LFXP2-5E-5FTN256C

IC FPGA 172 I/O 256FTBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 172 169984 5000 256-LBGA

Quantity 161 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O172Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs625Number of Logic Elements/Cells5000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits169984

Overview of LFXP2-5E-5FTN256C – XP2 Field Programmable Gate Array (FPGA), 5k logic elements, 172 I/O, 256-LBGA

The LFXP2-5E-5FTN256C is a commercial-grade LatticeXP2 family FPGA featuring a flexiFLASH architecture that combines LUT-based FPGA fabric with on-chip non-volatile flash. This device delivers instant-on reconfigurability, embedded memory, and high-performance DSP and I/O capabilities in a 256-ball ftBGA (17 × 17 mm) package.

Designed for commercial and consumer electronic systems, the device targets applications that require moderate logic capacity, substantial embedded RAM, and flexible I/O with a low-voltage 1.14–1.26 V supply and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic  Approximately 5,000 logic elements (LUT-based fabric) suitable for mid-range logic integration and control functions.
  • Embedded Memory  Approximately 169,984 bits of on-chip RAM for distributed and embedded storage supporting buffering and local data storage.
  • sysDSP Blocks & Multipliers  Family architecture includes sysDSP resources; the XP2-5 class supports sysDSP blocks and 18×18 multipliers for efficient MAC operations.
  • I/O Flexibility  Up to 172 I/O pins available in the 256-ball ftBGA package to support a wide range of parallel and high-speed interface requirements.
  • flexiFLASH Configuration  Non-volatile flash-based architecture provides instant-on, infinite reconfigurability and on-chip storage for images and configuration.
  • Live Update & Security  Family-level support for Live Update technologies including secure update mechanisms (128-bit AES described in family documentation) and dual-boot options.
  • Clocking  Analog PLL support as described for the LatticeXP2 family for clock multiply/divide and phase shifting.
  • Power & Packaging  Single-core supply operation in the 1.14 V–1.26 V range and surface-mount 256-FTBGA (17×17 mm) package for compact board integration.
  • Commercial Temperature Grade  Specified for operation from 0 °C to 85 °C and RoHS compliant for commercial applications.

Typical Applications

  • Consumer Electronics  Implement custom control logic, peripheral bridging, and interface adaptation where moderate logic density and embedded memory are required.
  • Communications & Networking  Support protocol bridging, packet buffering, and custom I/O arrangements using the device’s flexible I/O and on-chip RAM.
  • Imaging & Display Systems  Use pre-engineered source-synchronous interfaces and LVDS-capable I/O for display timing, data alignment, and pixel processing tasks.
  • Embedded Control  Integrate control functions, timing logic, and DSP-assisted math using the sysDSP resources and available multipliers.

Unique Advantages

  • Instant-on, reconfigurable flash architecture: flexiFLASH enables non-volatile configuration with instant-on behavior and on-chip image storage for compact system designs.
  • Balanced logic and memory: Around 5,000 logic elements combined with approximately 170 Kbits of embedded RAM supports a wide range of mid-density designs without external SRAM for many functions.
  • Flexible, high-count I/O in a compact package: 172 I/O in a 17 × 17 mm ftBGA offers significant connectivity while minimizing PCB area.
  • Low-voltage operation: 1.14–1.26 V supply compatibility aligns with modern low-voltage power rails for energy-conscious designs.
  • Design and update support: Family-level Live Update and secure update features enable field reconfiguration workflows and image management.
  • Commercial-grade compliance: Specified commercial temperature range and RoHS compliance simplify selection for consumer and commercial product lines.

Why Choose LFXP2-5E-5FTN256C?

The LFXP2-5E-5FTN256C positions itself as a compact, flash-configured FPGA that delivers a practical combination of logic density, on-chip RAM, DSP capability, and extensive I/O in a small ftBGA package. It is well-suited for designers needing instant-on reconfigurability, secure update options, and a commercial-grade device footprint.

Backed by the LatticeXP2 family feature set and development ecosystem, the device supports scalable design migration, IP reuse, and design flows that leverage the family’s configuration and clocking capabilities—helping teams reduce BOM complexity and iterate designs efficiently.

Request a quote or submit a purchase inquiry for pricing and availability of the LFXP2-5E-5FTN256C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up