LFXP2-40E-6F672I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 540 906240 40000 672-BBGA |
|---|---|
| Quantity | 958 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 540 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5000 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 906240 |
Overview of LFXP2-40E-6F672I – XP2 Field Programmable Gate Array (FPGA) IC 540 906240 40000 672-BBGA
The LFXP2-40E-6F672I is a LatticeXP2 family FPGA combining a LUT-based programmable fabric with non-volatile flash-based configuration. It delivers a high-density programmable solution with approximately 40,000 logic elements, up to 540 I/Os and approximately 0.9 Mbits of embedded RAM for complex control, signal processing and interface tasks.
Built on the flexiFLASH architecture, the device targets industrial applications that require instant-on configuration, live update capability and robust I/O support. Its value proposition centers on integration of logic, DSP blocks, embedded memory and flexible I/O in a single 672-ball fpBGA package for space-constrained system designs.
Key Features
- flexiFLASH Architecture — Instant-on, infinitely reconfigurable single-chip flash configuration with FlashBAK and Serial TAG memory for on-chip storage and design security.
- Live Update & Security — TransFR live update technology with secure updates using 128-bit AES encryption and support for dual-boot with external SPI.
- Logic Density — Approximately 40,000 logic elements suitable for medium-to-high complexity designs.
- Embedded Memory — Total on-chip RAM of 906,240 bits (approximately 0.9 Mbits) plus distributed RAM resources for buffering and state storage.
- sysDSP and Multipliers — Up to eight sysDSP blocks and support for thirty-two 18×18 multipliers to accelerate multiply-accumulate workloads.
- Clocking — Up to four analog PLLs for clock multiply, divide and phase shifting.
- Flexible I/O — Wide I/O standard support including LVCMOS, SSTL, HSTL, PCI, LVDS and related differential standards; pre‑engineered source-synchronous interfaces and DDR/DDR2 support.
- Package & Mounting — 672-ball fpBGA (27 × 27 mm) package, surface-mount mounting for compact board integration.
- Power & Temperature — Supply voltage range 1.14 V to 1.26 V and industrial operating temperature range from −40 °C to 100 °C.
- Compliance — RoHS compliant.
Typical Applications
- Industrial Control — Implements complex control logic, motor drive interfaces and real-time signal conditioning using embedded memory and sysDSP blocks.
- High-Speed Interfaces — Enables DDR/DDR2 memory interfaces and source-synchronous links for data acquisition and communication endpoints.
- Video & Display Systems — Supports multi-lane LVDS and 7:1 LVDS display interfaces for imaging and display pipelines.
- Embedded Communications — Provides programmable protocol handling and XGMII-capable interfaces for networking and telecom subsystems.
Unique Advantages
- Instant-on, non-volatile configuration: Flash-based flexiFLASH enables immediate startup without external configuration memory, simplifying system power-up.
- Secure, field-updatable devices: Live Update and 128-bit AES encryption allow secure firmware updates and dual-boot strategies for safe in-field revision.
- DSP acceleration on-chip: sysDSP blocks and multiple 18×18 multipliers reduce external accelerator needs and speed numeric processing tasks.
- High I/O count in compact package: Up to 540 I/Os in a 672-ball fpBGA (27×27 mm) consolidates connectivity in space-constrained designs.
- Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in harsh environments.
- Comprehensive I/O standards: Broad support for single-ended and differential standards simplifies interfacing to a wide range of peripherals and memory devices.
Why Choose LFXP2-40E-6F672I?
The LFXP2-40E-6F672I combines a high logic element count, substantial embedded RAM and dedicated DSP resources with a flash-based configuration architecture to deliver a flexible, secure and field-updateable FPGA platform. Its combination of dense I/O, multiple PLLs and wide I/O standard support makes it well suited for industrial control, high-speed interface bridging and embedded signal processing applications.
Designed for customers who require integration, configurability and long-term maintainability, this device supports scalable designs that benefit from on-chip memory, DSP acceleration and secure update mechanisms while fitting into compact board footprints.
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