LFXP2-30E-6FN672I

The LFXP2-30E-6FN672I is an industrial-grade FPGA from Lattice Semiconductor’s XP2 family, combining a LUT-based FPGA fabric with on‑chip flash configuration. Built on the LatticeXP2 architecture, it delivers a balance of integration, reconfigurability and I/O density for embedded and industrial applications.

Key attributes include 29,000 logic elements, approximately 0.396 Mbits of embedded RAM (396,288 bits), 472 I/Os and low-voltage operation from 1.14 V to 1.26 V, all in a 672‑ball fpBGA package designed for surface-mount assembly and extended temperature operation from −40 °C to 100 °C.

Key Features

• Core Logic  29,000 logic elements provide scalable LUT-based fabric for custom logic, control and glue‑logic implementations.
• Embedded Memory  Approximately 0.396 Mbits of on-chip RAM (396,288 bits) for data buffering, state storage and small embedded memories.
• High I/O Density  472 user I/Os support complex board-level interfaces and multiple parallel buses from a single device.
• sysDSP & Multipliers (family capability)  XP2 family sysDSP blocks and multiple dedicated multipliers enable efficient hardware acceleration of MAC and signal-processing functions.
• Flexible I/O Standards (family capability)  Supports a range of I/O standards for LVCMOS, LVTTL, SSTL, HSTL, LVDS and source-synchronous interfaces for memory and display links.
• Configuration & Security (family capability)  flexiFLASH architecture enables instant-on, on-chip non-volatile configuration with live update and secure update features.
• Power & Clock  Operates at a nominal 1.2 V supply range (1.14 V–1.26 V) and includes integrated PLLs for clocking and phase control.
• Package & Mounting  672‑ball fpBGA package (27 × 27 mm) in a surface-mount form factor suited for compact, high-density assemblies.
• Industrial Temperature Grade  Specified for −40 °C to 100 °C operation for deployment in industrial environments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Control  Programmable logic for motor control, I/O aggregation and custom control loops where extended temperature and industrial-grade components are needed.
• Embedded Systems  On-board FPGA for protocol bridging, peripheral aggregation and custom accelerators in compact embedded platforms.
• High‑Density I/O Interfaces  Consolidating multiple parallel I/O, memory interfaces or display links where high pin count and flexible I/O standards are required.
• Signal Processing Acceleration  Hardware acceleration using on‑chip DSP resources and multipliers for deterministic, low‑latency processing tasks.

Unique Advantages

• Highly Integrated FPGA with On‑Chip Flash:  Instant-on flexiFLASH configuration reduces external configuration footprint and enables reconfigurable, single‑chip solutions.
• Large Logic & I/O Capacity:  29,000 logic elements and 472 I/Os let you implement complex designs and consolidate functions to reduce BOM and board area.
• Industrial Readiness:  Rated for −40 °C to 100 °C and supplied in a robust fpBGA package for reliable operation in demanding environments.
• Low‑Voltage Operation:  1.14 V–1.26 V supply range supports low-power system architectures and modern board power domains.
• Flexible System Integration:  On-chip PLLs, DSP blocks and a variety of I/O standards (family capabilities) simplify clocking, processing and interface design.
• Regulatory & Environmental Compliance:  RoHS‑compliant manufacturing supports lead‑free assembly and regulatory requirements.

Why Choose LFXP2-30E-6FN672I?

The LFXP2-30E-6FN672I positions itself as a versatile, industrial-grade FPGA option for designers who need substantial logic resources, high I/O density and embedded non-volatile configuration in a compact fpBGA package. Its combination of 29,000 logic elements, nearly 0.4 Mbits of embedded RAM and 472 I/Os makes it suitable for complex embedded processing, I/O consolidation and hardware-accelerated tasks.

Backed by the Lattice XP2 family architecture and family-level capabilities such as sysDSP blocks, flexible I/O standards and flash-based instant-on configuration, this device offers a practical platform for scalable designs that require reconfigurability, secure updates and reliable operation across industrial temperature ranges.

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