LFXP2-5E-5FTN256C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 172 169984 5000 256-LBGA |
|---|---|
| Quantity | 161 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 172 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 625 | Number of Logic Elements/Cells | 5000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 169984 |
Overview of LFXP2-5E-5FTN256C – XP2 Field Programmable Gate Array (FPGA), 5k logic elements, 172 I/O, 256-LBGA
The LFXP2-5E-5FTN256C is a commercial-grade LatticeXP2 family FPGA featuring a flexiFLASH architecture that combines LUT-based FPGA fabric with on-chip non-volatile flash. This device delivers instant-on reconfigurability, embedded memory, and high-performance DSP and I/O capabilities in a 256-ball ftBGA (17 × 17 mm) package.
Designed for commercial and consumer electronic systems, the device targets applications that require moderate logic capacity, substantial embedded RAM, and flexible I/O with a low-voltage 1.14–1.26 V supply and an operating temperature range of 0 °C to 85 °C.
Key Features
- Core Logic Approximately 5,000 logic elements (LUT-based fabric) suitable for mid-range logic integration and control functions.
- Embedded Memory Approximately 169,984 bits of on-chip RAM for distributed and embedded storage supporting buffering and local data storage.
- sysDSP Blocks & Multipliers Family architecture includes sysDSP resources; the XP2-5 class supports sysDSP blocks and 18×18 multipliers for efficient MAC operations.
- I/O Flexibility Up to 172 I/O pins available in the 256-ball ftBGA package to support a wide range of parallel and high-speed interface requirements.
- flexiFLASH Configuration Non-volatile flash-based architecture provides instant-on, infinite reconfigurability and on-chip storage for images and configuration.
- Live Update & Security Family-level support for Live Update technologies including secure update mechanisms (128-bit AES described in family documentation) and dual-boot options.
- Clocking Analog PLL support as described for the LatticeXP2 family for clock multiply/divide and phase shifting.
- Power & Packaging Single-core supply operation in the 1.14 V–1.26 V range and surface-mount 256-FTBGA (17×17 mm) package for compact board integration.
- Commercial Temperature Grade Specified for operation from 0 °C to 85 °C and RoHS compliant for commercial applications.
Typical Applications
- Consumer Electronics Implement custom control logic, peripheral bridging, and interface adaptation where moderate logic density and embedded memory are required.
- Communications & Networking Support protocol bridging, packet buffering, and custom I/O arrangements using the device’s flexible I/O and on-chip RAM.
- Imaging & Display Systems Use pre-engineered source-synchronous interfaces and LVDS-capable I/O for display timing, data alignment, and pixel processing tasks.
- Embedded Control Integrate control functions, timing logic, and DSP-assisted math using the sysDSP resources and available multipliers.
Unique Advantages
- Instant-on, reconfigurable flash architecture: flexiFLASH enables non-volatile configuration with instant-on behavior and on-chip image storage for compact system designs.
- Balanced logic and memory: Around 5,000 logic elements combined with approximately 170 Kbits of embedded RAM supports a wide range of mid-density designs without external SRAM for many functions.
- Flexible, high-count I/O in a compact package: 172 I/O in a 17 × 17 mm ftBGA offers significant connectivity while minimizing PCB area.
- Low-voltage operation: 1.14–1.26 V supply compatibility aligns with modern low-voltage power rails for energy-conscious designs.
- Design and update support: Family-level Live Update and secure update features enable field reconfiguration workflows and image management.
- Commercial-grade compliance: Specified commercial temperature range and RoHS compliance simplify selection for consumer and commercial product lines.
Why Choose LFXP2-5E-5FTN256C?
The LFXP2-5E-5FTN256C positions itself as a compact, flash-configured FPGA that delivers a practical combination of logic density, on-chip RAM, DSP capability, and extensive I/O in a small ftBGA package. It is well-suited for designers needing instant-on reconfigurability, secure update options, and a commercial-grade device footprint.
Backed by the LatticeXP2 family feature set and development ecosystem, the device supports scalable design migration, IP reuse, and design flows that leverage the family’s configuration and clocking capabilities—helping teams reduce BOM complexity and iterate designs efficiently.
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