LFXP2-5E-5FTN256I

The LFXP2-5E-5FTN256I is an XP2 series Field Programmable Gate Array (FPGA) in a 256-LBGA package designed for industrial applications. It provides mid-range programmable logic capacity with on-chip memory and a broad I/O complement for custom digital designs.

Key distinguishing attributes include 5,000 logic elements, approximately 0.17 Mbits of embedded RAM, 172 I/O pins, low-voltage supply operation (1.14 V to 1.26 V), and an industrial operating temperature range of −40°C to 100°C.

Key Features

• Core Logic 5,000 logic elements organized across 625 LABs, enabling mid-range customizable digital logic implementations.
• Embedded Memory Total on-chip RAM of 169,984 bits, approximately 0.17 Mbits of embedded memory for local buffering and state storage.
• I/O Capacity 172 general-purpose I/O pins to support multiple interfaces and parallel signals in compact system designs.
• Power Low-voltage supply range from 1.14 V to 1.26 V to support power-sensitive designs and modern low-voltage systems.
• Package & Mounting Surface-mount 256-LBGA (supplier device package: 256-FTBGA, 17×17) for high-density board integration.
• Temperature & Grade Industrial grade with an operating temperature range of −40°C to 100°C suitable for extended-temperature environments.
• Compliance RoHS compliant for environmentally regulated production requirements.

Typical Applications

• Industrial Control — Use the FPGA's logic capacity and industrial temperature rating for deterministic control, I/O aggregation, and custom automation functions.
• Communications Interfaces — Leverage 172 I/Os and on-chip RAM to implement board-level protocol bridging, parallel interfaces, and custom timing logic.
• Embedded System Glue Logic — Integrate the device to consolidate discrete logic, implement state machines, and adapt peripheral interfaces in space-constrained designs.

Unique Advantages

• Mid-range Logic Density: 5,000 logic elements provide a balance of capacity and cost for many embedded and industrial designs.
• Compact High-density Package: 256-LBGA (17×17) enables a small PCB footprint while offering abundant I/O.
• Industrial Temperature Support: Rated from −40°C to 100°C to meet extended-temperature deployment needs.
• Low-voltage Operation: 1.14 V to 1.26 V supply range supports modern low-voltage system architectures.
• On-chip RAM: Approximately 0.17 Mbits of embedded memory for buffering and localized data storage without external memory.
• Regulatory Compliance: RoHS compliant to support environmentally conscious manufacturing.

Why Choose LFXP2-5E-5FTN256I?

The LFXP2-5E-5FTN256I positions itself as a practical mid-range FPGA choice for industrial and embedded applications that require a combination of logic capacity, I/O density, and compact packaging. Its specified operating temperature range and RoHS compliance make it suitable for production deployments that demand environmental robustness and regulatory alignment.

This device is well suited for engineers and procurement teams building control systems, custom interfaces, or board-level logic consolidation where 5,000 logic elements, on-chip RAM, and 172 I/Os delivered in a 256-LBGA package meet project requirements.

Request a quote or submit a purchasing inquiry to get pricing and availability for the LFXP2-5E-5FTN256I and evaluate it for your next design.