LFXP2-30E-7FT256C

The LFXP2-30E-7FT256C is a commercial-grade FPGA IC from Lattice Semiconductor based on the LatticeXP2 family flexiFLASH architecture. It combines a LUT-based FPGA fabric with non-volatile on-chip Flash, supporting instant-on operation, reconfigurability and on-chip embedded memory for a wide range of commercial embedded and interface applications.

Designed for applications that require dense logic, DSP capability and flexible I/O, this device provides 29,000 logic elements, approximately 0.387 Mbits of embedded memory, and up to 201 I/Os in a compact 256-ball ftBGA (17 × 17 mm) package.

Key Features

• Core Architecture LUT-based FPGA fabric combined with flexiFLASH non-volatile on-chip Flash cells for instant-on and infinitely reconfigurable single-chip operation.
• Logic Capacity 29,000 logic elements suitable for medium-density designs and logic-intensive functions.
• Embedded Memory Total on-chip RAM of 396,288 bits (approximately 0.387 Mbits) with both embedded and distributed memory resources.
• DSP Resources (sysDSP) sysDSP blocks optimized for high-performance multiply‑accumulate operations; XP2-30 devices provide 7 sysDSP blocks and up to 28 18×18 multipliers.
• I/O and Interface Support Up to 201 I/Os with flexible sysIO buffer support for a wide range of standards; pre‑engineered source-synchronous interfaces include DDR/DDR2 (up to 200 MHz) and 7:1 LVDS for display applications.
• Clocking Up to four analog PLLs for clock multiply, divide and phase shifting needs.
• Configuration & Security flexiFLASH with FlashBAK embedded block memory, serial TAG memory, TransFR Live Update technology and 128-bit AES encryption support for secure updates and dual-boot capability.
• Power & Temperature Operates from 1.14 V to 1.26 V supply rail and rated for commercial operating temperature from 0 °C to 85 °C.
• Package & Mounting 256-ball ftBGA (256-LBGA) surface mount package, supplier device package 256-FTBGA (17 × 17 mm), RoHS compliant.

Typical Applications

• Interface Bridging and Protocol Conversion Use the device’s flexible I/O and pre‑engineered source-synchronous interfaces to implement DDR/DDR2 interfaces and multi-standard signal bridging.
• High-Speed Display and Imaging 7:1 LVDS support and abundant I/Os make the device suitable for display interface and imaging pipeline tasks.
• Signal Processing and Acceleration sysDSP blocks and 18×18 multipliers accelerate multiply‑accumulate operations for DSP kernels and real-time data processing.
• Embedded Control and Custom Logic 29,000 logic elements and on-chip non-volatile configuration support embedded control, state machines and user interface engines in commercial products.

Unique Advantages

• Instant-on non-volatile configuration: flexiFLASH architecture integrates on-chip Flash for immediate startup without external configuration memory.
• Balanced logic and memory resources: 29,000 logic elements combined with approximately 0.387 Mbits of embedded memory support moderate complexity designs with local storage.
• Dedicated DSP capability: sysDSP blocks and multiple 18×18 multipliers provide hardware-accelerated MAC operations for compute-intensive tasks.
• Flexible I/O in a compact package: Up to 201 I/Os in a 256-ball ftBGA (17 × 17 mm) enable high pin-count designs in a small footprint.
• Secure field updates: Live Update with TransFR and 128-bit AES encryption supports secure dual-boot and field-reconfigurable updates.
• Commercial temperature and low-voltage operation: 0 °C to 85 °C rating and 1.14–1.26 V supply accommodate standard commercial embedded system environments.

Why Choose LFXP2-30E-7FT256C?

The LFXP2-30E-7FT256C positions itself as a flexible, mid-density FPGA solution for commercial embedded and interface-focused designs that need non-volatile instant-on configuration, DSP acceleration and versatile I/O. With 29,000 logic elements, sysDSP resources, and approximately 0.387 Mbits of embedded memory, it provides a balanced platform for signal processing, interface bridging and custom logic implementations.

Its compact 256-ball ftBGA package and up to 201 I/Os let designers integrate significant functionality while maintaining a small board footprint, and built-in security and Live Update capabilities support field reconfiguration and secure firmware management within commercial product lifecycles.

Request a quote or submit an inquiry to get pricing and availability for the LFXP2-30E-7FT256C. Our team can help confirm part suitability for your project requirements and supply needs.