LFXP2-30E-6F484I

IC FPGA 363 I/O 484FBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 363 396288 29000 484-BBGA

Quantity 678 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O363Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3625Number of Logic Elements/Cells29000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits396288

Overview of LFXP2-30E-6F484I – XP2 Field Programmable Gate Array (FPGA), 29,000 logic elements

The LFXP2-30E-6F484I is an industrial-grade FPGA IC from the LatticeXP2 family featuring a LUT-based FPGA fabric combined with non-volatile Flash architecture. The device delivers 29,000 logic elements, approximately 0.396 Mbits of on-chip RAM, and up to 363 general-purpose I/Os in a 484-ball fpBGA package, making it suitable for dense, I/O-rich embedded systems.

Built around the flexiFLASH architecture and family-level capabilities such as Live Update and sysDSP, this part targets industrial applications that need reconfigurable logic, secure updates, and high-performance arithmetic blocks while operating across a wide temperature and supply range.

Key Features

  • Core Architecture LUT-based FPGA fabric with non-volatile Flash (flexiFLASH) for instant-on operation and reconfigurability.
  • Logic Density 29,000 logic elements suitable for medium-to-high complexity logic integration.
  • Embedded Memory Approximately 0.396 Mbits of on-chip RAM to support buffers, state storage, and local data handling.
  • High I/O Count 363 I/Os available in the 484-ball fpBGA package to support wide parallel interfaces and multi-channel connectivity.
  • DSP and Multiply Resources XP2-30 family-level sysDSP blocks and 18×18 multipliers provide hardware acceleration for multiply-accumulate and signal processing tasks.
  • Clocking Family-level support for up to four analog PLLs for clock multiplication, division, and phase shifting.
  • Interfaces Pre-engineered source-synchronous interfaces supported at the family level, including DDR/DDR2 memory interfaces (up to 200 MHz) and multi-LVDS options suitable for display and high-speed link applications.
  • Power and Temperature Operates from 1.14 V to 1.26 V and rated for industrial temperatures from -40 °C to 100 °C.
  • Package & Mounting 484-BBGA (supplier package: 484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact board integration.
  • Regulatory RoHS compliant.

Typical Applications

  • Industrial Control Industrial-grade temperature range and plentiful I/O make this FPGA suitable for motor control, PLC extensions, and I/O aggregation in factory automation.
  • Memory and Interface Bridges Use for DDR/DDR2 interface bridging, protocol adaptation, and buffering where on-chip memory and source-synchronous interfaces are required.
  • Video and Display Systems High I/O density and multi-LVDS support enable display timing, serialization/deserialization, and video pipeline tasks.
  • Signal Processing sysDSP blocks and dedicated multipliers accelerate filtering, transformation, and real-time arithmetic workloads.

Unique Advantages

  • Instant-on, reconfigurable architecture: flexiFLASH-based design enables instant-on operation and unlimited reconfiguration without external volatile configuration storage.
  • High I/O capacity in a compact package: 363 I/Os in a 23 × 23 mm fpBGA provide dense connectivity for complex, multi-interface systems while minimizing PCB area.
  • Industrial readiness: Rated for -40 °C to 100 °C and specified as industrial grade for deployment in demanding environments.
  • On-chip DSP acceleration: sysDSP blocks and multiple hardware multipliers reduce CPU load and enable high-throughput signal processing.
  • Secure and flexible updates: Family-level Live Update technology and secure update capabilities support in-field reconfiguration and protected firmware images.
  • Low-voltage operation: Narrow supply range (1.14 V to 1.26 V) suitable for modern low-voltage system domains.

Why Choose LFXP2-30E-6F484I?

The LFXP2-30E-6F484I positions itself as a versatile, industrial-grade FPGA that balances logic density, embedded memory, DSP acceleration, and extensive I/O in a compact fpBGA package. Its family-proven flexiFLASH architecture, secure update mechanisms, and dedicated DSP resources make it a practical choice for embedded systems that require reconfigurability, reliable field updates, and deterministic on-chip processing.

This part is well suited for engineers designing industrial control systems, interface bridges, display and video pipelines, and signal-processing modules who need a single-chip solution that integrates Flash-based configuration with abundant I/O and DSP capability.

Request a quote or submit your request for pricing and availability for the LFXP2-30E-6F484I today to evaluate it for your next design.

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