LFXP2-40E-6FN672C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 540 906240 40000 672-BBGA |
|---|---|
| Quantity | 778 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 540 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5000 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 906240 |
Overview of LFXP2-40E-6FN672C – XP2 Field Programmable Gate Array (FPGA) IC 540 906240 40000 672-BBGA
The LFXP2-40E-6FN672C is a commercial-grade, flash-based FPGA that combines reconfigurable FPGA fabric with on-chip non-volatile memory. Built on the LatticeXP2 family architecture, this device delivers 40,000 logic elements, extensive I/O, and embedded memory for demanding embedded and communications applications. Its instant-on flash architecture and live-update capabilities address designs that require in‑field reconfiguration, secure updates, and compact system integration.
Key Features
- Logic Fabric — 40,000 logic elements for implementing complex custom logic and control functions.
- Embedded Memory — Approximately 0.91 Mbits of on-chip RAM (906,240 total bits) combining embedded and distributed memory for buffering, state storage, and data processing.
- I/O Capacity — Up to 540 user I/Os to support wide parallel interfaces, multi-channel connectivity and high-pin-count designs.
- sysDSP and Multipliers — sysDSP blocks and up to 32 18×18 multipliers for high-performance multiply-accumulate operations and DSP acceleration.
- flexiFLASH Architecture — Flash-based instant-on architecture with on-chip FlashBAK and serial TAG memory enabling non-volatile configuration and reconfigurability.
- Live Update and Security — Live Update technology with TransFR and 128-bit AES encryption for secure updates and dual-boot support.
- Clocking — Up to four analog PLLs for flexible clock multiply/divide and phase shifting to support diverse timing requirements.
- Package and Mounting — 672-ball fpBGA package (27 × 27 mm), surface-mount, optimized for high I/O density.
- Power and Temperature — Low-voltage operation with supply range 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C.
- Standards and Interfaces — Flexible I/O buffer support and pre-engineered source-synchronous interfaces (e.g., DDR/DDR2 and multi-channel LVDS options) as described for the LatticeXP2 family.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Embedded Systems — Implement control logic, protocol handling and custom interfaces where compact non-volatile configuration and reconfiguration are required.
- Communications Equipment — Support multi-channel I/O and DSP acceleration for packet processing, protocol bridging and timing-sensitive link interfaces.
- Display and Video Interfaces — Use pre-engineered source-synchronous interfaces and LVDS support for display timing, serialization, and deserialization tasks.
- Sensor and Data Acquisition — Aggregate high-channel-count sensor signals and perform on-chip buffering and DSP operations before passing data to system processors.
- Consumer and Industrial Control — Manage user interfaces, motor control logic, and system sequencing with instant-on capability and secure field updates.
Unique Advantages
- Instant-on, Non-Volatile Configuration: flexiFLASH architecture provides single-chip flash-based configuration, eliminating external configuration memory and enabling immediate startup.
- Secure Field Updates: Live Update with TransFR and 128-bit AES encryption supports secure in-field firmware updates and dual-boot strategies for reliability.
- High Integration Density: 40,000 logic elements and up to 540 I/Os reduce external components and simplify board-level design for complex systems.
- DSP Acceleration: sysDSP blocks and up to 32 18×18 multipliers enable efficient implementation of fixed-point DSP tasks and hardware-accelerated arithmetic.
- Flexible Clocking: Multiple analog PLLs provide on-chip clock management for multi-domain timing and interface requirements.
- Scalable Family Migration: LatticeXP2 family density migration is supported, aiding design scalability and product line planning.
Why Choose LFXP2-40E-6FN672C?
The LFXP2-40E-6FN672C combines flash-based non-volatile configuration, substantial logic capacity, and a large I/O complement to address embedded and communications designs that require secure, reconfigurable hardware. Its mix of embedded memory, DSP resources, and flexible clocking makes it appropriate for systems that need on-chip acceleration and high connectivity while keeping BOM complexity low.
This device is suited to design teams seeking a commercially graded FPGA with instant-on capability, secure update mechanisms, and a clear upgrade path within the LatticeXP2 family. The combination of on-chip flash, DSP blocks, and a 672-ball package supports dense, feature-rich system implementations with long-term design scalability.
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