LFXP2-40E-6FN672C

IC FPGA 540 I/O 672FPBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 540 906240 40000 672-BBGA

Quantity 778 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O540Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits906240

Overview of LFXP2-40E-6FN672C – XP2 Field Programmable Gate Array (FPGA) IC 540 906240 40000 672-BBGA

The LFXP2-40E-6FN672C is a commercial-grade, flash-based FPGA that combines reconfigurable FPGA fabric with on-chip non-volatile memory. Built on the LatticeXP2 family architecture, this device delivers 40,000 logic elements, extensive I/O, and embedded memory for demanding embedded and communications applications. Its instant-on flash architecture and live-update capabilities address designs that require in‑field reconfiguration, secure updates, and compact system integration.

Key Features

  • Logic Fabric — 40,000 logic elements for implementing complex custom logic and control functions.
  • Embedded Memory — Approximately 0.91 Mbits of on-chip RAM (906,240 total bits) combining embedded and distributed memory for buffering, state storage, and data processing.
  • I/O Capacity — Up to 540 user I/Os to support wide parallel interfaces, multi-channel connectivity and high-pin-count designs.
  • sysDSP and Multipliers — sysDSP blocks and up to 32 18×18 multipliers for high-performance multiply-accumulate operations and DSP acceleration.
  • flexiFLASH Architecture — Flash-based instant-on architecture with on-chip FlashBAK and serial TAG memory enabling non-volatile configuration and reconfigurability.
  • Live Update and Security — Live Update technology with TransFR and 128-bit AES encryption for secure updates and dual-boot support.
  • Clocking — Up to four analog PLLs for flexible clock multiply/divide and phase shifting to support diverse timing requirements.
  • Package and Mounting — 672-ball fpBGA package (27 × 27 mm), surface-mount, optimized for high I/O density.
  • Power and Temperature — Low-voltage operation with supply range 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C.
  • Standards and Interfaces — Flexible I/O buffer support and pre-engineered source-synchronous interfaces (e.g., DDR/DDR2 and multi-channel LVDS options) as described for the LatticeXP2 family.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Embedded Systems — Implement control logic, protocol handling and custom interfaces where compact non-volatile configuration and reconfiguration are required.
  • Communications Equipment — Support multi-channel I/O and DSP acceleration for packet processing, protocol bridging and timing-sensitive link interfaces.
  • Display and Video Interfaces — Use pre-engineered source-synchronous interfaces and LVDS support for display timing, serialization, and deserialization tasks.
  • Sensor and Data Acquisition — Aggregate high-channel-count sensor signals and perform on-chip buffering and DSP operations before passing data to system processors.
  • Consumer and Industrial Control — Manage user interfaces, motor control logic, and system sequencing with instant-on capability and secure field updates.

Unique Advantages

  • Instant-on, Non-Volatile Configuration: flexiFLASH architecture provides single-chip flash-based configuration, eliminating external configuration memory and enabling immediate startup.
  • Secure Field Updates: Live Update with TransFR and 128-bit AES encryption supports secure in-field firmware updates and dual-boot strategies for reliability.
  • High Integration Density: 40,000 logic elements and up to 540 I/Os reduce external components and simplify board-level design for complex systems.
  • DSP Acceleration: sysDSP blocks and up to 32 18×18 multipliers enable efficient implementation of fixed-point DSP tasks and hardware-accelerated arithmetic.
  • Flexible Clocking: Multiple analog PLLs provide on-chip clock management for multi-domain timing and interface requirements.
  • Scalable Family Migration: LatticeXP2 family density migration is supported, aiding design scalability and product line planning.

Why Choose LFXP2-40E-6FN672C?

The LFXP2-40E-6FN672C combines flash-based non-volatile configuration, substantial logic capacity, and a large I/O complement to address embedded and communications designs that require secure, reconfigurable hardware. Its mix of embedded memory, DSP resources, and flexible clocking makes it appropriate for systems that need on-chip acceleration and high connectivity while keeping BOM complexity low.

This device is suited to design teams seeking a commercially graded FPGA with instant-on capability, secure update mechanisms, and a clear upgrade path within the LatticeXP2 family. The combination of on-chip flash, DSP blocks, and a 672-ball package supports dense, feature-rich system implementations with long-term design scalability.

Request a quote or submit an inquiry to get pricing and availability information for the LFXP2-40E-6FN672C. Our team can provide lead-time details and help assess fit for your design requirements.

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