LFXP2-30E-6F484I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 363 396288 29000 484-BBGA |
|---|---|
| Quantity | 678 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 363 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3625 | Number of Logic Elements/Cells | 29000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 396288 |
Overview of LFXP2-30E-6F484I – XP2 Field Programmable Gate Array (FPGA), 29,000 logic elements
The LFXP2-30E-6F484I is an industrial-grade FPGA IC from the LatticeXP2 family featuring a LUT-based FPGA fabric combined with non-volatile Flash architecture. The device delivers 29,000 logic elements, approximately 0.396 Mbits of on-chip RAM, and up to 363 general-purpose I/Os in a 484-ball fpBGA package, making it suitable for dense, I/O-rich embedded systems.
Built around the flexiFLASH architecture and family-level capabilities such as Live Update and sysDSP, this part targets industrial applications that need reconfigurable logic, secure updates, and high-performance arithmetic blocks while operating across a wide temperature and supply range.
Key Features
- Core Architecture LUT-based FPGA fabric with non-volatile Flash (flexiFLASH) for instant-on operation and reconfigurability.
- Logic Density 29,000 logic elements suitable for medium-to-high complexity logic integration.
- Embedded Memory Approximately 0.396 Mbits of on-chip RAM to support buffers, state storage, and local data handling.
- High I/O Count 363 I/Os available in the 484-ball fpBGA package to support wide parallel interfaces and multi-channel connectivity.
- DSP and Multiply Resources XP2-30 family-level sysDSP blocks and 18×18 multipliers provide hardware acceleration for multiply-accumulate and signal processing tasks.
- Clocking Family-level support for up to four analog PLLs for clock multiplication, division, and phase shifting.
- Interfaces Pre-engineered source-synchronous interfaces supported at the family level, including DDR/DDR2 memory interfaces (up to 200 MHz) and multi-LVDS options suitable for display and high-speed link applications.
- Power and Temperature Operates from 1.14 V to 1.26 V and rated for industrial temperatures from -40 °C to 100 °C.
- Package & Mounting 484-BBGA (supplier package: 484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact board integration.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Industrial-grade temperature range and plentiful I/O make this FPGA suitable for motor control, PLC extensions, and I/O aggregation in factory automation.
- Memory and Interface Bridges Use for DDR/DDR2 interface bridging, protocol adaptation, and buffering where on-chip memory and source-synchronous interfaces are required.
- Video and Display Systems High I/O density and multi-LVDS support enable display timing, serialization/deserialization, and video pipeline tasks.
- Signal Processing sysDSP blocks and dedicated multipliers accelerate filtering, transformation, and real-time arithmetic workloads.
Unique Advantages
- Instant-on, reconfigurable architecture: flexiFLASH-based design enables instant-on operation and unlimited reconfiguration without external volatile configuration storage.
- High I/O capacity in a compact package: 363 I/Os in a 23 × 23 mm fpBGA provide dense connectivity for complex, multi-interface systems while minimizing PCB area.
- Industrial readiness: Rated for -40 °C to 100 °C and specified as industrial grade for deployment in demanding environments.
- On-chip DSP acceleration: sysDSP blocks and multiple hardware multipliers reduce CPU load and enable high-throughput signal processing.
- Secure and flexible updates: Family-level Live Update technology and secure update capabilities support in-field reconfiguration and protected firmware images.
- Low-voltage operation: Narrow supply range (1.14 V to 1.26 V) suitable for modern low-voltage system domains.
Why Choose LFXP2-30E-6F484I?
The LFXP2-30E-6F484I positions itself as a versatile, industrial-grade FPGA that balances logic density, embedded memory, DSP acceleration, and extensive I/O in a compact fpBGA package. Its family-proven flexiFLASH architecture, secure update mechanisms, and dedicated DSP resources make it a practical choice for embedded systems that require reconfigurability, reliable field updates, and deterministic on-chip processing.
This part is well suited for engineers designing industrial control systems, interface bridges, display and video pipelines, and signal-processing modules who need a single-chip solution that integrates Flash-based configuration with abundant I/O and DSP capability.
Request a quote or submit your request for pricing and availability for the LFXP2-30E-6F484I today to evaluate it for your next design.