LFXP2-40E-5F672C

The LFXP2-40E-5F672C is a commercial-grade XP2 FPGA featuring a flash-based flexiFLASH architecture and on-chip configuration capabilities. It delivers 40,000 logic elements, up to 540 I/Os and approximately 0.906 Mbits of on-chip RAM in a 672-ball fpBGA (27 × 27 mm) package, making it suitable for applications that require dense I/O, embedded memory and in-field reconfiguration.

Built for systems that need instant-on operation, secure updates and DSP-accelerated functions, this device targets equipment in consumer and communications segments where reconfigurability, integrated memory and flexible interfaces are important.

Key Features

• flexiFLASH Architecture & Configuration  Instant-on operation and infinitely reconfigurable single-chip flash-based configuration with on-chip FlashBAK and serial TAG memory for retained configuration and design security.
• Live Update & Security  Supports Live Update technology (TransFR) with secure updates and 128-bit AES encryption and dual-boot image capability for reliable field firmware management.
• Logic and DSP  Approximately 40,000 logic elements and multiple sysDSP blocks with up to 32 18×18 multipliers for multiply-accumulate workloads and accelerated signal processing.
• Embedded and Distributed Memory  Approximately 906,240 bits of on-chip RAM (embedded and distributed) for frame buffering, packet buffering or local data storage.
• I/O Flexibility  Up to 540 I/Os with support for a wide range of standards including LVCMOS, LVTTL, SSTL, HSTL, PCI and multiple differential interfaces (LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS) as provided by the XP2 family.
• Pre-engineered Interfaces  Pre-engineered source-synchronous interfaces including DDR/DDR2 memory interfaces and multi-lane LVDS for display and high-speed I/O implementations.
• Clocking  Multiple analog PLLs available for clock multiply/divide and phase shifting to support complex timing architectures.
• Power and Temperature  Operates from a 1.14 V to 1.26 V supply and is specified for commercial operation from 0 °C to 85 °C.
• Package and Mounting  672-ball fpBGA (27 × 27 mm) package, surface-mount mounting for compact board designs.
• Regulatory  RoHS compliant.

Typical Applications

• Display and Video Interfaces  Use the device’s multi-lane LVDS support and pre-engineered display interfaces for video transport, timing and framebuffer control in display systems.
• Memory-Interfaced Systems  Implement DDR/DDR2 host interfaces and local buffering using on-chip RAM for embedded controllers and communications equipment.
• Signal Processing and Acceleration  Deploy sysDSP blocks and 18×18 multipliers for real-time signal processing, filtering and other DSP tasks.
• Secure Field Upgrades  Leverage Live Update with 128-bit AES encryption and dual-boot capability to manage secure firmware updates in deployed products.

Unique Advantages

• Integrated Non-volatile Configuration: flash-based flexiFLASH provides instant-on and in-field reconfiguration without external volatile configuration memory.
• High I/O Count in Compact Package: up to 540 I/Os in a 672-ball fpBGA (27 × 27 mm) package enables dense connectivity while minimizing board area.
• Built-in DSP Resources: multiple sysDSP blocks and up to 32 18×18 multipliers reduce the need for external DSP chips in compute-intensive designs.
• Secure Update Path: TransFR live update and AES encryption support protected field image management for long-life products.
• Commercial Temperature Range and Low-Voltage Operation: specified for 0 °C to 85 °C operation with a 1.14–1.26 V supply to match modern low-voltage system rails.
• RoHS Compliance: meets RoHS requirements for environmentally constrained designs.

Why Choose LFXP2-40E-5F672C?

The LFXP2-40E-5F672C combines a flash-based XP2 architecture with substantial logic density (40,000 logic elements), large I/O capacity (540 pins) and nearly 0.906 Mbits of on-chip RAM to deliver a versatile FPGA for designs that require reconfigurability, secure updates and DSP acceleration. Its 672-ball fpBGA package and surface-mount form factor support compact, production-ready board layouts while the commercial temperature rating fits a wide range of consumer and communications products.

This device is well suited for engineers building systems that need integrated memory and DSP resources, flexible high-speed interfaces and a secure, field-updateable configuration model. It offers a balance of performance, integration and system-level features that support scalable product development within the XP2 family roadmap.

Request a quote or submit your requirements to receive pricing and availability for LFXP2-40E-5F672C. Our team can provide lead-time and ordering details to support your design timeline.