LFXP2-30E-7FN484C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 363 396288 29000 484-BBGA |
|---|---|
| Quantity | 264 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 363 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3625 | Number of Logic Elements/Cells | 29000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 396288 |
Overview of LFXP2-30E-7FN484C – XP2 Field Programmable Gate Array (FPGA) IC 363 396288 29000 484-BBGA
The LFXP2-30E-7FN484C is a commercial-grade FPGA from Lattice Semiconductor's LatticeXP2 family, combining a reconfigurable logic fabric with on-chip non-volatile configuration capabilities. It delivers a balanced mix of logic capacity, on-chip RAM and high-density I/O in a 484-ball BGA package for applications that require compact, reprogrammable system logic.
Typical use cases include embedded control, interface bridging and signal processing where dense I/O and moderate embedded memory are required. The device supports the family’s flash-based architecture and system-level features documented for the LatticeXP2 series.
Key Features
- Logic Capacity Provides 29,000 logic elements for implementing complex combinational and sequential logic functions.
- On‑Chip Memory Total RAM of 396,288 bits (≈396 kbits) for embedded data storage and buffering within user designs.
- High‑Density I/O Up to 363 user I/O pins in a 484-ball package to support multiple parallel interfaces and peripherals.
- Flash‑based Architecture (LatticeXP2 family) Family-level flexiFLASH architecture supports instant-on, reconfigurability and on‑chip non-volatile configuration storage.
- DSP and Multiply Resources (family capability) LatticeXP2 family includes sysDSP blocks and 18×18 multiplier support for common MAC and signal-processing tasks.
- Flexible I/O Standards (family capability) Family-level sysIO buffer options support a range of interface standards for source-synchronous and differential signaling.
- Package & Mounting 484-BBGA surface-mount package (484-FPBGA, 23 × 23 mm physical package) for dense board-level integration.
- Power & Operating Range Rated supply voltage range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant for lead-free manufacturing processes.
Typical Applications
- Embedded Control Implements control logic, state machines and protocol handling for industrial and consumer embedded systems using onboard logic and RAM.
- Interface Bridging Serves as a protocol bridge or interface hub where dense I/O (363 pins) and reconfigurable logic simplify board-level integration.
- Signal Processing Supports moderate DSP tasks and MAC operations leveraging the LatticeXP2 family’s sysDSP and multiplier resources for filtering, aggregation or preprocessing.
- Display and Video Front‑End Family-level support for source-synchronous and differential interfaces enables use in display timing, formatting and related front-end logic.
Unique Advantages
- Reconfigurable, Non‑volatile Architecture: Family flexiFLASH technology enables instant-on behavior and on-chip non-volatile configuration storage, reducing external configuration complexity.
- Balanced Compute and Memory: 29,000 logic elements paired with ~396 kbits of on-chip RAM provide headroom for complex logic with local buffering and state retention.
- High I/O Density: 363 I/O pins in a compact 484-ball fpBGA package allow integration of multiple high-pin-count interfaces without a large PCB footprint.
- Commercial Temperature Suitability: Specified for 0 °C to 85 °C operation to match a wide range of commercial embedded applications.
- Low‑profile Surface Mount Package: 484-BBGA surface-mount packaging supports high-density board designs and automated assembly.
- RoHS Compliant: Meets lead-free manufacturing requirements for modern production environments.
Why Choose LFXP2-30E-7FN484C?
The LFXP2-30E-7FN484C positions itself as a versatile, flash-configurable FPGA for designers who need substantial logic capacity, significant on-chip RAM and abundant I/O in a compact surface-mount package. Its alignment with the LatticeXP2 family features—flash-based configuration, DSP resources and flexible I/O—makes it suitable for designs that require reprogrammability and system-level flexibility without external configuration complexity.
This part is ideal for engineers developing embedded systems, interface controllers and signal-processing front ends that benefit from reconfigurable hardware, dense connectivity and commercial-grade operating parameters. The combination of logic, memory and I/O density delivers long-term design scalability while leveraging the documented LatticeXP2 family features for integration and system support.
Request a quote or submit an inquiry for pricing and availability to evaluate LFXP2-30E-7FN484C for your next design.

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