LFXP2-30E-6FTN256C

IC FPGA 201 I/O 256FTBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 201 396288 29000 256-LBGA

Quantity 102 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O201Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3625Number of Logic Elements/Cells29000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits396288

Overview of LFXP2-30E-6FTN256C – XP2 Field Programmable Gate Array (FPGA) IC 201 396288 29000 256-LBGA

The LFXP2-30E-6FTN256C is a LatticeXP2 family FPGA combining a LUT-based programmable fabric with non-volatile flash configuration (flexiFLASH) for instant-on, reconfigurable operation. It targets commercial embedded designs that require moderate I/O density, on-chip memory, DSP capability and secure update features.

Key value propositions include a balanced logic and DSP resource set, flexible I/O support, and integrated memory and configuration features that simplify system design and field updates.

Key Features

  • Core Logic  Approximately 29,000 logic elements implemented across 3,625 CLB blocks, providing programmable logic capacity for medium-complexity designs.
  • Embedded Memory  Approximately 0.396 Mbits of on-chip RAM (396,288 total bits) for embedded storage and buffering.
  • sysDSP Blocks & Multipliers  Includes sysDSP resources (seven sysDSP blocks for the XP2-30 family) and a collection of 18×18 multipliers for high-performance multiply-accumulate functions.
  • Clocking  Supports up to four PLLs for clock multiply/divide and phase shifting to manage multiple clock domains.
  • Flexible I/O  Supports a wide range of I/O standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS) to interface with memory, displays and high-speed peripherals.
  • Configuration & Security  flexiFLASH architecture with instant-on and reconfigurability, FlashBAK embedded block memory, Serial TAG memory, and Live Update technologies including TransFR, dual-boot and 128-bit AES secure update support.
  • I/O Count & Package  201 user I/Os in a 256-ball ftBGA footprint (supplier package: 256-FTBGA, 17 × 17 mm) with surface-mount mounting.
  • Power & Temperature  Operating VCC range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
  • Environmental  RoHS compliant.

Typical Applications

  • Display and Video Interfaces  Pre‑engineered source-synchronous and LVDS support make this device suitable for display interface and video pipeline tasks.
  • Memory Interfaces  DDR/DDR2 source-synchronous interfaces and flexible I/O standards enable use as a bridge or controller for memory subsystems.
  • Embedded Signal Processing  sysDSP blocks and on-chip multipliers accelerate multiply-accumulate workloads for filtering, sensor fusion, and protocol processing.
  • Secure Field Updates  Live Update features with AES encryption and dual-boot capability enable secure in-field firmware and configuration management.

Unique Advantages

  • Instant-on, reconfigurable architecture: flexiFLASH delivers non-volatile configuration for immediate startup and repeated reconfiguration without external configuration memory.
  • Balanced compute and memory: A combination of ~29,000 logic elements and ~0.396 Mbits of embedded RAM supports control, buffering and mid-sized processing tasks on a single device.
  • DSP acceleration on-chip: sysDSP blocks and dedicated multipliers reduce external component count and offload math-intensive functions from the host processor.
  • Broad I/O flexibility: Multi-standard I/O buffer support eases interfacing with a wide variety of peripherals and high-speed links.
  • Secure update and dual-boot: Integrated Live Update and encryption capabilities support secure field upgrades and firmware rollback strategies.
  • Compact surface-mount package: 256-ball ftBGA (17 × 17 mm) delivers 201 I/Os in a small footprint for space-constrained designs.

Why Choose LFXP2-30E-6FTN256C?

The LFXP2-30E-6FTN256C offers a pragmatic mix of programmable logic, embedded memory and DSP resources in a commercial‑grade FPGA tailored for mid-range embedded applications. Its flexiFLASH architecture and secure update features make it well-suited for designs that require field reconfigurability and controlled firmware management.

Choose this device when you need a compact, surface-mount FPGA with flexible I/O, on-chip DSP acceleration and on-board non-volatile configuration—ideal for display interfaces, memory bridging, signal processing and other commercial embedded systems where integration and secure updates reduce overall system complexity.

If you would like pricing, availability or to request a quote for LFXP2-30E-6FTN256C, please submit an inquiry or request a quote through your usual procurement channel.

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