LFXP2-30E-7FN484C

IC FPGA 363 I/O 484FBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 363 396288 29000 484-BBGA

Quantity 264 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O363Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3625Number of Logic Elements/Cells29000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits396288

Overview of LFXP2-30E-7FN484C – XP2 Field Programmable Gate Array (FPGA) IC 363 396288 29000 484-BBGA

The LFXP2-30E-7FN484C is a commercial-grade FPGA from Lattice Semiconductor's LatticeXP2 family, combining a reconfigurable logic fabric with on-chip non-volatile configuration capabilities. It delivers a balanced mix of logic capacity, on-chip RAM and high-density I/O in a 484-ball BGA package for applications that require compact, reprogrammable system logic.

Typical use cases include embedded control, interface bridging and signal processing where dense I/O and moderate embedded memory are required. The device supports the family’s flash-based architecture and system-level features documented for the LatticeXP2 series.

Key Features

  • Logic Capacity  Provides 29,000 logic elements for implementing complex combinational and sequential logic functions.
  • On‑Chip Memory  Total RAM of 396,288 bits (≈396 kbits) for embedded data storage and buffering within user designs.
  • High‑Density I/O  Up to 363 user I/O pins in a 484-ball package to support multiple parallel interfaces and peripherals.
  • Flash‑based Architecture (LatticeXP2 family)  Family-level flexiFLASH architecture supports instant-on, reconfigurability and on‑chip non-volatile configuration storage.
  • DSP and Multiply Resources (family capability)  LatticeXP2 family includes sysDSP blocks and 18×18 multiplier support for common MAC and signal-processing tasks.
  • Flexible I/O Standards (family capability)  Family-level sysIO buffer options support a range of interface standards for source-synchronous and differential signaling.
  • Package & Mounting  484-BBGA surface-mount package (484-FPBGA, 23 × 23 mm physical package) for dense board-level integration.
  • Power & Operating Range  Rated supply voltage range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant for lead-free manufacturing processes.

Typical Applications

  • Embedded Control  Implements control logic, state machines and protocol handling for industrial and consumer embedded systems using onboard logic and RAM.
  • Interface Bridging  Serves as a protocol bridge or interface hub where dense I/O (363 pins) and reconfigurable logic simplify board-level integration.
  • Signal Processing  Supports moderate DSP tasks and MAC operations leveraging the LatticeXP2 family’s sysDSP and multiplier resources for filtering, aggregation or preprocessing.
  • Display and Video Front‑End  Family-level support for source-synchronous and differential interfaces enables use in display timing, formatting and related front-end logic.

Unique Advantages

  • Reconfigurable, Non‑volatile Architecture:  Family flexiFLASH technology enables instant-on behavior and on-chip non-volatile configuration storage, reducing external configuration complexity.
  • Balanced Compute and Memory:  29,000 logic elements paired with ~396 kbits of on-chip RAM provide headroom for complex logic with local buffering and state retention.
  • High I/O Density:  363 I/O pins in a compact 484-ball fpBGA package allow integration of multiple high-pin-count interfaces without a large PCB footprint.
  • Commercial Temperature Suitability:  Specified for 0 °C to 85 °C operation to match a wide range of commercial embedded applications.
  • Low‑profile Surface Mount Package:  484-BBGA surface-mount packaging supports high-density board designs and automated assembly.
  • RoHS Compliant:  Meets lead-free manufacturing requirements for modern production environments.

Why Choose LFXP2-30E-7FN484C?

The LFXP2-30E-7FN484C positions itself as a versatile, flash-configurable FPGA for designers who need substantial logic capacity, significant on-chip RAM and abundant I/O in a compact surface-mount package. Its alignment with the LatticeXP2 family features—flash-based configuration, DSP resources and flexible I/O—makes it suitable for designs that require reprogrammability and system-level flexibility without external configuration complexity.

This part is ideal for engineers developing embedded systems, interface controllers and signal-processing front ends that benefit from reconfigurable hardware, dense connectivity and commercial-grade operating parameters. The combination of logic, memory and I/O density delivers long-term design scalability while leveraging the documented LatticeXP2 family features for integration and system support.

Request a quote or submit an inquiry for pricing and availability to evaluate LFXP2-30E-7FN484C for your next design.

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