LFXP2-5E-5FT256C

IC FPGA 172 I/O 256FTBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 172 169984 5000 256-LBGA

Quantity 606 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O172Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs625Number of Logic Elements/Cells5000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits169984

Overview of LFXP2-5E-5FT256C – XP2 Field Programmable Gate Array (FPGA) IC 172 169984 5000 256-LBGA

The LFXP2-5E-5FT256C is an XP2 family FPGA from Lattice Semiconductor offered in a 256-ball BGA package. It combines flash-based configuration architecture with a LUT-based FPGA fabric to deliver reconfigurable logic, embedded memory, DSP resources and a broad set of I/O for compact, low-voltage designs.

Designed for commercial applications, this device targets embedded control, interface bridging and display or sensor interface tasks where a small-footprint, instant-on FPGA with flexible I/O and on-chip memory is required.

Key Features

  • Logic Capacity  Approximately 5,000 logic elements enabling mid-density FPGA implementations; device data lists 625 CLBs corresponding to that logic capacity.
  • Embedded Memory  Approximately 169,984 bits (≈170 Kbits) of on-chip RAM for local buffering and state storage.
  • sysDSP and Multipliers  Includes 3 sysDSP blocks and 12 18×18 multipliers for hardware-accelerated multiply-accumulate operations and signal processing tasks.
  • I/O Count and Flexibility  172 user I/Os in a 256-ball package; the XP2 family supports flexible I/O standards including a wide range of CMOS, SSTL, HSTL and differential interfaces such as LVDS for display and high-speed signaling.
  • Non-volatile Configuration (flexiFLASH)  Family-level flexiFLASH architecture provides instant-on behavior, on-chip flash storage and FlashBAK memory for persistent configuration and design security features.
  • Live Update and Security  Family features include Live Update technology with TransFR, dual-boot capability and 128-bit AES encryption for secure firmware updates and configuration management.
  • Power and Temperature  Operates from a 1.14 V to 1.26 V supply and is specified for commercial-grade temperatures from 0 °C to 85 °C.
  • Package and Mounting  256-ball LBGA package (supplier device package: 256-FTBGA, 17×17 mm) with surface-mount mounting for compact board-level integration.

Typical Applications

  • Embedded Control  Use as a compact programmable controller for board-level logic, protocol handling and sensor aggregation where on-chip memory and DSP resources accelerate local processing.
  • Display and Video Interfaces  Flexible I/O and differential signaling support make the device suitable for display interfaces and source-synchronous links used in video and graphics front-ends.
  • Interface Bridging and Memory Controllers  Mid-density logic and dedicated multipliers allow implementation of protocol bridging, DDR/parallel interface support and timing-critical glue logic.
  • Secure Field Upgrades  Built-in flash configuration and Live Update features enable secure, field-deployable firmware updates and dual-boot configurations for system reliability.

Unique Advantages

  • Integrated Non-volatile Configuration: Flash-based flexiFLASH delivers instant-on behavior and on-chip configuration storage to simplify system designs and eliminate external volatile configuration devices.
  • Balanced Compute and Memory: 5,000 logic elements paired with approximately 170 Kbits of embedded RAM support a variety of mid-range control, buffering and data-path tasks without large external memory requirements.
  • Dedicated DSP Resources: sysDSP blocks and 18×18 multipliers provide hardware acceleration for signal processing and mathematical operations, reducing load on general logic.
  • Flexible, High-count I/O: 172 user I/Os in a compact ftBGA package deliver multiple interface options for mixed-signal designs, display links and high-speed differential pairs.
  • Secure Update Path: Live Update technologies and AES-based encryption allow secure firmware/configuration updates and support dual-boot workflows for safe field maintenance.
  • Compact Surface-mount Package: The 256-ball ftBGA (17×17 mm) package enables dense PCB layouts while preserving a large number of I/Os for routing and system connectivity.

Why Choose LFXP2-5E-5FT256C?

The LFXP2-5E-5FT256C positions itself as a mid-density, commercial-grade FPGA that combines flash-based configuration, DSP resources and flexible I/O in a compact surface-mount package. Its combination of approximately 5,000 logic elements, on-chip RAM and dedicated multipliers makes it suitable for designs requiring embedded processing, interface bridging and secure field updates without excessive external components.

With the XP2 family features—instant-on flexiFLASH, Live Update and an array of supported I/O standards—this device is a practical choice for teams seeking a scalable, reconfigurable solution supported by the Lattice XP2 ecosystem and design flow.

Request a quote or submit an inquiry for pricing and availability of the LFXP2-5E-5FT256C to evaluate it for your next embedded or interface design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up