small PCB footprint while delivering 86 I/Os, ideal for space‑constrained designs.
- Industrial temperature range: Rated for –40 °C to 100 °C operation to meet the environmental needs of industrial applications.
- Secure and flexible system updates: Family features such as secure update and dual‑boot support enable field updates and design protection strategies.
- Low‑voltage core: Operates from a nominal 1.2 V supply window (1.14–1.26 V), aligning with modern low‑power system rails.
Why Choose LFXP2-5E-5MN132I?
The LFXP2-5E-5MN132I positions itself as a compact, industrial‑rated mid‑density FPGA that combines non‑volatile instant‑on configuration, on‑chip RAM and DSP acceleration in a small csBGA package. It is well suited to designers who need a reconfigurable, secure and compact FPGA solution for control, interface bridging and signal processing tasks.
With the LatticeXP2 family’s ecosystem of configuration options, clocking resources and I/O flexibility, this device supports scalable designs that can evolve through firmware updates while maintaining a low component count and footprint — providing long‑term value for industrial and embedded projects.
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