LFXP2-40E-5F672I

The LFXP2-40E-5F672I is a Lattice XP2 family Field Programmable Gate Array (FPGA) supplied in a 672-ball FPBGA package and specified for industrial use. It combines a LUT-based FPGA fabric with non-volatile flash-based configuration (flexiFLASH architecture) to deliver instant-on operation, reconfigurability and on-chip non-volatile storage.

Designed for systems that require high I/O density, embedded memory and DSP acceleration, this device targets industrial and embedded applications that benefit from secure updates, clocking flexibility and a compact surface-mount 27 × 27 mm package.

Key Features

• Core Logic  40,000 logic elements provide substantial programmable fabric for glue logic, protocol adapters and custom processing pipelines.
• Embedded Memory  Approximately 0.9 Mbits (906,240 total RAM bits) of on-chip memory for FIFOs, buffers and local data storage.
• sysDSP Blocks & Multipliers  Device family sysDSP resources (XP2-40 class) include multiple DSP blocks and up to 32 18×18 multipliers for multiply–accumulate and signal processing functions.
• I/O Capacity & Standards  540 I/Os support a wide range of interfaces and high-pin-count system designs; flexible I/O buffer support is available across the XP2 family.
• Configuration & Security  flexiFLASH architecture with FlashBAK and serial TAG memory enables instant-on, infinite reconfiguration and design security; family-level Live Update technology supports secure updates and dual-boot schemes.
• Clocking  Multiple analog PLLs provide clock multiply/divide and phase shifting to support complex timing and source-synchronous interfaces.
• Power & Temperature  Operates from a 1.14 V to 1.26 V supply range and is specified for an industrial operating temperature range of −40 °C to 100 °C.
• Package & Mounting  672-ball fpBGA (27 × 27 mm) surface-mount package suitable for high-density board layouts and compact systems.

Typical Applications

• Industrial Control and Automation  Use the device for deterministic control logic, I/O aggregation and real-time data handling where industrial temperature range and ruggedness are required.
• Memory and Interface Bridging  Implement DDR/DDR2 interfaces and protocol translation using the device’s memory resources and pre‑engineered source-synchronous interfaces.
• Display and Video Interfaces  Support display applications with high-speed serial and LVDS-friendly I/O, including pre‑engineered 7:1 LVDS interfaces referenced in the family documentation.
• DSP-Accelerated Processing  Leverage the sysDSP blocks and 18×18 multipliers for signal processing, filtering and MAC-heavy workloads.

Unique Advantages

• Instant-on Non-volatile Architecture: flexiFLASH-based configuration provides immediate startup without external volatile configuration loads.
• High I/O Density: 540 I/Os enable complex multi-channel systems and dense interface routing in a single device.
• Integrated DSP Resources: Multiple sysDSP blocks and a large complement of multipliers reduce external DSP components and simplify signal-processing designs.
• Secure Update Options: Live Update features, including secure update capability and dual-boot support, help maintain field-updatable designs with encryption options noted in the family documentation.
• Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports demanding environmental deployments.
• Compact, High-Density Package: 672-ball fpBGA (27 × 27 mm) surface-mount package offers a compact footprint for space-constrained systems.

Why Choose LFXP2-40E-5F672I?

The LFXP2-40E-5F672I pairs a large FPGA fabric (40,000 logic elements) with substantial on-chip memory and DSP resources in a compact, industrial-grade fpBGA package. Its flash-based configuration and family-level Live Update and security features make it a strong choice for embedded systems that require reliable instant-on behavior, field reconfigurability and secure firmware management.

This device is suited to developers and system designers building industrial controls, high-speed interface adapters, display controllers and DSP-accelerated subsystems who need a highly integrated FPGA solution with wide I/O and industrial temperature capability.

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