LFXP2-40E-7FN672C

The LFXP2-40E-7FN672C is a LatticeXP2 family field‑programmable gate array featuring a flash‑based flexiFLASH architecture for single‑chip, instant‑on reconfigurability. It provides 40,000 logic elements, approximately 0.9 Mbits of on‑chip RAM, and up to 540 user I/Os in a 672‑ball BGA (27 × 27 mm) package for high‑density commercial applications.

Designed for applications that require embedded memory, DSP acceleration, flexible I/O standards and secure field updates, this commercial‑grade device targets compact system designs where integration, instant boot and update security are important.

Key Features

• flexiFLASH Architecture — Flash‑based single‑chip configuration with instant‑on behavior, on‑chip FlashBAK memory and support for infinitely reconfigurable designs.
• Live Update & Security — Supports TransFR live update technology, dual‑boot options and secure updates with 128‑bit AES encryption for controlled field reconfiguration.
• Logic Capacity — 40,000 logic elements (LUT‑based fabric) suitable for medium‑to‑large FPGA designs.
• Embedded Memory — Total on‑chip RAM of 906,240 bits (approximately 0.9 Mbits) combining embedded and distributed memory resources for buffering, frame storage or lookup tables.
• High‑Performance DSP — sysDSP resources: 8 sysDSP blocks and up to 32 18×18 multipliers (family data), enabling multiply‑accumulate functions for signal processing and compute‑intensive tasks.
• Flexible I/O & Interfaces — Up to 540 I/Os supporting standards listed for the XP2 family, including LVCMOS, LVDS, SSTL, HSTL, PCI, LVPECL and RSDS plus pre‑engineered source‑synchronous interfaces such as DDR/DDR2 and 7:1 LVDS for display links.
• Clocking — Up to four analog PLLs per device for clock multiply, divide and phase shifting to support complex timing requirements.
• Power & Temperature — Operates from a nominal supply range of 1.14 V to 1.26 V and rated for commercial operating temperatures from 0 °C to 85 °C.
• Package & Mounting — 672‑ball fpBGA / BBGA package (supplier package: 672‑FPBGA, 27 × 27 mm) with surface‑mount assembly; RoHS compliant.

Typical Applications

• Display and Video Interfaces — 7:1 LVDS support and high I/O count enable display bridging, panel interfaces and video preprocessing tasks.
• Memory and High‑Speed I/O Bridges — Pre‑engineered DDR/DDR2 interfaces (family capability up to 200 MHz) for memory controller logic and high‑bandwidth buffering.
• Signal Processing — sysDSP blocks and multiple multipliers support audio, communications and sensor signal multiply‑accumulate workloads.
• Secure Field Upgrades — Flash‑based configuration with AES‑protected updates and dual‑boot support for secure remote firmware or FPGA image management.

Unique Advantages

• Instant‑on, Single‑Chip Solution: Flash‑based flexiFLASH architecture eliminates external volatile configuration storage, reducing system boot time and BOM complexity.
• Integrated DSP and Memory: On‑chip sysDSP blocks and approximately 0.9 Mbits of RAM provide compute and buffering resources without external components.
• High I/O Density: Up to 540 I/Os in a 672‑ball BGA enable complex, multi‑lane interfaces and dense board routing for high‑function systems.
• Secure, Flexible Field Updates: TransFR live update capability with 128‑bit AES encryption and dual‑boot support reduces risk during in‑field reconfiguration.
• Clocking and Timing Flexibility: Up to four analog PLLs allow sophisticated clock domain generation and phase adjustments for multi‑rate designs.
• Commercial Grade with RoHS Compliance: Designed for commercial temperature ranges (0 °C to 85 °C) and compliant with RoHS requirements.

Why Choose LFXP2-40E-7FN672C?

The LFXP2-40E-7FN672C delivers a balanced combination of logic capacity, embedded memory, DSP acceleration and extensive I/O in a flash‑based FPGA that enables instant boot and secure field updates. It is well suited for commercial systems that require integrated processing, flexible interface support and predictable power/voltage operation.

Supported by the LatticeXP2 family data and ecosystem, this device is appropriate for designers who need scalable logic migration options, pre‑engineered interfaces and a design flow that addresses both integration and update security.

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