LFXP2-30E-7FTN256C

IC FPGA 201 I/O 256FTBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 201 396288 29000 256-LBGA

Quantity 530 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O201Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3625Number of Logic Elements/Cells29000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits396288

Overview of LFXP2-30E-7FTN256C – XP2 Field Programmable Gate Array (FPGA) IC, 201 I/O, 396,288 bits RAM, 29,000 logic elements, 256-LBGA

The LFXP2-30E-7FTN256C is a flash-based FPGA from the LatticeXP2 family designed for mid-density embedded logic and interface applications. Built on the flexiFLASH architecture, it combines non-volatile on-chip configuration, a rich FPGA fabric and dedicated DSP/multiplier resources to deliver instant-on, reconfigurable logic in a compact 256-ball BGA package.

Targeted at applications that require a balance of logic capacity, on-chip memory and multiple I/O, this device provides 29,000 logic elements, approximately 396 kbits of embedded memory and 201 user I/Os while operating over a low-voltage supply range and standard commercial temperature range.

Key Features

  • Core Architecture — flexiFLASH instant-on: Flash-based FPGA fabric enabling instant-on configuration, infinite reprogrammability and on-chip non-volatile storage.
  • Logic Capacity: 29,000 logic elements suitable for mid-density designs and function integration on a single chip.
  • Embedded Memory: Approximately 396,288 bits of on-chip RAM for embedded and distributed memory needs within the FPGA fabric.
  • sysDSP and Multipliers: Family-level sysDSP block support and multiple 18×18 multiplier resources for high-performance multiply-accumulate operations (as provided in the LatticeXP2 family).
  • I/O Flexibility: 201 user I/Os supported in the 256-ball ftBGA (17×17 mm) package for diverse interface requirements.
  • Configuration & Security: Live Update and TransFR technologies with secure update capability and 128-bit AES encryption support as part of the LatticeXP2 family feature set.
  • Clocking: Integrated PLLs (sysCLOCK) provide clock multiply/divide and phase shifting functionality across the family.
  • Power: Low-voltage core operation with a specified supply range of 1.14 V to 1.26 V.
  • Package & Mounting: Surface-mount 256-LBGA (supplier device package: 256-FTBGA, 17×17 mm) for compact board integration.
  • Commercial Grade & Environmental: Commercial operating temperature range of 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Video & Display Interfaces: Pre-engineered source-synchronous and LVDS interface support in the LatticeXP2 family makes this device suitable for display bridging and video interface buffering.
  • High-Performance DSP Functions: sysDSP blocks and multiple multipliers enable multiply-accumulate workloads and signal processing tasks.
  • Memory and Interface Bridging: On-chip embedded RAM and flexible I/O support are well suited for DDR/DDR2 interface logic and protocol bridging.
  • Secure, Field-Updatable Systems: flexiFLASH with Live Update and AES-based secure update mechanisms support designs that require field reconfiguration and secure firmware updates.

Unique Advantages

  • Integrated Non-Volatile Configuration: Flash-based flexiFLASH architecture removes external configuration flash dependence and delivers instant-on behavior.
  • Balanced Mid-Density Resource Set: 29,000 logic elements, ~396 kbits of embedded RAM and 201 I/Os in a compact 256-ball BGA reduce board-level component count while enabling complex designs.
  • Dedicated DSP Capability: Family sysDSP blocks and multiplier resources accelerate math-heavy functions, simplifying implementation of signal processing algorithms.
  • Low-Voltage Core: Operation within a 1.14–1.26 V supply window supports low-power system design considerations.
  • Secure Update Path: Live Update and 128-bit AES encryption allow controlled, secure remote updates and dual-boot configurations (family-level features).
  • Proven Toolchain Support: The LatticeXP2 family is supported by the vendor’s design software and IP ecosystem to streamline synthesis, place-and-route and IP integration (as described in the family data).

Why Choose LFXP2-30E-7FTN256C?

The LFXP2-30E-7FTN256C positions itself as a mid-density, flash-based FPGA option that integrates substantial logic capacity, embedded memory and flexible I/O within a compact 256-ball BGA. Its flash configuration and family-level Live Update/security features make it a practical choice for designs that require instant-on behavior and secure field reconfigurability.

This device is well suited to engineers building systems that combine interface bridging, embedded processing and DSP workloads, where reducing BOM and simplifying board-level configuration are priorities. Backed by the LatticeXP2 family design resources, it offers a clear upgrade path and ecosystem support for scalable FPGA deployments.

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