LFXP2-30E-6FT256C

The LFXP2-30E-6FT256C is a LatticeXP2-series FPGA combining a LUT-based programmable fabric with non-volatile flexiFLASH architecture. It offers 29,000 logic elements, approximately 0.396 Mbits of on-chip RAM, and 201 user I/Os in a compact 256-ball ftBGA (17 × 17 mm) package.

Designed for embedded and communications applications that require low-voltage operation and flexible I/O, this commercial-grade device provides instant-on configuration, DSP acceleration blocks and a range of system-level features for rapid integration.

Key Features

• Core Architecture LUT-based FPGA fabric with flexiFLASH non-volatile configuration for instant-on and infinitely reconfigurable operation.
• Logic Capacity 29,000 logic elements to implement medium-density FPGA designs.
• On-chip Memory Approximately 0.396 Mbits of embedded RAM for frame buffers, FIFOs and state storage.
• DSP Acceleration sysDSP blocks and multi-bit multipliers (family-spec sysDSP availability) for high-performance multiply-and-accumulate tasks.
• I/O Flexibility 201 user I/Os with support for a broad set of interface standards (family-level sysIO options indicated in the LatticeXP2 family datasheet).
• Clocking Multiple on-chip PLLs available at the family level for clock multiply/divide and phase shifting.
• Power Low-voltage core operation: 1.14 V to 1.26 V supply range.
• Package & Mounting 256-ball ftBGA (17 × 17 mm) surface-mount package for compact board integration.
• Temperature & Grade Commercial operating range: 0 °C to 85 °C.
• Environmental RoHS compliant.
• Configuration & Security (family) flexiFLASH architecture supports on-chip flash, serial TAG memory and design security options referenced in the LatticeXP2 family datasheet.

Typical Applications

• Embedded Systems — Implement control logic, peripheral bridging and custom data paths using the device’s logic capacity and flexible I/O.
• Communications & Networking — Use the FPGA’s DSP capability and high I/O count for protocol handling, packet processing and interface conversion.
• Display & Imaging — Support source-synchronous interfaces and on-chip memory for buffering and pixel processing tasks.
• Prototyping & Development — Leverage instant-on configuration and reprogrammability for rapid iteration and testing of hardware designs.

Unique Advantages

• Instant-on, reprogrammable flash architecture: flexiFLASH enables immediate startup and field reconfiguration without external volatile configuration devices.
• Balanced logic and memory: 29,000 logic elements paired with on-chip RAM support mid-range logic designs with local storage.
• DSP resources for signal tasks: sysDSP blocks and hardware multiplication resources accelerate common DSP workloads.
• Compact, production-ready package: 256-ball ftBGA (17 × 17 mm) offers a small footprint for space-constrained boards while providing 201 I/Os.
• Low-voltage operation: 1.14 V–1.26 V supply range aligns with modern low-power system designs.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for global manufacturing environments.

Why Choose LFXP2-30E-6FT256C?

The LFXP2-30E-6FT256C positions itself as a versatile, mid-density FPGA option for customers needing a compact, low-voltage programmable device with on-chip non-volatile configuration. Its combination of 29,000 logic elements, DSP resources, and approximately 0.396 Mbits of embedded RAM make it suitable for embedded control, communications, and display interfacing where instant-on and field reconfigurability are valuable.

Backed by the LatticeXP2 family ecosystem and design tools referenced in the family datasheet, this device supports scalable design migration and reliable production deployment in commercial-temperature applications.

Request a quote or submit a request to purchase the LFXP2-30E-6FT256C to check availability and lead time for your next design.