LFXP2-40E-7FN484C

IC FPGA 363 I/O 484FBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 363 906240 40000 484-BBGA

Quantity 262 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O363Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits906240

Overview of LFXP2-40E-7FN484C – XP2 Field Programmable Gate Array (FPGA) IC 363 906240 40000 484-BBGA

The LFXP2-40E-7FN484C is a flash-based LatticeXP2 FPGA optimized for applications that require a balance of on-chip memory, DSP capability and high I/O density. It combines a LUT-based FPGA fabric with non-volatile flash configuration to deliver instant-on, reconfigurable logic suitable for commercial embedded systems and communication interfaces.

With approximately 40,000 logic elements, around 0.9 Mbits of embedded RAM and 363 I/O pins in a 484-ball BGA package, this device targets designs needing moderate logic capacity, integrated memory and flexible I/O in a compact surface-mount package.

Key Features

  • Core Logic — Approximately 40,000 logic elements implemented in the LatticeXP2 architecture for LUT-based, reconfigurable logic.
  • Embedded Memory — Total on-chip RAM of 906,240 bits (approximately 0.9 Mbits) plus distributed RAM resources for FIFOs and small data buffers.
  • sysDSP Blocks — Series-level support includes multiple sysDSP blocks and dedicated multipliers for high-performance multiply-accumulate operations (series documentation shows up to eight sysDSP blocks and up to 32 18×18 multipliers for XP2-40 devices).
  • I/O and Interfaces — 363 I/O pins with the series’ flexible I/O buffer support for LVCMOS, LVTTL, SSTL, HSTL, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS signaling and pre-engineered source-synchronous interfaces such as DDR/DDR2 and LVDS link support.
  • Configuration and Security — Flash-based flexiFLASH architecture provides instant-on and on-chip non-volatile storage; series features include Live Update technology with TransFR and support for secure updates using 128-bit AES encryption and dual-boot capability.
  • Clocking — Multiple analog PLLs supported at the family level to enable clock multiply/divide and phase shifting for system clock management.
  • Power — Operates from a nominal core voltage range of 1.14 V to 1.26 V, consistent with low-voltage FPGA designs.
  • Package & Mounting — 484-ball BGA package (supplier device package: 484-FPBGA, 23×23); surface-mount device suitable for compact PCB designs.
  • Temperature & Compliance — Commercial grade operating range of 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Embedded compute acceleration — Use the sysDSP blocks and dedicated multipliers for signal processing, filtering, and real-time math acceleration in embedded systems.
  • Interface bridging and protocol conversion — High I/O count and flexible I/O standards support DDR/DDR2 memory interfaces, LVDS display links and other source-synchronous interfaces for protocol bridging and interface glue logic.
  • Secure, field-updateable systems — Flash-based configuration with Live Update and 128-bit AES support enables secure remote updates and dual-boot configurations for devices requiring in-field reconfiguration.
  • High-density I/O control — 363 I/Os in a compact BGA package make the device suitable for applications that need many external signals, such as data acquisition, board-level control and peripheral aggregation.

Unique Advantages

  • Instant-on non-volatile architecture: Flash-based flexiFLASH provides immediate configuration at power-up and eliminates the need for external configuration memory for startup.
  • Balanced compute and memory: Nearly 0.9 Mbits of embedded RAM combined with distributed RAM resources supports both control-oriented logic and data buffering within the FPGA fabric.
  • High I/O density in a compact package: 363 I/Os in a 484-ball BGA (23×23) deliver broad external connectivity while keeping board footprint small.
  • Secure update capability: Series-level Live Update features with TransFR and 128-bit AES enable secure firmware/configuration management and dual-boot strategies.
  • Low-voltage core operation: Core supply range of 1.14 V to 1.26 V aligns with modern low-voltage power domains to help manage power budgets.
  • Commercial-grade availability and compliance: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance support standard commercial product deployments.

Why Choose LFXP2-40E-7FN484C?

The LFXP2-40E-7FN484C positions itself as a capable mid-range FPGA offering a strong combination of logic capacity, embedded memory and DSP resources in a high I/O-count BGA package. It is well suited to designers who need instant-on, reconfigurable logic with secure update capability and a wide range of I/O signaling options.

This device is appropriate for commercial embedded designs that demand flexible interface support, on-chip memory for buffering and acceleration, and a compact board-level footprint. The LatticeXP2 family ecosystem and series-level features provide scalable options for migration within the family.

If you would like pricing, availability or a formal quote for LFXP2-40E-7FN484C, request a quote or submit an inquiry to receive product and purchasing information.

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