LFXP2-5E-5FT256C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 172 169984 5000 256-LBGA |
|---|---|
| Quantity | 606 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 172 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 625 | Number of Logic Elements/Cells | 5000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 169984 |
Overview of LFXP2-5E-5FT256C – XP2 Field Programmable Gate Array (FPGA) IC 172 169984 5000 256-LBGA
The LFXP2-5E-5FT256C is an XP2 family FPGA from Lattice Semiconductor offered in a 256-ball BGA package. It combines flash-based configuration architecture with a LUT-based FPGA fabric to deliver reconfigurable logic, embedded memory, DSP resources and a broad set of I/O for compact, low-voltage designs.
Designed for commercial applications, this device targets embedded control, interface bridging and display or sensor interface tasks where a small-footprint, instant-on FPGA with flexible I/O and on-chip memory is required.
Key Features
- Logic Capacity Approximately 5,000 logic elements enabling mid-density FPGA implementations; device data lists 625 CLBs corresponding to that logic capacity.
- Embedded Memory Approximately 169,984 bits (≈170 Kbits) of on-chip RAM for local buffering and state storage.
- sysDSP and Multipliers Includes 3 sysDSP blocks and 12 18×18 multipliers for hardware-accelerated multiply-accumulate operations and signal processing tasks.
- I/O Count and Flexibility 172 user I/Os in a 256-ball package; the XP2 family supports flexible I/O standards including a wide range of CMOS, SSTL, HSTL and differential interfaces such as LVDS for display and high-speed signaling.
- Non-volatile Configuration (flexiFLASH) Family-level flexiFLASH architecture provides instant-on behavior, on-chip flash storage and FlashBAK memory for persistent configuration and design security features.
- Live Update and Security Family features include Live Update technology with TransFR, dual-boot capability and 128-bit AES encryption for secure firmware updates and configuration management.
- Power and Temperature Operates from a 1.14 V to 1.26 V supply and is specified for commercial-grade temperatures from 0 °C to 85 °C.
- Package and Mounting 256-ball LBGA package (supplier device package: 256-FTBGA, 17×17 mm) with surface-mount mounting for compact board-level integration.
Typical Applications
- Embedded Control Use as a compact programmable controller for board-level logic, protocol handling and sensor aggregation where on-chip memory and DSP resources accelerate local processing.
- Display and Video Interfaces Flexible I/O and differential signaling support make the device suitable for display interfaces and source-synchronous links used in video and graphics front-ends.
- Interface Bridging and Memory Controllers Mid-density logic and dedicated multipliers allow implementation of protocol bridging, DDR/parallel interface support and timing-critical glue logic.
- Secure Field Upgrades Built-in flash configuration and Live Update features enable secure, field-deployable firmware updates and dual-boot configurations for system reliability.
Unique Advantages
- Integrated Non-volatile Configuration: Flash-based flexiFLASH delivers instant-on behavior and on-chip configuration storage to simplify system designs and eliminate external volatile configuration devices.
- Balanced Compute and Memory: 5,000 logic elements paired with approximately 170 Kbits of embedded RAM support a variety of mid-range control, buffering and data-path tasks without large external memory requirements.
- Dedicated DSP Resources: sysDSP blocks and 18×18 multipliers provide hardware acceleration for signal processing and mathematical operations, reducing load on general logic.
- Flexible, High-count I/O: 172 user I/Os in a compact ftBGA package deliver multiple interface options for mixed-signal designs, display links and high-speed differential pairs.
- Secure Update Path: Live Update technologies and AES-based encryption allow secure firmware/configuration updates and support dual-boot workflows for safe field maintenance.
- Compact Surface-mount Package: The 256-ball ftBGA (17×17 mm) package enables dense PCB layouts while preserving a large number of I/Os for routing and system connectivity.
Why Choose LFXP2-5E-5FT256C?
The LFXP2-5E-5FT256C positions itself as a mid-density, commercial-grade FPGA that combines flash-based configuration, DSP resources and flexible I/O in a compact surface-mount package. Its combination of approximately 5,000 logic elements, on-chip RAM and dedicated multipliers makes it suitable for designs requiring embedded processing, interface bridging and secure field updates without excessive external components.
With the XP2 family features—instant-on flexiFLASH, Live Update and an array of supported I/O standards—this device is a practical choice for teams seeking a scalable, reconfigurable solution supported by the Lattice XP2 ecosystem and design flow.
Request a quote or submit an inquiry for pricing and availability of the LFXP2-5E-5FT256C to evaluate it for your next embedded or interface design.

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