LFXP2-30E-6FN672C

The LFXP2-30E-6FN672C is a flash-based FPGA combining a LUT-based FPGA fabric with on-chip non-volatile flash in a flexiFLASH architecture. Designed for applications that require flexible, reconfigurable logic with embedded memory, high I/O density and hardware DSP resources, this device targets system designs that benefit from instant-on configuration, secure updates and source-synchronous interfaces.

Key value comes from integration of logic, embedded memory and specialized blocks such as sysDSP and PLLs, along with a 672-ball fpBGA package that supports up to 472 I/O for dense board-level connectivity.

Key Features

• Core Logic Approximately 29,000 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory Approximately 0.396 Mbits of on-chip RAM (396,288 total RAM bits) suitable for buffers, FIFOs and small frame storage.
• DSP Resources sysDSP blocks and multiple 18×18 multiplier resources provide hardware Multiply-and-Accumulate capability for signal processing tasks.
• I/O Density and Flexibility Up to 472 I/O in a 672-ball fpBGA (27 × 27 mm) package supporting a wide range of standards for high-speed, source-synchronous interfaces.
• Non-volatile Configuration (flexiFLASH) Flash-based architecture provides instant-on behavior, on-chip FlashBAK memory and serial TAG memory for stored configuration and design security.
• Live Update and Security Live Update technology with TransFR and support for 128-bit AES encryption enables secure updates and dual-boot configurations.
• Clocking Up to four analog PLLs for clock multiply/divide and phase shifting to support complex timing and interface requirements.
• Power and Temperature Operates from a 1.14 V to 1.26 V supply and rated for commercial operation from 0 °C to 85 °C.
• Compliance and Packaging RoHS compliant and available in a 672-BBGA (fpBGA) 27 × 27 mm package (supplier device package listed as 672-FPBGA).

Typical Applications

• Display and Video Interfaces High I/O density and multi-rate LVDS support enable display interfaces and screen drive applications using source-synchronous signaling.
• Memory Interface Controllers Pre-engineered DDR/DDR2 interface support and ample I/O count make the device suitable for memory controller and buffering functions.
• Signal Processing and DSP sysDSP blocks and hardware multipliers accelerate multiply-and-accumulate workloads for embedded signal processing tasks.
• Secure, Field-Updatable Systems Flash-based configuration with AES-encrypted Live Update and dual-boot capability supports secure firmware and bitstream update strategies.

Unique Advantages

• Highly integrated logic and memory: Combines ~29,000 logic elements with on-chip RAM to reduce external component count and simplify board design.
• Instant-on, non-volatile configuration: flexiFLASH architecture enables immediate start-up and on-chip storage of configuration data for reliable boot behavior.
• Secure update capability: Live Update with AES encryption and dual-boot options provides a managed path for field updates and rollback.
• Rich I/O and clocking resources: 472 I/Os and up to four PLLs support complex, high-speed interfaces and flexible timing architectures.
• Compact, board-friendly package: 672-ball fpBGA (27 × 27 mm) packaging delivers high pin-count in a compact footprint for space-constrained designs.
• Design ecosystem support: Supported by Lattice design software and pre-engineered IP to accelerate implementation of complex designs.

Why Choose LFXP2-30E-6FN672C?

The LFXP2-30E-6FN672C positions itself as a versatile, flash-configured FPGA that balances logic capacity, on-chip memory and DSP resources with a high I/O count for demanding embedded systems. Its flexiFLASH architecture enables instant-on operation and secure update paths, while multiple PLLs and flexible I/O standards support a wide range of interface requirements.

This device is well suited for customers who need a reconfigurable, non-volatile FPGA solution for display interfaces, memory controllers, signal processing or systems that require secure in-field updates and compact high-density packaging. The combination of integrated resources and Lattice design support helps accelerate development and long-term maintainability.

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