LFXP2-5E-5M132C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 86 169984 5000 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 628 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 86 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 625 | Number of Logic Elements/Cells | 5000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 169984 |
Overview of LFXP2-5E-5M132C – XP2 Field Programmable Gate Array (FPGA) IC, 86 I/Os, 132-LFBGA
The LFXP2-5E-5M132C is a flash-based FPGA in the LatticeXP2 family, delivering approximately 5,000 logic elements and embedded non-volatile configuration. It pairs a LUT-based FPGA fabric with on-chip flash architecture to provide instant-on reconfigurability and secure field update capabilities.
With 86 I/Os in a compact 132-ball csBGA (8×8 mm) package, low-voltage operation (1.14 V–1.26 V) and commercial temperature range (0 °C to 85 °C), this device targets embedded designs that require a balance of integration, DSP capability and flexible I/O in a space-efficient surface-mount package.
Key Features
- Core Logic Approximately 5,000 logic elements implemented in a LUT-based FPGA fabric for general-purpose combinational and sequential logic.
- Embedded Memory Approximately 169,984 bits (≈0.17 Mbits) of on-chip RAM for embedded storage and buffering.
- DSP Capabilities Family sysDSP architecture supports multiply–accumulate operations and dedicated multipliers (family-level feature) for signal processing tasks.
- Flash-Based Configuration (flexiFLASH) Flash configuration provides instant-on behavior, on-chip non-volatile storage and reconfigurability (family-level feature).
- Live Update & Security Family-level Live Update technologies include secure update mechanisms and support for encrypted images and dual-boot configurations.
- Flexible I/O 86 programmable I/Os with support for a wide set of I/O standards at the family level, enabling interface bridging and mixed-signal peripheral connections.
- Clocking Analog PLLs at the family level provide clock multiply, divide and phase shifting for complex timing domains.
- Power & Mounting Low-voltage supply range of 1.14 V to 1.26 V and surface-mount 132-ball csBGA package suitable for compact board designs.
- Compliance RoHS compliant for regulatory and manufacturing compatibility.
Typical Applications
- Embedded Control and Sensor Aggregation Use the FPGA fabric and on-chip memory to implement protocol bridging, sensor fusion and real-time control tasks in compact embedded systems.
- Display and Video Interfaces Flexible I/O and family-level source-synchronous interface support make the device suitable for display timing, LVDS lanes and video-interface bridging.
- Communications and Networking Endpoints Implement packet-handling, protocol adaptation and peripheral interfacing using DSP blocks and dedicated multipliers available in the XP2 family.
- Prototyping and Product Differentiation Flash-based reconfigurability enables iterative development and field updates without external configuration components.
Unique Advantages
- Flash-Based Instant-On: On-chip flash configuration enables immediate startup without external configuration memory.
- Secure Field Updates: Family Live Update features support encrypted updates and dual-boot strategies for safer in-field reconfiguration.
- Compact, High-Density I/O: 86 I/Os in a 132-ball csBGA (8×8 mm) package reduce board footprint while preserving interface flexibility.
- DSP-Ready Fabric: sysDSP blocks and dedicated multipliers (family-level) accelerate multiply–accumulate workloads and signal processing functions.
- Low-Voltage Operation: Operation within 1.14 V–1.26 V supports modern low-power supply domains and integration into power-sensitive designs.
- RoHS Compliant Surface-Mount Package: Designed for standard surface-mount assembly and environmental compliance for production use.
Why Choose LFXP2-5E-5M132C?
The LFXP2-5E-5M132C positions itself as a versatile, flash-configured FPGA for embedded designs that need approximately 5,000 logic elements, ~0.17 Mbits of on-chip RAM and 86 I/Os in a compact csBGA package. Its family-level features—flash-based instant-on, secure live update, DSP blocks and flexible I/O—make it well suited for designers who require field reconfigurability, hardware acceleration and compact system integration within a commercial temperature range.
Supported by LatticeXP2 family technologies and the associated design flow, the device offers a straightforward migration path within the XP2 family for projects that may scale in logic density or I/O count while keeping development and update models consistent.
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