LFXP2-30E-6F672I

The LFXP2-30E-6F672I is a flash-based XP2 FPGA optimized for instant-on reconfigurable logic and embedded system integration. It combines 29,000 logic elements with dedicated DSP resources, on-chip memory and a high I/O count to address display, memory-interface and industrial control applications.

Designed for industrial use, the device operates from 1.14 V to 1.26 V and across an extended temperature range (−40 °C to 100 °C), packaged in a 672-ball FBGA (27 × 27 mm) surface-mount package and RoHS compliant.

Key Features

• Core Logic — 29,000 logic elements provide a substantial FPGA fabric for combining control, glue logic and custom acceleration in a single device.
• DSP Acceleration — sysDSP blocks and dedicated multipliers (device-class sysDSP and 18×18 multipliers as defined for the XP2-30 family) enable efficient multiply-accumulate operations for signal processing tasks.
• On‑chip Memory — Approximately 396,288 bits of on-chip RAM (EBR and distributed RAM per XP2-30 device data) for buffering, FIFOs and embedded storage.
• High I/O Count — Up to 472 I/O pins supported in the 672-ball package for wide parallel buses, display interfaces and multi‑lane connectivity.
• flexiFLASH Architecture — Flash-based architecture provides instant-on functionality and single‑chip non-volatile configuration.
• Live Update & Security — TransFR live update technology with 128-bit AES encryption and dual-boot support for secure, field-update capable systems.
• Clocking — Multiple PLLs (up to four per device class) provide clock multiply/divide and phase shifting for complex timing requirements.
• Flexible I/O Standards — sysIO buffer support across numerous standards (LVCMOS, SSTL, HSTL, PCI, LVDS, MLVDS, LVPECL, RSDS) and pre‑engineered source-synchronous interfaces including DDR/DDR2 up to 200 MHz and multi-lane LVDS.
• Package & Mounting — 672-BBGA / 672-FPBGA (27×27 mm) surface-mount package suitable for board-level integration in industrial systems.
• Operating Range & Compliance — Industrial temperature rating (−40 °C to 100 °C) and RoHS compliant.

Typical Applications

• Display and Video Interfaces — Use the device’s multi‑lane LVDS support and high I/O count for display panels, timing and video interface bridging.
• Memory Interface and Bridge — Implement DDR/DDR2 source‑synchronous interfaces up to 200 MHz for memory controllers, buffering and protocol translation.
• Signal Processing and Control — Accelerate filtering, control loops and data processing with sysDSP blocks and dedicated multipliers for multiply-accumulate workloads.
• Communications and Interface Aggregation — High I/O density and flexible I/O standards support multi-protocol bridging and board-level aggregation (e.g., XGMII and parallel bus interfaces).

Unique Advantages

• Instant-on, single-chip non-volatile configuration: flexiFLASH architecture enables immediate startup without external FPGA configuration memory, simplifying system BOM.
• Secure field updates: TransFR live update with 128-bit AES encryption and dual-boot support allows secure in-field firmware updates and rollback strategies.
• Integrated DSP and memory: On-chip RAM and sysDSP resources reduce external memory and accelerator requirements, lowering board complexity and latency.
• Large I/O capacity: Up to 472 I/Os in a 672-ball package accommodates wide parallel interfaces and mixed-signal front-ends on a single device.
• Industrial temperature and RoHS compliance: Suitable for industrial environments with extended temperature operation and environmental compliance for commercial manufacturing.
• Low-voltage operation: 1.14 V to 1.26 V supply supports modern low-power system architectures.

Why Choose LFXP2-30E-6F672I?

The LFXP2-30E-6F672I balances substantial logic density, DSP capability and on-chip memory with a high I/O count and industrial environmental ratings to deliver a compact, reconfigurable platform for display, memory-interface, signal-processing and industrial control applications. Its flash-based flexiFLASH architecture and secure live-update features make it well suited for systems that require instant-on behavior and field reconfiguration.

Support for common I/O standards, multiple PLLs and pre-engineered interfaces—combined with design flow support referenced for the XP2 family—helps shorten development time and scale designs across device densities in the XP2 series.

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