LFXP2-30E-6FT256I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 201 396288 29000 256-LBGA |
|---|---|
| Quantity | 1,507 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 201 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3625 | Number of Logic Elements/Cells | 29000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 396288 |
Overview of LFXP2-30E-6FT256I – XP2 FPGA, 256-LBGA, Industrial
The LFXP2-30E-6FT256I is an FPGA IC from the LatticeXP2 family featuring a flexiFLASH architecture that combines LUT-based FPGA fabric with non-volatile flash. The device provides approximately 29,000 logic elements, around 0.396 Mbits of on-chip RAM, and up to 201 I/O in a 256-ball ftBGA (17 × 17 mm) package, targeting industrial applications that require reconfigurable logic with on-chip configuration and secure update capability.
Key Features
- Core Architecture LUT-based FPGA fabric with flexiFLASH architecture for instant-on and on-chip non-volatile configuration.
- Logic Capacity Approximately 29,000 logic elements suitable for mid-density FPGA designs.
- Embedded Memory Approximately 0.396 Mbits of on-chip RAM (396,288 bits) and support for distributed memory and embedded block RAM across the family.
- DSP Resources sysDSP blocks and multiple 18×18 multiplier resources in the family provide high-performance multiply-and-accumulate capability for signal processing tasks.
- I/O Flexibility Up to 201 user I/Os supported on this package, with a range of source-synchronous interface options available across the family.
- Configuration & Security flexiFLASH with FlashBAK, serial TAG memory and Live Update technologies (family-level) including TransFR and 128-bit AES encryption for secure updates and dual-boot support.
- Clocking Multiple sysCLOCK PLLs supported in the family for clock multiplication, division and phase shifting.
- Power & Package Low-voltage core operation with supply specified from 1.14 V to 1.26 V, delivered in a 256-LBGA (256-FTBGA 17×17 mm) surface-mount package.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
- Compliance RoHS compliant.
Typical Applications
- Display and Video Interfaces Pre-engineered 7:1 LVDS source-synchronous interfaces in the family support display applications and timing-critical video paths.
- Memory Interface Bridging Family support for DDR/DDR2 source-synchronous interfaces (up to 200 MHz) enables FPGA-based memory controllers and interface bridging.
- Embedded Signal Processing sysDSP blocks and multiple hardware multipliers facilitate multiply-and-accumulate functions for DSP tasks within embedded systems.
- Industrial Control Systems Industrial-grade temperature range, extensive I/O count and on-chip non-volatile configuration make the device suitable for industrial control, I/O aggregation and automation functions.
Unique Advantages
- Instant-on non-volatile configuration: flexiFLASH architecture delivers immediate start-up from on-chip flash, removing the need for external configuration PROMs.
- Secure field updates: Live Update technologies in the family, including TransFR and 128-bit AES encryption, enable secure remote updates and dual-boot capability.
- Balanced logic and memory: Approximately 29,000 logic elements paired with ~0.396 Mbits of embedded RAM provides a balance of logic capacity and on-chip storage for mid-density designs.
- High I/O density in compact BGA: 201 available I/Os in a 256-ball ftBGA (17 × 17 mm) package enables dense connectivity while maintaining a compact PCB footprint.
- Industrial robustness: −40 °C to 100 °C operating range supports deployment in industrial environments where extended temperature tolerance is required.
- Low-voltage core operation: 1.14 V to 1.26 V supply range supports low-voltage system designs and integration with modern power rails.
Why Choose LFXP2-30E-6FT256I?
The LFXP2-30E-6FT256I delivers a mid-density FPGA option within the LatticeXP2 family that combines non-volatile, instant-on configuration with a sizeable logic element count, embedded RAM, and dedicated DSP resources. Its 201 I/O capability in a 256-LBGA package and industrial operating range make it well suited to industrial embedded designs that require reconfigurability, secure update paths and compact form factor integration.
Engineers and system designers looking for an FPGA with on-chip flash configuration, secure Live Update options, and a balance of logic, memory and DSP resources will find this device appropriate for applications ranging from display and memory interfacing to industrial control and embedded signal processing.
Request a quote or submit a procurement inquiry to get pricing and availability for the LFXP2-30E-6FT256I. Our team can help with volume pricing, lead times and technical clarification specific to your design needs.