LFXP2-40E-6F484I

IC FPGA 363 I/O 484FBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 363 906240 40000 484-BBGA

Quantity 520 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O363Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits906240

Overview of LFXP2-40E-6F484I – XP2 Field Programmable Gate Array (FPGA) IC 363 906240 40000 484-BBGA

The LFXP2-40E-6F484I is a Lattice XP2 family FPGA that combines a LUT-based programmable fabric with non-volatile Flash-based configuration (flexiFLASH architecture). This device targets embedded and industrial applications that require high I/O count, substantial on-chip memory, and DSP capability for signal processing and control tasks.

With 40,000 logic elements, approximately 0.906 Mbits of on-chip RAM, and 363 I/Os in a 484-ball fpBGA package, the part delivers integration and reconfigurability for system-level designs where instant-on, secure updates and flexible interfaces matter.

Key Features

  • Core Logic — 40,000 logic elements for implementing complex combinational and sequential logic functions.
  • On-chip Memory — Approximately 906,240 bits of embedded RAM for buffering, state storage and local data processing.
  • DSP Resources — Family architecture provides sysDSP blocks and multiple 18×18 multipliers (XP2-40 family-level specification supports up to 32 18×18 multipliers) for high-performance multiply–accumulate operations.
  • I/O and Interfaces — 363 user I/Os supporting a wide range of I/O standards (as provided by the XP2 family) for display, memory and high-speed serial interfacing requirements.
  • Configuration and Security — Flash-based flexiFLASH architecture (instant-on, reconfigurable, single-chip) with family-level support for secure update technologies and dual-boot options.
  • Power — Operates from a nominal supply range of 1.14 V to 1.26 V suitable for low-voltage system designs.
  • Package & Mounting — 484-ball fpBGA (484-FPBGA, 23 × 23 mm) in a surface-mount package for compact PCB integration.
  • Operating Range & Compliance — Industrial-grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance.

Typical Applications

  • Industrial Control — Implement real-time control logic, sensor interfacing and deterministic I/O aggregation leveraging the device’s high I/O count and industrial temperature rating.
  • Signal Processing & DSP — Use embedded RAM and sysDSP resources with 18×18 multipliers for filtering, aggregation and arithmetic-heavy processing tasks.
  • Display & Interface Bridging — Support source-synchronous interfaces and multiple I/O standards for display controllers, camera interfaces and protocol bridging.
  • Embedded System Integration — Combine instant-on Flash configuration, dual-boot capability and abundant logic to integrate glue logic, bus interfaces and sub-system control into a single FPGA.

Unique Advantages

  • Flash-based instant-on architecture: flexiFLASH provides single-chip, non-volatile configuration for rapid startup and in-field reconfigurability.
  • High integration density: 40,000 logic elements and substantial on-chip RAM reduce external component count and simplify board-level design.
  • Strong DSP capability: sysDSP resources and numerous 18×18 multipliers support arithmetic-heavy workloads without external accelerators.
  • Ample I/O in compact package: 363 I/Os in a 23 × 23 mm fpBGA enable dense connectivity for high-pin-count applications while keeping PCB footprint small.
  • Designed for industrial environments: −40 °C to 100 °C operating range and RoHS compliance align with industrial deployment requirements.
  • Secure and flexible update options: Family-level Live Update technologies support secure firmware updates and dual-boot configurations for field maintainability.

Why Choose LFXP2-40E-6F484I?

This XP2 device balances programmable logic capacity, on-chip memory and DSP resources in a Flash-configured FPGA, making it well suited for embedded and industrial designs that require instant-on behavior, reconfigurability and secure update capabilities. Its high I/O count and compact 484-ball fpBGA footprint enable system designers to consolidate functions and simplify BOMs.

Engineers building control systems, signal-processing modules, interface bridges or dense embedded platforms will find this part a practical option for designs that need reliable operation across a wide temperature range and a vendor-backed FPGA architecture for long-term support and scalability.

Request a quote or submit a purchase inquiry to receive pricing and availability for the LFXP2-40E-6F484I.

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