LFXP2-5E-5M132C

IC FPGA 86 I/O 132CSBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 86 169984 5000 132-LFBGA, CSPBGA

Quantity 628 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-CSBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O86Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs625Number of Logic Elements/Cells5000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits169984

Overview of LFXP2-5E-5M132C – XP2 Field Programmable Gate Array (FPGA) IC, 86 I/Os, 132-LFBGA

The LFXP2-5E-5M132C is a flash-based FPGA in the LatticeXP2 family, delivering approximately 5,000 logic elements and embedded non-volatile configuration. It pairs a LUT-based FPGA fabric with on-chip flash architecture to provide instant-on reconfigurability and secure field update capabilities.

With 86 I/Os in a compact 132-ball csBGA (8×8 mm) package, low-voltage operation (1.14 V–1.26 V) and commercial temperature range (0 °C to 85 °C), this device targets embedded designs that require a balance of integration, DSP capability and flexible I/O in a space-efficient surface-mount package.

Key Features

  • Core Logic  Approximately 5,000 logic elements implemented in a LUT-based FPGA fabric for general-purpose combinational and sequential logic.
  • Embedded Memory  Approximately 169,984 bits (≈0.17 Mbits) of on-chip RAM for embedded storage and buffering.
  • DSP Capabilities  Family sysDSP architecture supports multiply–accumulate operations and dedicated multipliers (family-level feature) for signal processing tasks.
  • Flash-Based Configuration (flexiFLASH)  Flash configuration provides instant-on behavior, on-chip non-volatile storage and reconfigurability (family-level feature).
  • Live Update & Security  Family-level Live Update technologies include secure update mechanisms and support for encrypted images and dual-boot configurations.
  • Flexible I/O  86 programmable I/Os with support for a wide set of I/O standards at the family level, enabling interface bridging and mixed-signal peripheral connections.
  • Clocking  Analog PLLs at the family level provide clock multiply, divide and phase shifting for complex timing domains.
  • Power & Mounting  Low-voltage supply range of 1.14 V to 1.26 V and surface-mount 132-ball csBGA package suitable for compact board designs.
  • Compliance  RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

  • Embedded Control and Sensor Aggregation  Use the FPGA fabric and on-chip memory to implement protocol bridging, sensor fusion and real-time control tasks in compact embedded systems.
  • Display and Video Interfaces  Flexible I/O and family-level source-synchronous interface support make the device suitable for display timing, LVDS lanes and video-interface bridging.
  • Communications and Networking Endpoints  Implement packet-handling, protocol adaptation and peripheral interfacing using DSP blocks and dedicated multipliers available in the XP2 family.
  • Prototyping and Product Differentiation  Flash-based reconfigurability enables iterative development and field updates without external configuration components.

Unique Advantages

  • Flash-Based Instant-On: On-chip flash configuration enables immediate startup without external configuration memory.
  • Secure Field Updates: Family Live Update features support encrypted updates and dual-boot strategies for safer in-field reconfiguration.
  • Compact, High-Density I/O: 86 I/Os in a 132-ball csBGA (8×8 mm) package reduce board footprint while preserving interface flexibility.
  • DSP-Ready Fabric: sysDSP blocks and dedicated multipliers (family-level) accelerate multiply–accumulate workloads and signal processing functions.
  • Low-Voltage Operation: Operation within 1.14 V–1.26 V supports modern low-power supply domains and integration into power-sensitive designs.
  • RoHS Compliant Surface-Mount Package: Designed for standard surface-mount assembly and environmental compliance for production use.

Why Choose LFXP2-5E-5M132C?

The LFXP2-5E-5M132C positions itself as a versatile, flash-configured FPGA for embedded designs that need approximately 5,000 logic elements, ~0.17 Mbits of on-chip RAM and 86 I/Os in a compact csBGA package. Its family-level features—flash-based instant-on, secure live update, DSP blocks and flexible I/O—make it well suited for designers who require field reconfigurability, hardware acceleration and compact system integration within a commercial temperature range.

Supported by LatticeXP2 family technologies and the associated design flow, the device offers a straightforward migration path within the XP2 family for projects that may scale in logic density or I/O count while keeping development and update models consistent.

Request a quote or submit a product inquiry to obtain pricing, availability and technical procurement details for LFXP2-5E-5M132C.

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