LFXP2-5E-5MN132C

IC FPGA 86 I/O 132CSBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 86 169984 5000 132-LFBGA, CSPBGA

Quantity 868 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package132-CSBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O86Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs625Number of Logic Elements/Cells5000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits169984

Overview of LFXP2-5E-5MN132C – XP2 Field Programmable Gate Array, 5k logic elements, 86 I/Os, 132-LFBGA

The LFXP2-5E-5MN132C is a member of the LatticeXP2 family of flash-based FPGAs, delivering a compact, reconfigurable logic platform with integrated non-volatile configuration. It combines 5,000 logic elements with approximately 170 Kbits of on-chip RAM and 86 general-purpose I/Os in a 132-ball LFBGA package, making it suitable for compact embedded systems and communications and display interface designs.

Built on the flexiFLASH architecture and family-level features, this device targets applications that require instant-on configuration, secure field update capability, and a balance of DSP resources and configurable I/O in a commercial-temperature, surface-mount package.

Key Features

  • Logic Capacity — 5,000 logic elements and 625 logic blocks provide programmable fabric for mid-range logic integration and control tasks.
  • On-chip Memory — Approximately 170 Kbits of on-chip RAM (169,984 bits) for embedded data buffering, state storage, and small lookup tables.
  • DSP Resources — Includes 3 sysDSP blocks and 12 18×18 multipliers (per XP2-5 device class) to accelerate arithmetic-intensive functions such as filtering and signal processing.
  • Configuration & Security — Family-level flexiFLASH architecture provides instant-on, on-chip flash configuration and flash-based design security; supports secure updates with 128-bit AES and dual-boot capability.
  • Clocking — Integrated PLL resources (device-level: 2 GPLLs for XP2-5 class) for clock management, multiply/divide and phase shifting.
  • Flexible I/O — 86 I/Os in a compact 132-LFBGA (132-CSBGA, 8 × 8 mm) package with support for a range of interface standards across the XP2 family.
  • Power & Supply — Operates from a low-voltage core supply range of 1.14 V to 1.26 V, supporting modern low-voltage system architectures.
  • Mounting & Grade — Surface-mount package rated for commercial operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Consumer and Embedded Systems — Compact FPGA fabric and on-chip flash enable instant-on control logic, peripheral bridging, and custom interfacing in consumer devices.
  • Communications & Networking — DSP blocks and flexible I/O support protocol handling, packet processing functions, and interface bridging in mid-density networking equipment.
  • Display & Video Interfaces — Source-synchronous interface support in the XP2 family and programmable logic make the device suitable for display timing, serialization, and interface adaptation tasks.
  • Industrial Control & Automation (Commercial-level) — Reconfigurable logic and secure field-update capability support control, monitoring, and in-field firmware updates for commercial automation equipment.

Unique Advantages

  • Instant-on, Flash-based Configuration: flexiFLASH architecture provides non-volatile on-chip configuration for immediate startup without external configuration memory.
  • Secure Field Updates: Family-level Live Update features including TransFR and 128-bit AES encryption enable secure, in-field firmware updates and dual-boot strategies.
  • Balanced DSP and Logic: sysDSP blocks and 18×18 multipliers deliver hardware-accelerated arithmetic alongside 5,000 logic elements for mixed control and signal-processing tasks.
  • Space-efficient Package: 132-LFBGA (132-CSBGA, 8 × 8 mm) delivers 86 I/Os and mid-range logic density in a compact surface-mount footprint to minimize PCB area.
  • Low-Voltage Core: Core supply range of 1.14 V to 1.26 V supports integration into low-voltage designs and modern power-optimized systems.
  • RoHS Compliant: Environmentally compliant construction supports regulatory and supply-chain requirements.

Why Choose LFXP2-5E-5MN132C?

The LFXP2-5E-5MN132C positions itself as a versatile mid-density FPGA that blends on-chip non-volatile configuration, moderate logic capacity, DSP acceleration, and flexible I/O in a compact BGA package. It is well suited for designers who need instant-on behavior, secure update paths, and a balance of compute and memory resources without adding external configuration devices.

Choose this device for commercial-temperature embedded and communications designs that benefit from integrated flash configuration, hardware DSP blocks, and a small PCB footprint while maintaining RoHS compliance and predictable supply-range operation.

Request a quote or submit an inquiry to receive pricing and availability for LFXP2-5E-5MN132C and to discuss how this FPGA can fit into your next design.

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