LFXP2-5E-5FT256I

The LFXP2-5E-5FT256I is an industrial-grade Lattice XP2 field programmable gate array (FPGA) offered in a 256-ball LBGA/ftBGA package. It combines a LUT-based FPGA fabric with non-volatile flash architecture and is suited for embedded and industrial applications that require moderate logic capacity, on-chip memory, and flexible I/O.

As part of the LatticeXP2 family, the device benefits from the family’s flexiFLASH architecture and Live Update features, delivering instant-on, reconfigurable operation with design security and field-update capability.

Key Features

• Core Logic  Approximately 5,000 logic elements for implementing medium-complexity control, glue-logic and protocol offload functions.
• Embedded Memory  Approximately 170 Kbits of on-chip RAM (169,984 bits) for block and distributed storage of state, FIFOs and small frame buffers.
• sysDSP and Multipliers  Includes the XP2 family sysDSP resources; the XP2-5 device provides 3 sysDSP blocks and 12 18×18 multipliers for accelerated MAC and DSP functions.
• I/O and Interface Support  Up to 172 user I/Os; flexible sysIO buffer options and pre‑engineered source synchronous interfaces including DDR/DDR2 and LVDS-class signaling as provided by the XP2 family.
• Configuration and Security  flexiFLASH non-volatile architecture with Instant-on operation, FlashBAK memory and Live Update capability with secure update support as defined for the LatticeXP2 family.
• Power  Low-voltage core operation with a supply range of 1.14 V to 1.26 V.
• Package and Mounting  256-ball LBGA (supplier package: 256-FTBGA, 17 × 17 mm) in a surface-mount form factor supporting up to 172 I/Os.
• Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Industrial-grade temperature range and flexible I/O make this FPGA suitable for embedded control, protocol bridging and I/O aggregation in factory and process environments.
• Embedded Systems  On-chip logic and approximately 170 Kbits of RAM enable custom peripheral control, glue logic and small buffering tasks in embedded designs.
• Display and Video Interfaces  XP2 family source synchronous interfaces and LVDS support make the device appropriate for display interface handling and timing-critical signal conditioning.
• Field-Updatable Systems  flexiFLASH instant-on and Live Update technologies support secure in-system updates and dual-boot configurations for deployed equipment.

Unique Advantages

• Instant-on, non-volatile architecture: flexiFLASH provides immediate availability of the programmed design without external volatile configuration memory.
• Integrated DSP capability: sysDSP blocks and 18×18 multipliers accelerate multiply-accumulate workloads without external DSP chips.
• Compact, high-density packaging: 256-ball ftBGA (17 × 17 mm) surface-mount package delivers a high I/O count (172) in a small footprint to reduce PCB area.
• Industrial robustness: Specified operation from −40 °C to 100 °C supports deployment in demanding environmental conditions.
• Secure field updates: Live Update and FlashBAK capabilities enable secure, encrypted updates and dual-boot strategies for in-field maintainability.

Why Choose LFXP2-5E-5FT256I?

The LFXP2-5E-5FT256I delivers a balanced combination of approximately 5,000 logic elements, embedded memory and dedicated DSP resources within an industrial-temperature, surface-mount package. It is well suited for designers seeking an FPGA with instant-on flash configuration, flexible I/O and on-chip DSP acceleration for embedded and industrial applications.

Backed by the LatticeXP2 family architecture, this device provides a path for designs that require field-update capability, secure configuration and compact packaging while maintaining moderate logic and memory capacity.

If you would like pricing, availability or to request a quote for LFXP2-5E-5FT256I, submit an inquiry to receive a formal quote and additional procurement details.