LFXP2-40E-5FN672C

The LFXP2-40E-5FN672C is a flash-based FPGA device built on the LatticeXP2 family flexiFLASH architecture. It combines a LUT-based programmable fabric with non-volatile on-chip flash and live-update capabilities for designs that require instant-on behavior, reconfigurability, and secure field updates.

With 40,000 logic elements, approximately 0.9 Mbits of embedded memory, and up to 540 I/O in a 672-ball BGA package, this commercial-grade device targets embedded systems and communication and display applications that need a high I/O count and on-chip memory integration while operating within a 1.14 V–1.26 V supply and 0 °C–85 °C temperature range.

Key Features

• Programmable Fabric and Architecture FlexiFLASH architecture provides instant-on, single-chip flash-based configuration with reconfigurability and on-chip FlashBAK storage features described for the LatticeXP2 family.
• Logic Capacity 40,000 logic elements to implement mid- to high-density FPGA logic functions.
• Embedded Memory Approximately 0.9 Mbits of total on-chip RAM (as specified), supporting both embedded block RAM and distributed RAM usage.
• sysDSP and Multiply Resources Family-level sysDSP block support with multiple 18×18 multipliers (family documentation shows up to 32 multipliers for XP2-40 devices), enabling multiply-accumulate and DSP-oriented functions.
• High I/O Count and Flexible I/O Standards Up to 540 I/O pins with sysIO buffer support for standards listed in the family datasheet (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS), enabling diverse interface options.
• Memory and Interface Support Pre-engineered source-synchronous interfaces including DDR/DDR2 support (up to 200 MHz) and multi-lane LVDS display links for camera and display applications (family-level capabilities).
• Package and Mounting 672-ball fpBGA package (27 × 27 mm) optimized for surface-mount assembly and high I/O density.
• Power and Temperature Operates from 1.14 V to 1.26 V supply rails and specified for commercial temperature range 0 °C to 85 °C.
• Compliance RoHS compliant.

Typical Applications

• Display and Video Interfaces Use the device’s high I/O count and LVDS-capable interfaces for display timing, panel bridging, and multi-lane video links.
• Memory Interface and Bridge Logic Implement DDR/DDR2 controller interfaces and memory bridging where on-chip logic and embedded RAM reduce external component count.
• Communications and Network Processing Deploy the FPGA’s DSP and multiplier resources along with flexible I/O for protocol handling, packet processing, and interface adaptation.
• Embedded Control and Field Update Systems Take advantage of flash configuration and Live Update features for systems requiring secure updates and dual-boot capabilities at the system level.

Unique Advantages

• Highly integrated logic and I/O: 40,000 logic elements with up to 540 I/O in a single 672-ball BGA package reduces external glue logic and enables compact board layouts.
• Flash-based instant-on architecture: On-chip flash configuration delivers instant-on operation and simplifies system boot and configuration management.
• Substantial on-chip memory: Approximately 0.9 Mbits of embedded RAM supports buffering, packet queues, and local storage without relying entirely on external memory.
• DSP-friendly resources: Family DSP blocks and multiple 18×18 multipliers enable efficient implementation of multiply-accumulate and signal processing tasks.
• Flexible interface support: Broad I/O standard compatibility enables a wide range of interfaces—from single-ended LVCMOS to LVDS and high-speed source-synchronous links.
• Commercial-grade operating range: Designed for standard commercial environments with a 0 °C–85 °C rating and RoHS compliance for broad market applicability.

Why Choose LFXP2-40E-5FN672C?

The LFXP2-40E-5FN672C positions itself as a mid-to-high density flash FPGA that balances substantial logic capacity, on-chip memory, DSP resources, and one of the highest I/O counts available in the LatticeXP2 family. Its flash-based flexiFLASH architecture and family-level Live Update technologies support designs that require on-device non-volatile configuration and secure update strategies.

This device is well suited to engineers building compact embedded systems, display or communications interfaces, and memory-interfacing logic that benefit from integrated RAM, flexible I/O standards, and the package density of a 672-ball fpBGA. The combination of logic, memory, and interface capability provides a scalable platform with vendor-documented family-level tools and IP support.

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