LFXP2-40E-6F484I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 363 906240 40000 484-BBGA |
|---|---|
| Quantity | 520 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 363 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5000 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 906240 |
Overview of LFXP2-40E-6F484I – XP2 Field Programmable Gate Array (FPGA) IC 363 906240 40000 484-BBGA
The LFXP2-40E-6F484I is a Lattice XP2 family FPGA that combines a LUT-based programmable fabric with non-volatile Flash-based configuration (flexiFLASH architecture). This device targets embedded and industrial applications that require high I/O count, substantial on-chip memory, and DSP capability for signal processing and control tasks.
With 40,000 logic elements, approximately 0.906 Mbits of on-chip RAM, and 363 I/Os in a 484-ball fpBGA package, the part delivers integration and reconfigurability for system-level designs where instant-on, secure updates and flexible interfaces matter.
Key Features
- Core Logic — 40,000 logic elements for implementing complex combinational and sequential logic functions.
- On-chip Memory — Approximately 906,240 bits of embedded RAM for buffering, state storage and local data processing.
- DSP Resources — Family architecture provides sysDSP blocks and multiple 18×18 multipliers (XP2-40 family-level specification supports up to 32 18×18 multipliers) for high-performance multiply–accumulate operations.
- I/O and Interfaces — 363 user I/Os supporting a wide range of I/O standards (as provided by the XP2 family) for display, memory and high-speed serial interfacing requirements.
- Configuration and Security — Flash-based flexiFLASH architecture (instant-on, reconfigurable, single-chip) with family-level support for secure update technologies and dual-boot options.
- Power — Operates from a nominal supply range of 1.14 V to 1.26 V suitable for low-voltage system designs.
- Package & Mounting — 484-ball fpBGA (484-FPBGA, 23 × 23 mm) in a surface-mount package for compact PCB integration.
- Operating Range & Compliance — Industrial-grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance.
Typical Applications
- Industrial Control — Implement real-time control logic, sensor interfacing and deterministic I/O aggregation leveraging the device’s high I/O count and industrial temperature rating.
- Signal Processing & DSP — Use embedded RAM and sysDSP resources with 18×18 multipliers for filtering, aggregation and arithmetic-heavy processing tasks.
- Display & Interface Bridging — Support source-synchronous interfaces and multiple I/O standards for display controllers, camera interfaces and protocol bridging.
- Embedded System Integration — Combine instant-on Flash configuration, dual-boot capability and abundant logic to integrate glue logic, bus interfaces and sub-system control into a single FPGA.
Unique Advantages
- Flash-based instant-on architecture: flexiFLASH provides single-chip, non-volatile configuration for rapid startup and in-field reconfigurability.
- High integration density: 40,000 logic elements and substantial on-chip RAM reduce external component count and simplify board-level design.
- Strong DSP capability: sysDSP resources and numerous 18×18 multipliers support arithmetic-heavy workloads without external accelerators.
- Ample I/O in compact package: 363 I/Os in a 23 × 23 mm fpBGA enable dense connectivity for high-pin-count applications while keeping PCB footprint small.
- Designed for industrial environments: −40 °C to 100 °C operating range and RoHS compliance align with industrial deployment requirements.
- Secure and flexible update options: Family-level Live Update technologies support secure firmware updates and dual-boot configurations for field maintainability.
Why Choose LFXP2-40E-6F484I?
This XP2 device balances programmable logic capacity, on-chip memory and DSP resources in a Flash-configured FPGA, making it well suited for embedded and industrial designs that require instant-on behavior, reconfigurability and secure update capabilities. Its high I/O count and compact 484-ball fpBGA footprint enable system designers to consolidate functions and simplify BOMs.
Engineers building control systems, signal-processing modules, interface bridges or dense embedded platforms will find this part a practical option for designs that need reliable operation across a wide temperature range and a vendor-backed FPGA architecture for long-term support and scalability.
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