LFXP2-5E-5M132I

IC FPGA 86 I/O 132CSBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 86 169984 5000 132-LFBGA, CSPBGA

Quantity 1,119 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package132-CSBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case132-LFBGA, CSPBGANumber of I/O86Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs625Number of Logic Elements/Cells5000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits169984

Overview of LFXP2-5E-5M132I – Lattice XP2 FPGA, 5,000 Logic Elements, 86 I/O, 132-LFBGA

The LFXP2-5E-5M132I is a flash-based Lattice XP2 Field Programmable Gate Array (FPGA) in a 132-ball LFBGA package. It combines a reconfigurable FPGA fabric with on-chip non-volatile flash architecture and high-performance DSP and memory resources for embedded and industrial designs.

With approximately 5,000 logic elements, roughly 170 Kbits of on-chip RAM and 86 user I/O pins, this device targets space-constrained applications that require instant-on reconfigurability, secure update capability and low-voltage operation (1.14 V to 1.26 V).

Key Features

  • Core Logic 625 logic blocks delivering a total of 5,000 logic elements suitable for mid-density control, glue logic and custom acceleration tasks.
  • Embedded Memory Approximately 169,984 bits (~170 Kbits) of on-chip RAM plus support for distributed RAM for embedded buffering and state storage.
  • sysDSP Blocks Family-level sysDSP architecture provides multiply–accumulate resources and 18×18 multiplier support for signal processing and numerical tasks.
  • Configuration & Security Flash-based flexiFLASH architecture provides instant-on, on-chip non-volatile configuration and support for secure update technologies.
  • Flexible I/O 86 I/O pins with the family’s sysIO buffer options for multiple standards, enabling a variety of parallel and serial interfaces in compact designs.
  • Clocking On-chip PLLs support clock multiplication, division and phase shifting for flexible timing architectures.
  • Power Single-core supply operation within a 1.14 V to 1.26 V range to match low-voltage system rails.
  • Package & Temperature 132-ball LFBGA (8 × 8 mm csBGA) package with industrial-grade operating range from −40 °C to 100 °C.
  • Compliance RoHS-compliant device suitable for environmentally conscious designs.

Typical Applications

  • Industrial Control Implements custom control logic, I/O aggregation and protocol bridging in factory automation and machine control systems within industrial temperature ranges.
  • Signal Processing & Imaging sysDSP resources and on-chip RAM enable filtering, data conditioning and preprocessing for imaging, sensor fusion and acquisition front-ends.
  • Communications & Networking Flexible I/O and clocking support pre-engineered source-synchronous interfaces and parallel/serial link implementations for networked devices.
  • Embedded System Glue Logic Compact footprint and instant-on flash configuration make the device suitable for board-level interface logic, boot-time control and peripheral management.
  • Secure Field Upgrades Flash-based configuration and live-update technologies support secure firmware updates and dual-boot strategies for deployed systems.

Unique Advantages

  • Instant-on, non-volatile configuration: Flash-based flexiFLASH architecture eliminates external configuration memory for faster system bring-up.
  • Balanced mid-range capacity: 5,000 logic elements and ~170 Kbits of RAM deliver a practical balance of logic and memory for mid-complexity designs without excess BOM.
  • Integrated DSP capability: sysDSP multiplier blocks accelerate signal processing tasks, reducing the need for external DSP components.
  • Compact industrial package: 132-LFBGA packaging with wide operating temperature range supports space-constrained, industrial applications.
  • Low-voltage operation: 1.14 V to 1.26 V supply compatibility aligns with modern low-voltage system rails for efficient power integration.
  • RoHS compliant: Meets environmental directives for safer and more sustainable manufacturing.

Why Choose LFXP2-5E-5M132I?

The LFXP2-5E-5M132I positions itself as a versatile, flash-configured FPGA for engineers who need mid-density logic, embedded memory and DSP capability in a compact industrial package. Its instant-on non-volatile configuration, flexible I/O and low-voltage operation make it well suited for embedded control, signal processing and communications tasks where board space and reliable field updates matter.

Designed for customers requiring integration, reconfigurability and secure update paths, this device benefits from the Lattice XP2 family architecture — delivering a practical balance of resources, temperature robustness and configuration flexibility for long-lived product designs.

Request a quote or submit a procurement inquiry to get pricing and availability for LFXP2-5E-5M132I.

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